System BIOS | Intel® Server Board Set SE8500HW4 |
Redundant Array of Inexpensive Disks (RAID) level 4, where data is striped across three Memory Boards and parity information is kept on the fourth.
When one board fails, the memory subsystem operates in
Memory hot upgrade is performed with the following steps:
1.Confirm in the BIOS Setup the RAID Upgrade Gap size, which is the size of memory BIOS allocates on each Memory Board for RAID memory capacity addition.
2.Hot remove one Memory Board
3.Upgrade the removed board, with up to the gap size set in the BIOS Setup
4.Hot add the higher capacity Memory Board
5.Perform
6.When the last Memory Board has been upgraded, the BIOS sends an ACPI notification of the new memory size to the operating system.
Supported Memory Board configurations for this mode are:
Memory Board A, B, C and D all of equal size. Memory Board hot replace is supported in the following way:
Memory Board A, B, C and D are installed and are of equal size. Remove Memory Board A, B, C, or D and replace with an equal sized Memory Board.
Memory Board hot upgrade is supported in the following way:
Memory Boards A, B, C and D are installed and of equal size. The BIOS Setup has been configured with a RAID Upgrade Gap size corresponding to the planned size update. One at a time, remove Memory Board A, B, C, and D and replace with an updated size (that does not exceed the RAID Update Gap size) of Memory Board.
72 | Revision 1.0 |
| Intel order number |