Cypress CY7C63310, CY7C638xx - page 76

CY7C63310, CY7C638xx
Document 38-08035 Rev. *K Page 76 of 83
31. Package Diagrams
Figure 31-1. 16-Pin (300-Mil) Molded DIP P1
Figure 31-2. 16-Pin (150-Mil) SOIC S16.15
DIMENSIONS IN INCHES MIN.
MAX.
SEATING PLANE
0.240
0.260
0.015
0.035
0.740
0.770
0.120
0.140
0.015
0.060
0.015
0.020
0.055
0.065
0.140
0.190
0.090
0.110
0.280
0.325
0.009
0.012
0.310
0.385
0.115
0.160
3° MIN.
18
916
51-85009 *A
PIN1 ID
0°~8°
18
916
SEATINGPLANE
0.230[5.842]
0.244[6.197]
0.157[3.987]
0.150[3.810]
0.386[9.804]
0.393[9.982]
0.050[1.270]
BSC
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.0098[0.249]
0.0138[0.350]
0.0192[0.487]
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
DIMENSIONSIN INCHES[MM] MIN.
MAX.
0.016[0.406]
0.010[0.254] X45°
0.004[0.102]
REFERENCEJEDEC MS-012
PART#
S16.15 STANDARD PKG.
SZ16.15LEAD FREE PKG.
PACKAGEWEIGHT 0.15gms
51-85068-*B
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