Cypress CY7C1475BV25 Maximum Ratings, Electrical Characteristics, Operating Range, Range Ambient

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CY7C1471BV25 CY7C1473BV25, CY7C1475BV25

Maximum Ratings

Exceeding maximum ratings may impair the useful life of the device. These user guidelines are not tested.

Storage Temperature

–65°C to +150°C

Ambient Temperature with

 

 

Power Applied

–55°C to +125°C

Supply Voltage on VDD Relative to GND

–0.5V to +3.6V

Supply Voltage on VDDQ Relative to GND

–0.5V to +VDD

DC Voltage Applied to Outputs

 

 

in Tri-State

–0.5V to VDDQ + 0.5V

Electrical Characteristics

Over the Operating Range [12, 13]

DC Input Voltage

–0.5V to VDD + 0.5V

Current into Outputs (LOW)

20 mA

Static Discharge Voltage

>2001V

(MIL-STD-883, Method 3015)

 

Latch Up Current

>200 mA

Operating Range

Range

Ambient

VDD

VDDQ

Temperature

Commercial

0°C to +70°C

2.5V –5%/+5%

2.5V–5% to

 

 

 

VDD

Industrial

–40°C to +85°C

 

Parameter

Description

Test Conditions

Min

Max

Unit

VDD

Power Supply Voltage

 

 

2.375

2.625

V

VDDQ

IO Supply Voltage

For 2.5V IO

 

2.375

VDD

V

VOH

Output HIGH Voltage

For 2.5V IO, IOH = –1.0 mA

 

2.0

 

V

VOL

Output LOW Voltage

For 2.5V IO, IOL= 1.0 mA

 

 

0.4

V

VIH

Input HIGH Voltage[12]

For 2.5V IO

 

1.7

VDD + 0.3V

V

VIL

Input LOW Voltage[12]

For 2.5V IO

 

–0.3

0.7

V

IX

Input Leakage Current

GND VI VDDQ

 

–5

5

μA

 

except ZZ and MODE

 

 

 

 

 

 

Input Current of MODE

Input = VSS

 

–30

 

μA

 

 

Input = VDD

 

 

5

μA

 

Input Current of ZZ

Input = VSS

 

–5

 

μA

 

 

Input = VDD

 

 

30

μA

IOZ

Output Leakage Current

GND VI VDDQ, Output Disabled

 

–5

5

μA

IDD [14]

VDD Operating Supply

VDD = Max, IOUT = 0 mA,

6.5 ns cycle, 133 MHz

 

305

mA

 

Current

f = fMAX = 1/tCYC

 

 

 

 

 

8.5 ns cycle, 100 MHz

 

275

mA

ISB1

Automatic CE

VDD = Max, Device Deselected,

6.5 ns cycle, 133 MHz

 

170

mA

 

Power Down

VIN VIH or VIN VIL

 

 

 

 

 

8.5 ns cycle, 100 MHz

 

170

mA

 

Current—TTL Inputs

f = fMAX, inputs switching

 

 

 

 

ISB2

Automatic CE

VDD = Max, Device Deselected,

All speeds

 

120

mA

 

Power Down

VIN 0.3V or VIN > VDD – 0.3V,

 

 

 

 

 

Current—CMOS Inputs

f = 0, inputs static

 

 

 

 

ISB3

Automatic CE

VDD = Max, Device Deselected, or

6.5 ns cycle, 133 MHz

 

170

mA

 

Power Down

VIN 0.3V or VIN > VDDQ – 0.3V

 

 

 

 

 

8.5 ns cycle, 100 MHz

 

170

mA

 

Current—CMOS Inputs

f = fMAX, inputs switching

 

 

 

 

ISB4

Automatic CE

VDD = Max, Device Deselected,

All Speeds

 

135

mA

 

Power Down

VIN VDD – 0.3V or VIN 0.3V,

 

 

 

 

 

Current—TTL Inputs

f = 0, inputs static

 

 

 

 

Notes

12.Overshoot: VIH(AC) < VDD +1.5V (pulse width less than tCYC/2). Undershoot: VIL(AC) > –2V (pulse width less than tCYC/2).

13.TPower-up: assumes a linear ramp from 0V to VDD(min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD.

14.The operation current is calculated with 50% read cycle and 50% write cycle.

Document #: 001-15013 Rev. *E

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Contents Features Selection Guide Functional DescriptionDescription 133 MHz 100 MHz Unit Cypress Semiconductor Corporation 198 Champion CourtLogic Block Diagram CY7C1471BV25 2M x Logic Block Diagram CY7C1473BV25 4M xLogic Block Diagram CY7C1475BV25 1M x Pin Configurations CY7C1471BV25CY7C1473BV25 Ball Fbga 15 x 17 x 1.4 mm Pinout CY7C1471BV25 2M x CY7C1473BV25 4M xBall Fbga 14 x 22 x 1.76 mm Pinout CY7C1475BV25 1M × NC/1GMode Input. Selects the Burst Order of the Device Power Supply Inputs to the Core of the DevicePower Supply for the IO Circuitry Pin Definitions Name DescriptionFunctional Overview Pin DefinitionsName Description TDIParameter Description Test Conditions Min Max Unit ZZ Mode Electrical CharacteristicsFirst Second Third Fourth Address A1 A0 Used Truth TableOperation Address Truth Table for Read/Write FunctionTAP Controller State Diagram Ieee 1149.1 Serial Boundary Scan JtagTAP Registers TAP Timing 5V TAP AC Test Conditions TAP AC Switching CharacteristicsTAP DC Electrical Characteristics And Operating Conditions Scan Register Sizes Register Name Bit Size Identification Codes Instruction DescriptionBit # Ball ID Boundary Scan Exit Order 2M x Bit # Ball IDBoundary Scan Exit Order 4M x Bit # Ball ID Boundary Scan Exit Order 1M x Bit # Ball ID Electrical Characteristics Maximum RatingsOperating Range Range AmbientParameter Description Test Conditions Tqfp Fbga Unit CapacitanceThermal Resistance Switching Characteristics Setup TimesParameter Description 133 MHz 100 MHz Unit Min Max Output TimesRite ReadStall Switching WaveformsAddress ZZ Mode Timing Ordering Information Package Diagrams Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm Issue Orig. Description of Change Date Document History

CY7C1475BV25, CY7C1473BV25, CY7C1471BV25 specifications

Cypress Semiconductor, a leader in specialized memory solutions, offers a range of high-performance SRAM products, including the CY7C1471BV25, CY7C1473BV25, and CY7C1475BV25. These devices are designed to provide high-speed data processing capabilities along with impressive power efficiency, making them ideal choices for a variety of applications in telecommunications, networking, automotive, and consumer electronics.

The CY7C1471BV25 features a 1-Mbit density, while the CY7C1473BV25 and CY7C1475BV25 support densities of 3-Mbits and 5-Mbits respectively. All three models utilize a 3.3V power supply, and deliver fast access times of 5 ns (for CY7C1471BV25) and 6 ns (for CY7C1473BV25 and CY7C1475BV25). This rapid access enables quicker data retrieval and overall enhanced system performance.

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In summary, the CY7C1471BV25, CY7C1473BV25, and CY7C1475BV25 SRAMs by Cypress are excellent choices for those seeking high-performance, low-power memory solutions. Their advanced technology, combined with a variety of features and options, caters to the needs of many industries, paving the way for innovative designs in modern electronics.