CS-HE9DKE CU-HE9DKE / CS-HE12DKE CU-HE12DKE

13 Servicing Information

13.1. About Lead Solder (PbF)

DISTINCTION OF PbF P.C. BOARD

P.C. Boards (manufactured) using lead free solder will have a PbF stamp on the P.C. Board.

CAUTION

••Pb free solder has a higher melting point than standard solder; Typically the melting point is 50 - 70 °F (30 - 40 °C) higher. Please use a high temperature solder iron and set it to 700 ± 20 °F (370 ± 10 °C)

••Pb free solder will tend to slash when heated too high (about 1100 °F/ 600°C). If you must use Pb solder, please completely all of the Pb free solder on the pins or solder area before applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

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