Intel® Server Boards S5000PSL and S5000XSL TPS

Design and Environmental Specifications

8.Design and Environmental Specifications

8.1Server Boards S5000PSL and S5000XSL Design Specifications

The operation of the server boards at conditions beyond those shown in the following table may cause permanent damage to the system. Exposure to absolute maximum rating conditions for extended periods may affect system reliability.

Table 37. Server Board Design Specifications

Operating Temperature

0º C to 55º C 1 (32º F to 131º F)

Non-Operating Temperature

-40º C to 70º C (-40º F to 158º F)

 

 

DC Voltage

± 5% of all nominal voltages

 

 

Shock (Unpackaged)

Trapezoidal, 50 G, 170 inches / sec

 

 

Shock (Packaged)

 

<20 pounds

36 inches

20 to <40 pounds

30 inches

40 to <80 pounds

24 inches

80 to <100 pounds

18 inches

100 to <120 pounds

12 inches

120 pounds

9 inches

 

 

Vibration (Unpackaged)

5 Hz to 500 Hz 3.13 g RMS random

 

 

Note:

1Chassis design must provide proper airflow to avoid exceeding the Dual-Core Intel® Xeon® processor 5000 sequence maximum case temperature.

Disclaimer Note: Intel Corporation server boards contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel ensures through its own chassis development and testing that when Intel server building blocks are used together, the fully integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of air flow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible, if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits.

Revision 1.2

79

 

Intel order number: D41763-003