Cypress CY7C1473BV25 ZZ Mode Electrical Characteristics, First Second Third Fourth Address A1 A0

Page 10

CY7C1471BV25 CY7C1473BV25, CY7C1475BV25

included to greatly simplify read/modify/write sequences, which can be reduced to simple byte write operations.

Because the CY7C1471BV25, CY7C1473BV25, and CY7C1475BV25 are common IO devices, data must not be driven into the device while the outputs are active. The OE can be deasserted HIGH before presenting data to the DQs and DQPX inputs. This tri-states the output drivers. As a safety precaution, DQs and DQPX are automatically tri-stated during the data portion of a write cycle, regardless of the state of OE.

Burst Write Accesses

The CY7C1471BV25, CY7C1473BV25, and CY7C1475BV25 have an on-chip burst counter that makes it possible to supply a single address and conduct up to four Write operations without reasserting the address inputs. Drive ADV/LD LOW to load the initial address, as described in the Single Write Access section. When ADV/LD is driven HIGH on the subsequent clock rise, the Chip Enables (CE1, CE2, and CE3) and WE inputs are ignored and the burst counter is incremented. You must drive the correct BWX inputs in each cycle of the Burst Write to write the correct data bytes.

Sleep Mode

The ZZ input pin is an asynchronous input. Asserting ZZ places the SRAM in a power conservation “sleep” mode. Two clock cycles are required to enter into or exit from this “sleep” mode. While in this mode, data integrity is guaranteed. Accesses pending when entering the “sleep” mode are not considered valid nor is the completion of the operation guaranteed. You must select the device before entering the “sleep” mode. CE1, CE2, and CE3, must remain inactive for the duration of tZZREC after the ZZ input returns LOW.

Table 2. Interleaved Burst Address Table (MODE = Floating or VDD)

First

Second

Third

Fourth

Address

Address

Address

Address

A1: A0

A1: A0

A1: A0

A1: A0

00

01

10

11

 

 

 

 

01

00

11

10

 

 

 

 

10

11

00

01

 

 

 

 

11

10

01

00

 

 

 

 

Table 3. Linear Burst Address Table

 

(MODE = GND)

 

 

 

 

 

 

 

First

Second

Third

Fourth

Address

Address

Address

Address

A1: A0

A1: A0

A1: A0

A1: A0

00

01

10

11

 

 

 

 

01

10

11

00

 

 

 

 

10

11

00

01

 

 

 

 

11

00

01

10

 

 

 

 

ZZ Mode Electrical Characteristics

Parameter

Description

Test Conditions

Min

Max

Unit

IDDZZ

Sleep mode standby current

ZZ > VDD – 0.2V

 

120

mA

tZZS

Device operation to ZZ

ZZ > VDD – 0.2V

 

2tCYC

ns

tZZREC

ZZ recovery time

ZZ < 0.2V

2tCYC

 

ns

tZZI

ZZ active to sleep current

This parameter is sampled

 

2tCYC

ns

tRZZI

ZZ Inactive to exit sleep current

This parameter is sampled

0

 

ns

Document #: 001-15013 Rev. *E

Page 10 of 30

[+] Feedback

Image 10
Contents Description 133 MHz 100 MHz Unit FeaturesSelection Guide Functional Description Cypress Semiconductor Corporation 198 Champion CourtLogic Block Diagram CY7C1471BV25 2M x Logic Block Diagram CY7C1473BV25 4M xLogic Block Diagram CY7C1475BV25 1M x Pin Configurations CY7C1471BV25CY7C1473BV25 Ball Fbga 15 x 17 x 1.4 mm Pinout CY7C1471BV25 2M x CY7C1473BV25 4M xBall Fbga 14 x 22 x 1.76 mm Pinout CY7C1475BV25 1M × NC/1GPower Supply for the IO Circuitry Mode Input. Selects the Burst Order of the DevicePower Supply Inputs to the Core of the Device Pin Definitions Name DescriptionName Description Functional OverviewPin Definitions TDIFirst Second Third Fourth Address A1 A0 ZZ Mode Electrical CharacteristicsParameter Description Test Conditions Min Max Unit Operation Address Truth TableUsed Truth Table for Read/Write FunctionTAP Controller State Diagram Ieee 1149.1 Serial Boundary Scan JtagTAP Registers TAP Timing TAP DC Electrical Characteristics And Operating Conditions TAP AC Switching Characteristics5V TAP AC Test Conditions Scan Register Sizes Register Name Bit Size Identification Codes Instruction DescriptionBoundary Scan Exit Order 4M x Bit # Ball ID Boundary Scan Exit Order 2M x Bit # Ball IDBit # Ball ID Boundary Scan Exit Order 1M x Bit # Ball ID Operating Range Electrical CharacteristicsMaximum Ratings Range AmbientThermal Resistance CapacitanceParameter Description Test Conditions Tqfp Fbga Unit Parameter Description 133 MHz 100 MHz Unit Min Max Switching CharacteristicsSetup Times Output TimesRite ReadAddress Switching WaveformsStall ZZ Mode Timing Ordering Information Package Diagrams Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm Issue Orig. Description of Change Date Document History

CY7C1475BV25, CY7C1473BV25, CY7C1471BV25 specifications

Cypress Semiconductor, a leader in specialized memory solutions, offers a range of high-performance SRAM products, including the CY7C1471BV25, CY7C1473BV25, and CY7C1475BV25. These devices are designed to provide high-speed data processing capabilities along with impressive power efficiency, making them ideal choices for a variety of applications in telecommunications, networking, automotive, and consumer electronics.

The CY7C1471BV25 features a 1-Mbit density, while the CY7C1473BV25 and CY7C1475BV25 support densities of 3-Mbits and 5-Mbits respectively. All three models utilize a 3.3V power supply, and deliver fast access times of 5 ns (for CY7C1471BV25) and 6 ns (for CY7C1473BV25 and CY7C1475BV25). This rapid access enables quicker data retrieval and overall enhanced system performance.

One of the standout features of these SRAM devices is their asynchronous operation, which allows for straightforward integration into existing systems without the need for complex timing protocols. They can be easily interfaced with various microcontrollers and digital signal processors, providing flexibility and ease of use. Additionally, the devices are available in multiple package options, including the widely used TSOP and BGA formats, enabling designers to choose the best fit for their specific layouts.

In terms of technology, these SRAMs leverage advanced CMOS manufacturing processes, which contribute to their low power consumption and high reliability. With sleep modes and low standby current, they are particularly suited for battery-operated devices that demand energy efficiency.

Cypress products are renowned for their reliability and robustness, ensuring that the CY7C1471BV25, CY7C1473BV25, and CY7C1475BV25 can withstand the demands of harsh environments and extended usage. The devices also incorporate features such as high-speed data ports, which facilitate bidirectional data flow, making them optimal for both read and write operations.

In summary, the CY7C1471BV25, CY7C1473BV25, and CY7C1475BV25 SRAMs by Cypress are excellent choices for those seeking high-performance, low-power memory solutions. Their advanced technology, combined with a variety of features and options, caters to the needs of many industries, paving the way for innovative designs in modern electronics.