Cypress CY7C1511JV18 manual Capacitance, Thermal Resistance, AC Test Loads and Waveforms, Package

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Capacitance

CY7C1511JV18, CY7C1526JV18

CY7C1513JV18, CY7C1515JV18

Capacitance

Tested initially and after any design or process change that may affect these parameters.

Parameter

Description

Test Conditions

Max

Unit

CIN

Input Capacitance

TA = 25°C, f = 1 MHz, VDD = 1.8V, VDDQ = 1.5V

5.5

pF

CCLK

Clock Input Capacitance

 

8.5

pF

CO

Output Capacitance

 

6

pF

Thermal Resistance

Tested initially and after any design or process change that may affect these parameters.

Parameter

Description

Test Conditions

165 FBGA

Unit

Package

 

 

 

 

ΘJA

Thermal Resistance

Test conditions follow standard test methods and

16.2

°C/W

 

(Junction to Ambient)

procedures for measuring thermal impedance, in

 

 

 

 

accordance with EIA/JESD51.

 

 

ΘJC

Thermal Resistance

2.3

°C/W

 

 

(Junction to Case)

 

 

 

AC Test Loads and Waveforms

VREF = 0.75V

VREF

 

 

 

 

 

 

 

0.75V

 

 

 

 

 

 

 

 

 

 

 

OUTPUT

 

 

 

 

 

 

 

 

Z0 = 50Ω

 

 

 

 

 

 

 

 

 

 

 

 

Device

 

 

 

 

 

 

 

 

 

Under

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Test

 

 

 

 

 

 

 

 

 

 

 

 

 

ZQ

RQ =

Thermal ResistancePackageAC Test Loads and Waveforms 250Ω

(a)

Manual backgroundManual background RL = 50Ω

VREF = 0.75V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VREF

 

 

 

 

 

 

0.75V

 

 

 

 

 

R = 50Ω

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

OUTPUT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ALL INPUT PULSES[21]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.25V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Device

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

5 pF 0.25V

 

 

 

0.75V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Under

ZQ

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Slew Rate = 2 V/ns

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Test

 

 

 

 

 

 

RQ =

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

250Ω

 

 

 

 

 

 

 

 

 

 

INCLUDING

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

JIG AND

 

 

 

 

 

 

(b)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SCOPE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Notes

21.Unless otherwise noted, test conditions are based on signal transition time of 2V/ns, timing reference levels of 0.75V, Vref = 0.75V, RQ = 250Ω, VDDQ = 1.5V, input pulse levels of 0.25V to 1.25V, and output loading of the specified IOL/IOH and load capacitance shown in (a) of AC Test Loads and Waveforms.

Document Number: 001-12560 Rev. *C

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Contents CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 FeaturesConfigurations Functional DescriptionLogic Block Diagram CY7C1526JV18 Logic Block Diagram CY7C1511JV18CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 Logic Block Diagram CY7C1513JV18 Logic Block Diagram CY7C1515JV18Pin Configuration 165-Ball FBGA 15 x 17 x 1.4 mm PinoutCY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 CY7C1513JV18, CY7C1515JV18 CY7C1511JV18, CY7C1526JV18Pin Definitions CY7C1513JV18, CY7C1515JV18 Pin Definitions continuedWrite Operations Functional OverviewRead Operations Byte Write OperationsProgrammable Impedance Concurrent TransactionsDepth Expansion Echo ClocksTruth Table CY7C1511JV18, CY7C1526JV18Application Example ASICWrite Cycle Descriptions CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 Performing a TAP Reset Disabling the JTAG FeatureTest Access Port-Test Clock IEEE 1149.1 Serial Boundary Scan JTAGSAMPLE/PRELOAD IDCODESAMPLE Z BYPASSTAP Controller State Diagram Page 15 ofTAP Controller Block Diagram TAP Electrical CharacteristicsTAP AC Switching Characteristics TAP Timing and Test ConditionsInstruction Codes Identification Register DefinitionsScan Register Sizes CY7C1511JV18Boundary Scan Order Power Up Sequence Power Up Sequence in QDR-II SRAMPower Up Waveforms DLL ConstraintsAC Electrical Characteristics Electrical CharacteristicsDC Electrical Characteristics Maximum RatingsAC Test Loads and Waveforms CapacitanceThermal Resistance PackageSwitching Characteristics ParameterWRITE Switching WaveformsREAD K K RPS WPSOrdering Information Package Diagram Figure 4. 165-ball FBGA 15 x 17 x 1.40 mmBurst Architecture Document Number Document History PageISSUE ECN NO