NEC Recommended Soldering Conditions, ΜPD75P308GF-3B9 80-pin plastic QFP 14 x 20 mm, Vps

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μPD75P308

★6. RECOMMENDED SOLDERING CONDITIONS

It is recommended that μPD75P308 be soldered under the following conditions.

For details on the recommended soldering conditions, refer to Information Document "Semiconductor Devices Mounting Manual" (IEI-616).

The soldering methods and conditions are not listed here, consult NEC.

Table 6-1 Soldering Conditions

μPD75P308GF-3B9: 80-pin plastic QFP (14 x 20 mm)

Soldering Method

Soldering Conditions

Symbol for Recommended

Condition

 

 

 

 

 

Wave Soldering

Soldering bath temperature: 260°C max.,

WS60-162-1

 

time: 10 seconds max., number of times: 1,

 

 

pre-heating temperature: 120°C max. (package surface

 

 

temperature), maximum number of days: 2 days*,

 

 

(beyond this period, 16 hours of pre-baking is required

 

 

at 125°C).

 

 

 

 

Infrared Reflow

Package peak temperature: 230°C,

IR30-162-1

 

time: 30 seconds max. (210°C min.),

 

 

number of times: 1, maximum number of days: 2 days*

 

 

(beyond this period, 16 hours of pre-baking is required

 

 

at 125°C)

 

 

 

 

VPS

Package peak temperature: 215°C,

VP15-162-1

 

time: 40 seconds max. (200°C min.),

 

 

number of times: 1, maximum number of days: 2 days*

 

 

(beyond this period, 16 hours of pre-baking is required

 

 

at 125°C)

 

 

 

 

Pin Partial Heating

Pin temperature: 300°C max.,

—

 

time: 3 seconds max. (per side)

 

 

 

 

*: Number of days after unpacking the dry pack. Storage conditions are 25°C and 65%RH max.

Caution: Do not use two or more soldering methods in combination (except the pin partial heating method).

Notice

A model that can be soldered under the more stringent conditions (infrared reflow peak temperature: 235°C, number of times: 2, and an extended number of days) is also available.

For details, consult NEC.

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Contents Ordering Information FeaturesDescription Quality GradePIN Configuration ΜPD75P308Block Diagram Contents Port Pins PIN FunctionsNON Port Pins Schmitt trigger input with hysteresis characteristics PIN INPUT/OUTPUT CircuitsInput buffer of Cmos standard COM Type F-BIN/OUT SEG Connect capacitor between VDD and P00/INT4, Reset pin Type M-CDifferences Between μPD75P308 and μPD75308 EpromWriting and Verifying Prom Program Memory Program memory address 0 clear mode+12.5 Write mode Verify mode Program inhibit mode Or H Operation Modes for WRITING/VERIFYING Program MemoryProgram Memory Write Procedure VDD+1Program Memory Read Procedure Erasure μPD75P308K only Electrical Specifications Absolute Maximum Ratings Ta = 25CRecommended Oscillation Circuit Constants Main System Clock Oscillator Circuit CharacteristicsTa = -10 to +70C, VDD = 5 to ±5 Main System Clock Ceramic Oscillator Ta = -10 to +70CCapacitance Ta = 25C, VDD = 0 DC Characteristics Ta = -10 to +70C, VDD = 5V ±5% AC Characteristics Ta = -10 to + 70C, VDD = 5V ±5% Interrupt mode register IM0Operation Other Than Serial Transfer Serial Transfer Operation SBI Mode SCK internal clock output master SBI Mode SCK external clock output masterAC Timing Test Point excluding X1 and XT1 inputs Clock TimingTI0 Timing Serial Transfer Timing THREE-LINE Serial I/O Mode TWO-LINE Serial I/O ModeReset Input Timing Serial Transfer Timing BUS Release Signal TransferCommand Signal Transfer Interrupt Input TimingData Retention Timing releasing Stop mode by Reset Ta = -10 to +70CBTM3 BTM2 BTM1 BTM0 Other than X1 or Program Memory Write Timing Program Memory Read TimingMD0 MD1 Package Drawings PIN Plastic QFP 14×20PIN Ceramic Wqfn Millimeters InchesRecommended Soldering Conditions ΜPD75P308GF-3B9 80-pin plastic QFP 14 x 20 mmVPS Appendix A. Development Tools Prom writing toolsAppendix B. Related Documents Status Before Initialization ALL MOS Devices Processing of Unused Pins Cmos Devices onlyStatic Electricity ALL MOS Devices Fix the input level of Cmos devicesMemo
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