ELANsat Tech EM78P156N Quality Assurance And Reliability

EM78P156N

OTP ROM

Quality Assurance And Reliability

Test category	Test conditions	Remarks
Solderability	Solder temperature=245±5℃，for 5 seconds u p to th e sto pper
	using a rosin-type flux
Pre-condition	Step1: TCT ，65℃(15mins)~150℃(15mins)，10 cycles	For SMD IC(such as
		SOP、QFP、SOJ…etc)
	Step2: bake 125℃，TD(durance)=24 hrs
	Step3:soak 30°C /60%，TD(durance)=192hrs
	Step4:IR flow 3cycles
	(Pkg thickness≧2.5mm or Pkg volume≧350mm3 ----225±5℃)
	(Pkg thickness≦2.5mm or Pkg volume≦350mm3 ----240±5
	℃ )
Temperature cycle test	-65℃(15mins)~150℃(15mins) , 200 cycles
Pressure cooker test	TA =121℃,RH=100%,pressure=2atm, TD(durance)= 96 Hrs
High temperature /high	TA=85℃ , RH=85%，TD(durance)=168 ,500 Hrs
humidity test
High-temperature	TA=150℃, TD(durance)=500,1000Hrs
storage life
High-temperature	TA=125 ℃ , VCC=Max. operating voltage, TD(durance)
operating life	=168,500,1000Hrs
Latch-up	TA=25℃, VCC=Max. operating voltage, 150mA/20V
ESD(HBM)	TA=25℃, ≧∣±3KV∣	IP_ND,OP_ND,IO_ND
		IP_NS,OP_NS,IO_NS
		IP_PD,OP_PD,IO_PD,
ESD(MM)	TA=25℃, ≧∣±300V∣
		IP_PS,OP_PS,IO_PS,
		VDD-VSS(+),VDD_VSS
		(-)mode

This specification is subject to change without prior notice. 56 07.29.2004 (V1.2)