Mechanical and Thermal Specifications

Intel® Server Board Set SE8500HW4

9.2Thermal Specifications

Table 38. Thermal Specifications

Component

Target Velocity

Target Ambient

Temp Specification

Processors

See Processors Thermal Specifications

 

 

 

 

 

Sockets

400 lfm

50 °C

100

°C, Tsocket

 

 

 

 

Cache VRD

400 lfm

50 °C

90°C, Tsink @ MAX

Core VRD

400 lfm

50 °C

90°C, Tsink @ MAX

North Bridge

400 lfm

50 °C

105

°C, THIS

 

 

 

 

 

PXH

400 lfm

50 °C

105

°C, Tdie

XMB

400 lfm

50 °C

105

°C, Tcase

Intel® IOP332 Storage I/O

400 lfm

50 °C

105

°C, Tdie

Processor

 

 

 

 

ICH5

400 lfm

50 °C

85 °C, Tcase

LSI* 53C1030 SCSI

400 lfm

50 °C

85 °C, Tcase

ATI* Radeon* 7000 Video

400 lfm

50 °C

85 °C, Tcase

Broadcom* BCM5704 Ethernet

400 lfm

50 °C

105

°C, Tdie

DDR2 400MHz RAID DIMM

400 lfm

50 °C

85 °C, Tcase

Mainboard

400 lfm

50 °C

100

°C, Tboard

 

 

 

 

 

68

Revision 1.0

 

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