Texas Instruments TMS320C642x DSP manual Important Notice

Page 57

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer'srisk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products

 

Applications

 

Amplifiers

amplifier.ti.com

Audio

www.ti.com/audio

Data Converters

dataconverter.ti.com

Automotive

www.ti.com/automotive

DSP

dsp.ti.com

Broadband

www.ti.com/broadband

Interface

interface.ti.com

Digital Control

www.ti.com/digitalcontrol

Logic

logic.ti.com

Military

www.ti.com/military

Power Mgmt

power.ti.com

Optical Networking

www.ti.com/opticalnetwork

Microcontrollers

microcontroller.ti.com

Security

www.ti.com/security

RFID

www.ti-rfid.com

Telephony

www.ti.com/telephony

Low Power

www.ti.com/lpw

Video & Imaging

www.ti.com/video

Wireless

 

 

 

 

 

Wireless

www.ti.com/wireless

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Copyright © 2007, Texas Instruments Incorporated

Image 57
Contents Users Guide Submit Documentation Feedback Contents List of Figures List of Tables Read This First Purpose of the Peripheral FeaturesFunctional Block Diagram Supported Use Case StatementIndustry Standards Compliance Statement Clock Source Clock ControlPLLC2 Configuration Clock ConfigurationMemory Map 3 DDR2 Memory Controller Internal Clock DomainsDDR2 Memory Controller Signal Descriptions Signal DescriptionsClock enable Active high Pin Type DescriptionTruth Table for DDR2 Sdram Commands DDR2 Sdram CommandsCommand Function Protocol DescriptionsRefresh Command Refresh ModeDeactivation Dcab and Deac Dcab CommandDeac Command Activation Actv Actv CommandDDR2 Read Command Read CommandDDR2 WRT Command Write WRT CommandDDR2 MRS and Emrs Command Mode Register Set MRS and EmrsAddressable Memory Ranges Memory Width and Byte AlignmentBit External Memory Endianness SupportBank Configuration Register Fields for Address Mapping Address MappingBit Field Bit Value Bit Description Logical Address-to-DDR2 Sdram Address Map for 16-bit Sdram Logical Address-to-DDR2 Sdram Address Map for 32-Bit SdramLogical Address-to-DDR2 Sdram Address Map DDR2 Sdram Column, Row, and Bank Access DDR2 Memory Controller Fifo Description DDR2 Memory Controller InterfaceCommand Ordering and Scheduling, Advanced Concept Possible Race Condition Command StarvationRefresh Scheduling Self-Refresh ModeRefresh Urgency Levels Urgency Level DescriptionReset Considerations Reset SourcesReset Signal Reset Source Auto-Initialization Sequence VTP IO Buffer CalibrationDDR2 Sdram Configuration by EMRS1 Command DDR2 Sdram Configuration by MRS CommandInitializing Configuration Registers DDR2 Memory ControllerPeripheral Architecture Power Management Interrupt SupportDMA Event Support Emulation Considerations Supported Use Cases Connecting the DDR2 Memory Controller to DDR2 MemoryConnecting DDR2 Memory Controller for 32-Bit Connection Sdram Bank Configuration Register Sdbcr Configuration Configuring Sdram Bank Configuration Register SdbcrConfiguring Sdram Refresh Control Register Sdrcr DDR2 Memory Refresh SpecificationSdram Timing Register Sdtimr Configuration Configuring Sdram Timing Registers Sdtimr and SDTIMR2Sdram Timing Register 2 SDTIMR2 Configuration DDR2 Data Register Field Manual Data Manual FormulaConfiguring DDR PHY Control Register Ddrphycr DDR PHY Control Register Ddrphycr ConfigurationRegister Field Name Description D31-0 Mode D63-32Acronym Register Description DDR VTP RegisterSdram Status Register Sdrstat Sdram Status Register Sdrstat Field DescriptionsBit Field Sdram Bank Configuration Register Sdbcr Sdram Bank Configuration Register Sdbcr Field DescriptionsBit Field Value Description Reserved Reserved. Always write a 0 to this bit Sdram Refresh Control Register Sdrcr Field Descriptions Sdram Refresh Control Register SdrcrSdram Timing Register Sdtimr Field Descriptions Sdram Timing Register SdtimrSdram Timing Register 2 SDTIMR2 Field Descriptions Sdram Timing Register 2 SDTIMR2Peripheral Bus Burst Priority Register Pbbpr Peripheral Bus Burst Priority Register PbbprInterrupt Raw Register IRR Field Descriptions Interrupt Raw Register IRRInterrupt Masked Register IMR Field Descriptions Interrupt Masked Register IMRInterrupt Mask Set Register Imsr Field Descriptions Interrupt Mask Set Register ImsrInterrupt Mask Clear Register Imcr Field Descriptions Interrupt Mask Clear Register ImcrDDR PHY Control Register Ddrphycr Field Descriptions DDR PHY Control Register DdrphycrVTP IO Control Register Vtpiocr Field Descriptions VTP IO Control Register VtpiocrDDR VTP Enable Register Ddrvtper Field Descriptions DDR VTP Enable Register DdrvtperDDR VTP Register Ddrvtpr DDR VTP Register Ddrvtpr Field DescriptionsAdditions/Modifications/Deletions Table A-1. Document Revision HistoryImportant Notice