Maxim MAX12557 manual Parameter Symbol Conditions MIN TYP MAX Units DC Accuracy, Conversion Rate

Dual, 65Msps, 14-Bit, IF/Baseband ADC

MAX12557

ABSOLUTE MAXIMUM RATINGS

VDD to GND	-0.3V to +3.6V
OVDD to GND	-0.3V to the lower of (VDD + 0.3V) and +3.6V
INAP, INAN to GND ...	-0.3V to the lower of (VDD + 0.3V) and +3.6V
INBP, INBN to GND ...	-0.3V to the lower of (VDD + 0.3V) and +3.6V
CLKP, CLKN........................to	-0.3V to the lower of (VDD + 0.3V) and +3.6V
GND
REFIN, REFOUT	-0.3V to the lower of (VDD + 0.3V) and +3.6V
to GND
REFAP, REFAN,	-0.3V to the lower of (VDD + 0.3V) and +3.6V
COMA to GND
REFBP, REFBN,	-0.3V to the lower of (VDD + 0.3V) and +3.6V
COMB to GND

DIFFCLK/SECLK, G/T, PD, SHREF, DIV2,
DIV4 to GND	.........-0.3V to the lower of (VDD + 0.3V) and +3.6V
D0A–D13A,D0B–D13B, ..............................DAV,		-0.3V to (OVDD + 0.3V)
DORA, DORB to GND

Continuous Power Dissipation (TA = +70°C)
68-Pin Thin QFN 10mm x 10mm x 0.8mm
(derate 70mW/°C above +70°C)	4000mW
Operating Temperature Range	-40°C to +85°C
Junction Temperature	+150°C
Storage Temperature Range	-65°C to +150°C
Lead Temperature (soldering 10s)	+300°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ELECTRICAL CHARACTERISTICS

(VDD = 3.3V, OVDD = 2.0V, GND = 0, REFIN = REFOUT (internal reference), CL ≈ 10pF at digital outputs, VIN = -0.5dBFS (differen- tial), DIFFCLK/SECLK = OVDD, PD = GND, SHREF = GND, DIV2 = GND, DIV4 = GND, G/T = GND, fCLK = 65MHz, TA = -40°C to

+85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1)

PARAMETER	SYMBOL	CONDITIONS	MIN	TYP	MAX	UNITS
DC ACCURACY
Resolution			14			Bits
Integral Nonlinearity	INL	fIN = 3MHz		±2.1		LSB
Differential Nonlinearity	DNL	fIN = 3MHz, no missing codes over	-1.0	±0.6	+1.3	LSB
		temperature (Note 2)
Offset Error				±0.1	±0.9	%FSR
Gain Error				±0.5	±5.0	%FSR
ANALOG INPUT (INAP, INAN, INBP, INBN)
Differential Input Voltage Range	VDIFF	Differential or single-ended inputs		±1.024		V
Common-Mode Input Voltage				VDD / 2		V
Analog Input Resistance	RIN	Each input, Figure 3		3.4		kΩ
	CPAR	Fixed capacitance to ground,		2
		each input, Figure 3
Analog Input Capacitance						pF
	CSAMPLE	Switched capacitance,		4.5
		each input, Figure 3
CONVERSION RATE
Maximum Clock Frequency	fCLK		65			MHz
Minimum Clock Frequency					5	MHz
Data Latency		Figure 5		8		Clock
						Cycles
DYNAMIC CHARACTERISTICS (differential inputs)
Small-Signal Noise Floor	SSNF	Input at -35dBFS	74.5	76		dBFS
		fIN = 3MHz at -0.5dBFS	72.5	75
Signal-to-Noise Ratio	SNR	fIN = 32.5MHz at -0.5dBFS		74.5		dB
		fIN = 70MHz at -0.5dBFS		74.1
		fIN = 175MHz at -0.5dBFS	70.4	72.5

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