NEC user manual Differences Between μPD75P308 and μPD75308, Eprom

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μPD75P308

2. DIFFERENCES BETWEEN μPD75P308 AND μPD75308

The μPD75P308 is a model of the μPD75308 and is equipped with a PROM instead of a mask ROM. Programs can be rewritten to the PROM of the μPD75P308. Table 2-1 shows the differences between the μPD75P308 and μPD75308. You should fully consider these differences when you debug or produce your application system on an experimental basis by using the PROM model, and then proceed to mass-produce the system by using the mask ROM model.

For the details of the CPU and the internal hardware, refer to μPD75308 User's Manual (IEM-5016).

Table 2-1 Differences between μPD75P308 and μPD75308

 

Item

 

μPD75P308K

 

 

μPD75P308GF

μPD75308GF

 

 

 

 

 

 

 

 

 

 

 

 

 

• EPROM

 

 

• PROM (one-time model)

• Mask ROM

 

Program Memory

• 0000H-1F7FH

 

 

• 0000H-1F7FH

• 0000H-1F7FH

 

 

 

 

• 8064 x 8 bits

 

 

• 8064 x 8 bits

• 8064 x 8 bits

 

 

 

 

 

 

 

 

 

Pull-up Resistor

 

Ports 4, 5

 

Not provided

Mask option

 

 

 

 

 

 

 

 

 

Dividing Resistor for LCD

 

Not provided

Mask option

 

Driving Power Supply

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin Connection

 

Pins 50-53

P30/MD0-P33/MD3

P30-P33

 

 

 

 

 

 

 

 

 

 

Pin 57

 

 

VPP

NC

 

 

 

 

 

 

Electrical Specifications

Current dissipations and operating temperature ranges differ between μPD75P308 and

 

μPD75308. For detail, refer to the specification documents of each mode.

★

 

 

 

 

 

 

 

 

 

 

 

 

Operating Voltage Range

 

 

5V±5%

2.7-6.0V

 

 

 

 

 

 

 

 

 

Package

80-pin ceramic WQFN

 

80-pin plastic QFP (14 x 20 mm)

 

 

 

 

 

 

 

 

(LCC w/window)

 

 

 

 

 

 

 

 

 

 

 

Others

 

Noise immunity and noise radiation differ because circuit scale and mask layout are

 

 

 

 

 

 

 

★

 

 

 

different.

 

 

 

 

 

 

 

 

 

 

 

 

 

★Note: The noise immunity and noise radiation differ between the PROM and mask ROM models. To replace the PROM model with the mask ROM model in the course of experimental production to mass production, evaluate your system by using the CS mode (not ES model) of the mask ROM model.

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Contents Ordering Information FeaturesDescription Quality GradePIN Configuration ΜPD75P308Block Diagram Contents Port Pins PIN FunctionsNON Port Pins PIN INPUT/OUTPUT Circuits Schmitt trigger input with hysteresis characteristicsInput buffer of Cmos standard Type F-B COMIN/OUT SEG Connect capacitor between VDD and P00/INT4, Reset pin Type M-CDifferences Between μPD75P308 and μPD75308 EpromWriting and Verifying Prom Program Memory Program memory address 0 clear mode+12.5 Write mode Verify mode Program inhibit mode Or H Operation Modes for WRITING/VERIFYING Program MemoryProgram Memory Write Procedure VDD+1Program Memory Read Procedure Erasure μPD75P308K only Electrical Specifications Absolute Maximum Ratings Ta = 25CRecommended Oscillation Circuit Constants Main System Clock Oscillator Circuit CharacteristicsTa = -10 to +70C, VDD = 5 to ±5 Main System Clock Ceramic Oscillator Ta = -10 to +70CCapacitance Ta = 25C, VDD = 0 DC Characteristics Ta = -10 to +70C, VDD = 5V ±5% Interrupt mode register IM0 AC Characteristics Ta = -10 to + 70C, VDD = 5V ±5%Operation Other Than Serial Transfer Serial Transfer Operation SBI Mode SCK internal clock output master SBI Mode SCK external clock output masterClock Timing AC Timing Test Point excluding X1 and XT1 inputsTI0 Timing Serial Transfer Timing THREE-LINE Serial I/O Mode TWO-LINE Serial I/O ModeReset Input Timing Serial Transfer Timing BUS Release Signal TransferCommand Signal Transfer Interrupt Input TimingTa = -10 to +70C Data Retention Timing releasing Stop mode by ResetBTM3 BTM2 BTM1 BTM0 Other than X1 or Program Memory Read Timing Program Memory Write TimingMD0 MD1 Package Drawings PIN Plastic QFP 14×20PIN Ceramic Wqfn Millimeters InchesΜPD75P308GF-3B9 80-pin plastic QFP 14 x 20 mm Recommended Soldering ConditionsVPS Appendix A. Development Tools Prom writing toolsAppendix B. Related Documents Status Before Initialization ALL MOS Devices Processing of Unused Pins Cmos Devices onlyStatic Electricity ALL MOS Devices Fix the input level of Cmos devicesMemo
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