Intel E8500 manual First NB Heatsink Thermal Solution Assembly, TNBLocation

Page 26

NB Reference Thermal Solution #1

6.5First NB Heatsink Thermal Solution Assembly

The reference thermal solution for the chipset NB component is a passive extruded heatsink with thermal interface. It is attached to the board by using four retaining Tuflok* fasteners. Figure 6-4shows the reference thermal solution assembly and associated components.

Full mechanical drawings of the thermal solution assembly and the heatsink are provided in Appendix B. Appendix A contains vendor information for each thermal solution component.

Figure 6-3. First NB Heatsink Board Component Keepout

4X Ø 5.5mm

64.500mm.

55.245mm.

42.500mm.

TNBLocation

42.500mm. 55.245mm. 64.500mm.

4X Ø 2.95 ± 0.0254mm

No Component Keep Out Area

4.14mm Max Component Height

Heatsink Mounting Hole

NOTE: All dimensions are in millimeters.

26	Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
	Bridge (XMB) Thermal/Mechanical Design Guide

Image 26

Contents Thermal/Mechanical Design Guide Intel E8500 Chipset North Bridge NB and eXternal Memory Contents Figures Tables Revision History Introduction Design FlowDefinition of Terms BGAReference Documents XMBIntroduction Packaging Technology TNBNB Package Dimensions Bottom View XMB Package Dimensions Top View XMB Package Dimensions Bottom View Package Mechanical RequirementsDie Case Temperature Specifications Thermal SpecificationsThermal Design Power TDP Intel E8500 Chipset XMB Thermal Specifications Thermal Simulation Thermal Simulation Die Case Temperature Measurements Thermal MetrologyThermal Solution Decision Flowchart Power Simulation Software Thermal Metrology Heatsink Performance NB Reference Thermal Solution #1Operating Environment Mechanical Design Envelope Board-Level Components Keepout Dimensions First NB Reference Heatsink Volumetric EnvelopeFirst NB Heatsink Thermal Solution Assembly TNBLocationExtruded Heatsink Profiles Heatsink Retaining Fastener Reliability Guidelines Reliability GuidelinesNB Reference Thermal Solution #1 NB Reference Thermal Solution #2 NB Reference Thermal Solution #2 Second NB Heatsink Thermal Solution Assembly Second NB Reference Heatsink Volumetric EnvelopeSecond NB Heatsink Assembly Please refer to .6 for detail NB Reference Thermal Solution #2 XMB Reference Thermal Solution XMB Heatsink Thermal Solution Assembly XMB Reference Heatsink Volumetric EnvelopeXMB Location Extruded Heatsink Profiles XMB Heatsink Extrusion Profile XMB Reference Thermal Solution Thermal Solution Component Suppliers Table A-1 NB Heatsink Thermal Solution #1Table A-2 NB Heatsink Thermal Solution #2 Table A-3 XMB Heatsink Thermal Solution Thermal Solution Component Suppliers Mechanical Drawings Table B-1. Mechanical Drawing ListFigure B-1. NB Heatsink #1 Assembly Drawing Figure B-2. NB Heatsink #1 Drawing Figure B-3. NB Heatsink #2 Assembly Drawing Figure B-4. NB Heatsink #2 Drawing Figure B-5. XMB Heatsink Assembly Drawing Figure B-6. XMB Heatsink Drawing Intel E8500 Chipset North Bridge NB and eXternal Memory