HP L25500 manual Select the number of passes, Key, Vinyl

Handle the substrate

Setting	Description	If too low	If too high
Cool-down curing	The safe temperature at which	A long time is needed to finish the	The end of the print may be
temperature offset	the substrate can be under the	print.	damaged if the cutter is disabled.
	curing module without being
	damaged. At the end of a job, the
	substrate is not stopped until this
	temperature is reached.
Minimum drying	The	A heavily inked area that comes	The substrate is damaged in
power	minimum power applied in the	after a lightly inked area will have	blank or lightly inked areas of the
		bleeding or coalescence defects.	print, especially with a high
	drying module while printing, so		number of passes.
	the substrate does not cool too
	much in lightly inked areas.

Select the number of passes

Increasing the number of passes will tend to improve the print quality but reduce the speed of printing.

Passes	Uni/bidir	Self-	Banner	High-		Bill-	Offset	Mesh	Fabric	Film
		adhes.		quality		board
		vinyl		paper-
				based
Ink limit setting in RIP					Normal ink limit					High ink
										limit
4	Bidir	No	No	No		No	No	No	No	No
6	Bidir	No	Maybe	Maybe		Maybe	Yes	No	No	No
8	Bidir	Maybe	Yes	Yes		Yes	Yes	Yes	No	No
10	Bidir	Yes	Yes	Yes		Yes	Yes	Yes	No	No
12 to 16	Bidir	Yes	Yes	Yes		Yes	Yes	Yes	Yes	Yes
10 to 18	Unidir	Yes	Yes	Yes		Yes	Yes	Yes	Yes	Yes

Key

●Unidir: unidirectional

●Bidir: bidirectional

●No: not recommended

●Maybe: may be worth trying for extra speed

●Yes: recommended

36 Chapter 4 Handle the substrate ENWW