Cypress manual CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18, Write Cycle Descriptions

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Manual background

CY7C1511JV18, CY7C1526JV18

CY7C1513JV18, CY7C1515JV18

Write Cycle Descriptions

The write cycle description table for CY7C1515JV18 follows. [2, 10]

 

BWS0

 

BWS1

 

BWS2

 

BWS3

K

 

K

Comments

 

L

 

L

 

L

 

L

L–H

 

During the Data portion of a write sequence, all four bytes (D[35:0]) are written into

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

the device.

 

 

 

 

 

 

 

 

 

 

 

 

L

 

L

 

L

 

L

L–H

During the Data portion of a write sequence, all four bytes (D[35:0]) are written into

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

the device.

 

 

 

 

 

 

 

 

 

 

 

 

 

L

 

H

 

H

 

H

L–H

 

During the Data portion of a write sequence, only the lower byte (D[8:0]) is written

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

into the device. D[35:9] remains unaltered.

 

L

 

H

 

H

 

H

L–H

During the Data portion of a write sequence, only the lower byte (D[8:0]) is written

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

into the device. D[35:9] remains unaltered.

 

H

 

L

 

H

 

H

L–H

 

During the Data portion of a write sequence, only the byte (D[17:9]) is written into

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

the device. D[8:0] and D[35:18] remains unaltered.

 

H

 

L

 

H

 

H

L–H

During the Data portion of a write sequence, only the byte (D[17:9]) is written into

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

the device. D[8:0] and D[35:18] remains unaltered.

 

H

 

H

 

L

 

H

L–H

 

During the Data portion of a write sequence, only the byte (D[26:18]) is written into

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

the device. D[17:0] and D[35:27] remains unaltered.

 

H

 

H

 

L

 

H

L–H

During the Data portion of a write sequence, only the byte (D[26:18]) is written into

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

the device. D[17:0] and D[35:27] remains unaltered.

 

H

 

H

 

H

 

L

L–H

 

During the Data portion of a write sequence, only the byte (D[35:27]) is written into

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

the device. D[26:0] remains unaltered.

 

H

 

H

 

H

 

L

L–H

During the Data portion of a write sequence, only the byte (D[35:27]) is written into

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

the device. D[26:0] remains unaltered.

 

H

 

H

 

H

 

H

L–H

 

No data is written into the device during this portion of a write operation.

 

 

 

 

 

 

 

 

 

 

 

 

H

 

H

 

H

 

H

L–H

No data is written into the device during this portion of a write operation.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Document Number: 001-12560 Rev. *C

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Contents Features ConfigurationsCY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 Functional DescriptionLogic Block Diagram CY7C1511JV18 Logic Block Diagram CY7C1526JV18CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 Logic Block Diagram CY7C1513JV18 Logic Block Diagram CY7C1515JV18Pin Configuration 165-Ball FBGA 15 x 17 x 1.4 mm PinoutPin Configuration CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18Pin Definitions CY7C1513JV18, CY7C1515JV18 Pin Definitions continuedFunctional Overview Read OperationsWrite Operations Byte Write OperationsConcurrent Transactions Depth ExpansionProgrammable Impedance Echo ClocksCY7C1511JV18, CY7C1526JV18 Application ExampleTruth Table ASICWrite Cycle Descriptions CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 Disabling the JTAG Feature Test Access Port-Test ClockPerforming a TAP Reset IEEE 1149.1 Serial Boundary Scan JTAGIDCODE SAMPLE ZSAMPLE/PRELOAD BYPASSTAP Controller State Diagram Page 15 ofTAP Controller Block Diagram TAP Electrical CharacteristicsTAP AC Switching Characteristics TAP Timing and Test ConditionsIdentification Register Definitions Scan Register SizesInstruction Codes CY7C1511JV18Boundary Scan Order Power Up Sequence in QDR-II SRAM Power Up WaveformsPower Up Sequence DLL ConstraintsElectrical Characteristics DC Electrical CharacteristicsAC Electrical Characteristics Maximum RatingsCapacitance Thermal ResistanceAC Test Loads and Waveforms PackageSwitching Characteristics ParameterSwitching Waveforms READWRITE K K RPS WPSOrdering Information Package Diagram Figure 4. 165-ball FBGA 15 x 17 x 1.40 mmDocument History Page ISSUEBurst Architecture Document Number ECN NO