Server Board Overview |
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| Intel® Server Boards S5000PSL and S5000XSL TPS | |||||
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| Intel® Xeon® Processor 5050 | 667 MHz | 3.0 GHz |
| 2x 2 MB | 95 | Yes |
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| Intel® Xeon® Processor 5060 | 1066 MHz | 3.2 GHz |
| 2x 2 MB | 130 | Yes |
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| Intel® Xeon® Processor 5063 | 1066 MHz | 3.2 GHz |
| 2x 2 MB | 95 | Yes |
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| Intel® Xeon® Processor 5080 | 1066 MHz | 3.73 GHz |
| 2x 2 MB | 130 | Yes |
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| Intel® Xeon® Processor 5110 | 1066 MHz | 1.60 |
| 4 MB | 65 | Yes |
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| Intel® Xeon® Processor 5120 | 1066 MHz | 1.86 |
| 4 MB | 65 | Yes |
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| Intel® Xeon® Processor 5130 | 1333 | 2.00 |
| 4 MB | 65 | Yes |
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| Intel® Xeon® Processor 5140 | 1333 | 2.33 |
| 4 MB | 65 | Yes |
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| Intel® Xeon® Processor 5148 | 1333 | 2.33 |
| 4 MB | 40 | Yes |
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| Intel® Xeon® Processor 5150 | 1333 | 2.66 |
| 4 MB | 65 | Yes |
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| Intel® Xeon® Processor 5160 | 1333 | 3.00 |
| 4 MB | 80 | Yes |
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When two processors are installed, both must be of identical revision, core voltage, and bus/core speed. When only one processor is installed, it must be in the socket labeled CPU1. The other socket must be empty.
The board is designed to provide up to 130A of current per processor. Processors with higher current requirements are not supported.
No terminator is required in the second processor socket when using a single processor configuration.
3.1.2.2Common Enabling Kit (CEK) Design SupportThe server board complies with Intel’s Common Enabling Kit (CEK) processor mounting and heatsink retention solution. The server board ships with a CEK spring snapped onto the underside of the server board, beneath each processor socket. The heatsink attaches to the CEK, over the top of the processor and the thermal interface material (TIM). See the figure below for the stacking order of the chassis, CEK spring, server board, TIM, and heatsink.
The CEK spring is removable, allowing for the use of
30 | Revision 1.2 |
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