Cypress manual CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18, Features, Configurations

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CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18

CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18

72-Mbit QDR™-II SRAM 4-Word Burst Architecture

Features

Separate independent read and write data ports

Supports concurrent transactions

300 MHz clock for high bandwidth

4-word burst for reducing address bus frequency

Double Data Rate (DDR) interfaces on both read and write ports (data transferred at 600 MHz) at 300 MHz

Two input clocks (K and K) for precise DDR timing

SRAM uses rising edges only

Two input clocks for output data (C and C) to minimize clock skew and flight time mismatches

Echo clocks (CQ and CQ) simplify data capture in high-speed systems

Single multiplexed address input bus latches address inputs for read and write ports

Separate port selects for depth expansion

Synchronous internally self-timed writes

QDR-II operates with 1.5 cycle read latency when the Delay Lock Loop (DLL) is enabled

Operates like a QDR-I device with 1 cycle read latency in DLL off mode

Available in x8, x9, x18, and x36 configurations

Full data coherency, providing most current data

Core VDD = 1.8 (± 0.1V); IO VDDQ = 1.4V to VDD

Available in 165-Ball FBGA package (15 x 17 x 1.4 mm)

Offered in both Pb-free and non Pb-free packages

Variable drive HSTL output buffers

JTAG 1149.1 compatible test access port

Delay Lock Loop (DLL) for accurate data placement

Configurations

CY7C1511JV18 – 8M x 8

CY7C1526JV18 – 8M x 9

CY7C1513JV18 – 4M x 18

CY7C1515JV18 – 2M x 36

Functional Description

The CY7C1511JV18, CY7C1526JV18, CY7C1513JV18, and CY7C1515JV18 are 1.8V Synchronous Pipelined SRAMs, equipped with QDR-II architecture. QDR-II architecture consists of two separate ports: the read port and the write port to access the memory array. The read port has dedicated data outputs to support read operations and the write port has dedicated data inputs to support write operations. QDR-II architecture has separate data inputs and data outputs to completely eliminate the need to “turn-around” the data bus that exists with common IO devices. Each port can be accessed through a common address bus. Addresses for read and write addresses are latched on alternate rising edges of the input (K) clock. Accesses to the QDR-II read and write ports are completely independent of one another. To maximize data throughput, both read and write ports are equipped with DDR interfaces. Each address location is associated with four 8-bit words (CY7C1511JV18), 9-bit words (CY7C1526JV18), 18-bit words (CY7C1513JV18), or 36-bit words (CY7C1515JV18) that burst sequentially into or out of the device. Because data can be transferred into and out of the device on every rising edge of both input clocks (K and K and C and C), memory bandwidth is maximized while simplifying system design by eliminating bus “turn-arounds”.

Depth expansion is accomplished with port selects, which enables each port to operate independently.

All synchronous inputs pass through input registers controlled by the K or K input clocks. All data outputs pass through output registers controlled by the C or C (or K or K in a single clock domain) input clocks. Writes are conducted with on-chip synchronous self-timed write circuitry.

Selection Guide

 

Description

300 MHz

Unit

Maximum Operating Frequency

 

 

300

MHz

 

 

 

 

 

Maximum Operating Current

 

x8

1090

mA

 

 

 

 

 

 

 

x9

1090

 

 

 

 

 

 

 

 

x18

1115

 

 

 

 

 

 

 

 

x36

1140

 

 

 

 

 

 

Cypress Semiconductor Corporation • 198 Champion Court

San Jose, CA 95134-1709

408-943-2600

Document Number: 001-12560 Rev. *C

 

Revised March 10, 2008

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Contents Configurations FeaturesCY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 Functional DescriptionLogic Block Diagram CY7C1526JV18 Logic Block Diagram CY7C1511JV18CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 Logic Block Diagram CY7C1515JV18 Logic Block Diagram CY7C1513JV18165-Ball FBGA 15 x 17 x 1.4 mm Pinout Pin ConfigurationCY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 CY7C1513JV18, CY7C1515JV18 CY7C1511JV18, CY7C1526JV18Pin Definitions Pin Definitions continued CY7C1513JV18, CY7C1515JV18Read Operations Functional OverviewWrite Operations Byte Write OperationsDepth Expansion Concurrent TransactionsProgrammable Impedance Echo ClocksApplication Example CY7C1511JV18, CY7C1526JV18Truth Table ASICWrite Cycle Descriptions Write Cycle Descriptions Test Access Port-Test Clock Disabling the JTAG FeaturePerforming a TAP Reset IEEE 1149.1 Serial Boundary Scan JTAGSAMPLE Z IDCODESAMPLE/PRELOAD BYPASSPage 15 of TAP Controller State DiagramTAP Electrical Characteristics TAP Controller Block DiagramTAP Timing and Test Conditions TAP AC Switching CharacteristicsScan Register Sizes Identification Register DefinitionsInstruction Codes CY7C1511JV18Boundary Scan Order Power Up Waveforms Power Up Sequence in QDR-II SRAMPower Up Sequence DLL ConstraintsDC Electrical Characteristics Electrical CharacteristicsAC Electrical Characteristics Maximum RatingsThermal Resistance CapacitanceAC Test Loads and Waveforms PackageParameter Switching CharacteristicsREAD Switching WaveformsWRITE K K RPS WPSOrdering Information Figure 4. 165-ball FBGA 15 x 17 x 1.40 mm Package DiagramISSUE Document History PageBurst Architecture Document Number ECN NO