HP Performance Optimized Data Center (POD) 20cp manual Grounding requirements

Grounding requirements

The HP POD 20c structure and internal components are all bonded together. A common grounding electrode conductor connection point is provided on the utility-end of the hot aisle.

WARNING: To avoid the risk of personal injury or electric shock, the HP POD 20c must be properly grounded (earthed) in accordance with national, regional, and local regulations.

The following is a list of component requirements for grounding and bonding:

•Grounding of the HP POD 20c must comply with the requirements of Article 250 of the NEC, NFPA 70-2008/2011 (NA/JPN).

•Bonding of the piping systems and any exposed structural steel that is installed to support the HP POD 20c must be in accordance with the NEC (NA).

Grounding feature	Specification
Grounding electrode	• The grounding electrode conductor connection bus pad is located on the outside of
conductor pad	the HP POD 20c on the hot aisle side of the utility end of the POD and below the
	transformer cabinet.
	• The grounding pad must be connected to the grounding electrode system or
	building steel in accordance with Article 250 of the NEC or equivalent regional
	regulation.
Grounding lugs	• Grounding lugs cannot be attached to any painted surface.
	• Grounding lugs must be compression-type 2-hole lugs and UL listed specifically for
	grounding.
Ground rod system or	The customer must provide an effective grounding system with a ground rod or a
ground well	ground well.

IMPORTANT: Before installing the HP POD 20c, consult your local AHJ for applicable regulations and to review site-specific location guidelines. If needed, obtain any necessary permits.

The following figure shows the grounding electrode conductor connection that is located on the cold aisle of the HP POD 20c.

Side view shown

Site requirements 11