Mechanical and Thermal Specifications | Intel® Server Board Set SE8500HW4 |
9.2Thermal Specifications
Table 38. Thermal SpecificationsComponent | Target Velocity | Target Ambient | Temp Specification | |
Processors | See Processors Thermal Specifications | |||
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Sockets | 400 lfm | 50 °C | 100 | °C, Tsocket |
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Cache VRD | 400 lfm | 50 °C | 90°C, Tsink @ MAX | |
Core VRD | 400 lfm | 50 °C | 90°C, Tsink @ MAX | |
North Bridge | 400 lfm | 50 °C | 105 | °C, THIS |
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PXH | 400 lfm | 50 °C | 105 | °C, Tdie |
XMB | 400 lfm | 50 °C | 105 | °C, Tcase |
Intel® IOP332 Storage I/O | 400 lfm | 50 °C | 105 | °C, Tdie |
Processor |
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ICH5 | 400 lfm | 50 °C | 85 °C, Tcase | |
LSI* 53C1030 SCSI | 400 lfm | 50 °C | 85 °C, Tcase | |
ATI* Radeon* 7000 Video | 400 lfm | 50 °C | 85 °C, Tcase | |
Broadcom* BCM5704 Ethernet | 400 lfm | 50 °C | 105 | °C, Tdie |
DDR2 400MHz RAID DIMM | 400 lfm | 50 °C | 85 °C, Tcase | |
Mainboard | 400 lfm | 50 °C | 100 | °C, Tboard |
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68 | Revision 1.0 |
| Intel order number |