Intel Xeon, 6300ESB ICH user manual Products Feature List

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Product Overview

1.3Products Feature List

•Processor Support

—Dual Intel® Xeon™ Processors

—On-board processor voltage regulators compatible with VRM/EVRD 10.1 Design Guide

•Clocking

—CK409B clock synthesizer that generates all host clock and the PCI Express* interface clock for the MCH PHY Layer

—DB800 generates the PCI Express differential pair clocks to the onboard PCI Express components and the dedicated PCI Express slots

•Memory Support

—Registered, ECC, DDR2 400

—Each of the two memory channels on the Intel® E7520 in this CRB supports a maximum of two DDR2 400 DIMMs per channel

—The maximum supported DDR2 400 memory configuration is 8 Gbyte using different combinations of single and dual ranked, x4, 1 Gbyte technology DIMMs (limit of up to four ranks per channel)

—3.2 Gbytes/s bus per channel bandwidth with DDR2 400

•I/O slot support

—One PCI-X 133 MHz slot from PXH

—Two PCI-X 100 MHz slots from PXH

—One PCI Express x8 slot

—One PCI Express x4 slot

—One 5 V PCI-32/33 slot connected through the Intel® 6300ESB I/O Controller

—Two 3.3 V PCI-X 64/66 slots connected through the Intel® 6300ESB I/O Controller

•Low Pin Count Bus

—National* LPC 47M172 Super I/O residing on LPC bus

—LPC card header for debug purposes only

—Firmware hub

•IDE ATA 100 support

—Two ATA-100 IDE connectors supported

•S-ATA support

—Two S-ATA connectors

•USB Support (Four Channels)

—Two USB 2.0 connectors

—Two USB 2.0 headers

•Back Panel I/O

8Intel® Xeon™ Processor, Intel® E7520 Chipset, Intel® 6300ESB ICH Development Kit User’s Manual

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Contents User’s Manual SeptemberContents Contents Contents Figures TablesRevision History Date Revision DescriptionRelated Documents Product ContentsProduct Overview Products Feature List Block Diagram +$&0,,+ Dimm Placement DDR2 Dimm Placement DDR2Memory Subsystem Supported Dimm Module TypesMemory Population Rules and Configurations DDR2 400 Memory Dimm OrderingPower Button Platform ManagementSoft Off Sleep States Supported2 S1 State 3 S2 State4 S3 State 5 S4 StatePCI PM Support Platform ManagementSystem Fan Operation Processor Thermal ManagementPrecautions Equipment Required for CRB UsageDriver and OS Requirements Drivers included on CDEquipment Required for CRB Usage Windows Compatible Driver Package Contents Jumpers and Headers JumpersJumper Settings Sheet 1 Ref Des Description/SettingsJumper Settings Sheet 2 BSEL0 J4J3Jumper Settings Sheet 3 IchsmbclkSystem Overview Power DiagramsBlock Diagram Clock Block Diagram Platform ClockingPlatform Resets Platform Reset DiagramSMBus Block Diagram SMBusIRQ Routing Diagram Platform IRQ RoutingProcessor VRD Settings Sheet 1 VRD VID HeadersProcessor VRD Settings Sheet 2 Power Buttons Miscellaneous ButtonsDebug Procedure Level 1 Debug Port 80/BIOSLevel 1 Debug Port 80/BIOS Test Pass/Fail Criteria Cause of FailureLevel 2 Debug Power Sequence Level 2 Debug Power SequenceLevel 3 Debug Voltage References Level 3 Debug Voltage ReferencesHeatsink Assembly Components Requiring Heat Sink AssemblyComponent Quantity per BoardProcessor Heat Sink Installation Instructions Inserting Processor in SocketInstalling the Processor Backplate Installing the Heatsink