Cypress CY7C63413C, CY7C63513C, CY7C63613C Package Diagrams , 24-Lead (300-Mil) SOIC S24.3/SZ24.3

CY7C63413C
CY7C63513C
CY7C63613C
Document #: 38-08027 Rev. *B Page 31 of 32
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsib ility f or the u se
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
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Package Diagrams (continued)
PIN1 ID
SEATINGPLANE
0.597[15.163]
0.615[15.621]
112
13 24
*
*
*
0.291[7.391]
0.300[7.620]
0.394[10.007]
0.419[10.642]
0.050[1.270]
TYP.
0.092[2.336]
0.105[2.667]
0.004[0.101]
0.0118[0.299]
0.0091[0.231]
0.0125[0.317]
0.015[0.381]
0.050[1.270]
0.013[0.330]
0.019[0.482]
0.026[0.660]
0.032[0.812]
0.004[0.101]
PART#
S24.3 STANDARD PKG.
SZ24.3LEAD FREE PKG.
MIN.
MAX.
NOTE:
1.JEDEC STD REF MO-119
2.BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH,BUT
MOLDPROTRUSION/END FLASH SHALL NOT EXCEED 0.010 in (0.254 mm) PER SIDE
3.DIMENSIONS IN INCHES
4.PACKAGE WEIGHT 0.65gms
DOESINCLUDE MOLD MISMATCH AND ARE MEASURED AT THE MOLD PARTING LINE.
51-85025-*C
24-Lead (300-Mil) SOIC S24.3/SZ24.3
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