Cypress CY7C63310, CY7C638xx - page 77

CY7C63310, CY7C638xx
Document 38-08035 Rev. *K Page 77 of 83
Figure 31-3. 18-Pin (300-Mil) Molded DIP P3
Figure 31-4. 18-Pin (300-Mil) Molded SOIC S3
DIMENSIONS IN INCHES MIN.
MAX.
SEATING PLANE
0.240
0.270
0.030
0.060
0.870
0.920
0.140
0.190
0.090
0.110
0.055
0.065 0.015
0.020
0.120
0.140
0.015
0.060
0.009
0.012
0.310
0.385
0.300
0.325
0.115
0.160
3° MIN.
19
10 18
PART #
LEAD FREE PKG.
STANDARD PKG.
PZ18.3
P18.3
51-85010 *B
PIN1 ID
SEATINGPLANE
0.447[11.353]
0.463[11.760]
19
10 18
*
*
*
DIMENSIONSIN INCHES[MM] MIN.
MAX.
0.291[7.391]
0.300[7.620]
0.394[10.007]
0.419[10.642]
0.050[1.270]
TYP.
0.092[2.336]
0.105[2.667]
0.004[0.101]
0.0118[0.299]
0.0091[0.231]
0.0125[0.317]
0.015[0.381]
0.050[1.270]
0.013[0.330]
0.019[0.482]
0.026[0.660]
0.032[0.812]
0.004[0.101]
REFERENCEJEDEC MO-119
PART#
S18.3STANDARD PKG.
SZ18.3LEADFREE PKG.
51-85023-*B
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