NB Reference Thermal Solution #1
6.5.1Heatsink Orientation
Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned with the direction of the heatsink fins.
Figure 6-4. First NB Heatsink Assembly
6.5.2Extruded Heatsink Profiles
The reference NB thermal solution uses an extruded heatsink for cooling the chipset NB.
Figure 6-5 shows the heatsink profile. Appendix A lists a supplier for this extruded heatsink. Other heatsinks with similar dimensions and increased thermal performance may be available. Full mechanical drawing of this heatsink is provided in Appendix B.
6.5.3Mechanical Interface Material
There is no mechanical interface material associated with this reference solution.
6.5.4Thermal Interface Material
A TIM provides improved conductivity between the die and heatsink. The reference thermal solution uses Chomerics THERMFLOW* T710, 0.127 mm (0.005 in.) thick, 38.5 mm x 38.5 mm (1.5 in. x 1.5 in.) square.
Note: Unflowed or “dry” Chomerics THERMFLOW T710 has a material thickness of 0.005 inch. The flowed or “wet” Chomerics THERMFLOW T710 has a material thickness of ~0.0025 inch after it reaches its phase change temperature.
6.5.4.1Effect of Pressure on TIM Performance
As mechanical pressure increases on the TIM, the thermal resistance of the TIM decreases. This phenomenon is due to the decrease of the bond line thickness (BLT). BLT is the final settled thickness of the thermal interface material after installation of heatsink. The effect of pressure on
Intel® E8500 Chipset North Bridge (NB) and eXternal Memory | 27 |
Bridge (XMB) Thermal/Mechanical Design Guide |
|