Intel 6300ESB ICH, Xeon user manual Equipment Required for CRB Usage, Precautions

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Equipment Required for CRB Usage

Equipment Required for CRB Usage 3

The following components are required for the Intel® Xeon™ Processor with 800 MHz System Bus and Intel® E7520 and Intel® 6300ESB Customer Reference Board (CRB) usage:

A 550 W SSI EPS 12 V power supply. The CRB is shipped with the power supply.

At least two modules of DDR2 400 DIMM. The CRB is shipped with 2 x 256 Mbytes of DDR2 400.

Hard drive loaded with Operating System1

Monitor

PS/2 mouse and keyboard

Visually inspect the board and ensure that the MCH, Intel® 6300ESB I/O Controller, PXH, and other components did not shake loose during shipment. If the board has any loose or missing components, contact your Intel representative.

Caution: Powering up without all components installed correctly could lead to a power-up failure that could damage the board. Do not power up the board until the source of any loose component is determined and the component has been replaced on the board.

3.1Precautions

The following precautions will reduce the chances of damaging the board:

Ensure that a 550 W SSI EPV 12 V power supply is used to power up the CRB. Refer to Section 5.1, “Power Diagrams” on page 25 for details on the SSI power supply interface on the CRB.

This platform supports DDR2 400 DIMMs; ensure that the same speed DIMM is plugged in all slots of the platform.

Ensure that each processor has heat sinks attached before powering up the board.

Ensure that the heat sink is attached to the MCH and PXH before powering up the board. Never attach a heat sink while the board is powered.

Use Table 4 to verify that all jumpers are in their default positions.

1. Note The hard disk provided with the development kit is not pre-loaded with any software.

Intel® Xeon™ Processor, Intel® E7520 Chipset, Intel® 6300ESB ICH Development Kit User’s Manual

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Contents September User’s ManualContents Contents Contents Tables FiguresDate Revision Description Revision HistoryRelated Documents Product ContentsProduct Overview Products Feature List Block Diagram +$&0,,+ Dimm Placement DDR2 Dimm Placement DDR2Memory Subsystem Supported Dimm Module TypesDDR2 400 Memory Dimm Ordering Memory Population Rules and ConfigurationsPlatform Management Power ButtonSoft Off Sleep States Supported3 S2 State 2 S1 State4 S3 State 5 S4 StatePlatform Management PCI PM SupportProcessor Thermal Management System Fan OperationEquipment Required for CRB Usage PrecautionsDrivers included on CD Driver and OS RequirementsEquipment Required for CRB Usage Windows Compatible Driver Package Contents Jumpers Jumpers and HeadersRef Des Description/Settings Jumper Settings Sheet 1BSEL0 J4J3 Jumper Settings Sheet 2Ichsmbclk Jumper Settings Sheet 3System Overview Power DiagramsBlock Diagram Platform Clocking Clock Block DiagramPlatform Reset Diagram Platform ResetsSMBus SMBus Block DiagramPlatform IRQ Routing IRQ Routing DiagramVRD VID Headers Processor VRD Settings Sheet 1Processor VRD Settings Sheet 2 Miscellaneous Buttons Power ButtonsLevel 1 Debug Port 80/BIOS Debug ProcedureLevel 1 Debug Port 80/BIOS Test Pass/Fail Criteria Cause of FailureLevel 2 Debug Power Sequence Level 2 Debug Power SequenceLevel 3 Debug Voltage References Level 3 Debug Voltage ReferencesComponents Requiring Heat Sink Assembly Heatsink AssemblyComponent Quantity per BoardInserting Processor in Socket Processor Heat Sink Installation InstructionsInstalling the Processor Backplate Installing the Heatsink