Cypress 37000 CPLD manual Features, Ultra37000 5.0V Devices, Ultra37000V 3.3V Devices

Page 1

Ultra37000 CPLD Family

5V, 3.3V, ISR™ High-Performance CPLDs

Features

General Description

In-System Reprogrammable™ (ISR™) CMOS CPLDs

JTAG interface for reconfigurability

Design changes do not cause pinout changes

Design changes do not cause timing changes

High density

32 to 512 macrocells

32 to 264 I/O pins

Five dedicated inputs including four clock pins

Simple timing model

No fanout delays

No expander delays

No dedicated vs. I/O pin delays

No additional delay through PIM

No penalty for using full 16 product terms

No delay for steering or sharing product terms

3.3V and 5V versions

PCI-compatible[1]

Programmable bus-hold capabilities on all I/Os

Intelligent product term allocator provides:

0 to 16 product terms to any macrocell

Product term steering on an individual basis

Product term sharing among local macrocells

Flexible clocking

Four synchronous clocks per device

Product term clocking

Clock polarity control per logic block

Consistent package/pinout offering across all densities

Simplifies design migration

Same pinout for 3.3V and 5.0V devices

Packages

44 to 400 leads in PLCC, CLCC, PQFP, TQFP, CQFP, BGA, and Fine-Pitch BGA packages

Lead (Pb)-free packages available

Note:

The Ultra37000™ family of CMOS CPLDs provides a range of high-density programmable logic solutions with unparalleled system performance. The Ultra37000 family is designed to bring the flexibility, ease of use, and performance of the 22V10 to high-density CPLDs. The architecture is based on a number of logic blocks that are connected by a Programmable Inter- connect Matrix (PIM). Each logic block features its own product term array, product term allocator, and 16 macrocells. The PIM distributes signals from the logic block outputs and all input pins to the logic block inputs.

All of the Ultra37000 devices are electrically erasable and In-System Reprogrammable (ISR), which simplifies both design and manufacturing flows, thereby reducing costs. The ISR feature provides the ability to reconfigure the devices without having design changes cause pinout or timing changes. The Cypress ISR function is implemented through a JTAG-compliant serial interface. Data is shifted in and out through the TDI and TDO pins, respectively. Because of the superior routability and simple timing model of the Ultra37000 devices, ISR allows users to change existing logic designs while simultaneously fixing pinout assignments and maintaining system performance.

The entire family features JTAG for ISR and boundary scan, and is compatible with the PCI Local Bus specification, meeting the electrical and timing requirements. The Ultra37000 family features user programmable bus-hold capabilities on all I/Os.

Ultra37000 5.0V Devices

The Ultra37000 devices operate with a 5V supply and can support 5V or 3.3V I/O levels. VCCO connections provide the capability of interfacing to either a 5V or 3.3V bus. By connecting the VCCO pins to 5V the user insures 5V TTL levels on the outputs. If VCCO is connected to 3.3V the output levels meet 3.3V JEDEC standard CMOS levels and are 5V tolerant. These devices require 5V ISR programming.

Ultra37000V 3.3V Devices

Devices operating with a 3.3V supply require 3.3V on all VCCO pins, reducing the device’s power consumption. These devices support 3.3V JEDEC standard CMOS output levels, and are 5V-tolerant. These devices allow 3.3V ISR programming.

1. Due to the 5V-tolerant nature of 3.3V device I/Os, the I/Os are not clamped to VCC, PCI VIH = 2V.

Cypress Semiconductor Corporation

3901 North First Street

San Jose, CA 95134

408-943-2600

Document #: 38-03007 Rev. *E

 

 

 

Revised March 7, 2004

[+] Feedback

Image 1
Contents Ultra37000 5.0V Devices FeaturesUltra37000V 3.3V Devices Cypress Semiconductor CorporationSelection Guide Programmable Interconnect Matrix Architecture Overview of Ultra37000 FamilyLogic Block Ultra37000 Macrocell Product Term AllocatorO and Buried Macrocells Timing Model Input MacrocellJtag and PCI Standards Development Software SupportThird-Party Programmers CY37032/CY37032V Logic Block DiagramsCY37064/CY37064VInput CY37192/CY37192V CY37128/CY37128VCY37256/CY37256V Logic Block DiagramsTMS CY37384/CY37384VCY37512/CY37512V Operating Range2 0V Device Characteristics Maximum RatingsRange Output Condition3V Device Characteristics Maximum Ratings Endurance Characteristics5Inductance5 Capacitance5AC Characteristics Switching Characteristics Over the Operating Range Reset/Preset Parameters Pipelined Mode ParametersParameter Description Unit Product Term Clocking Parameters User Option ParametersSynchronous Reset/PresetProduct Term Operating Frequency ParametersUser Option Switching WaveformsJtag Timing Combinatorial OutputLatched Output Clock to Clock Registered InputLatched Input Asynchronous Preset Asynchronous ResetOutput Enable/Disable Latched Input and OutputTypical 5.0V Power Consumption CY37032 Power ConsumptionCY37064 CY37192 Typical 5.0V Power Consumption CY37128CY37384 Typical 5.0V Power Consumption CY37256Typical 3.3V Power Consumption CY37032V Typical 5.0V Power Consumption CY37512CY37128V Typical 3.3V Power Consumption CY37064VCY37256V Typical 3.3V Power Consumption CY37192VCY37512V Typical 3.3V Power Consumption CY37384VPin Tqfp A44 Top View Pin Configurations20Pin Plcc J67 / Clcc Y67 Top View Lead Plcc J83 / Clcc Y84 Top View Ball Fine-Pitch BGA BA50 Top ViewLead Tqfp A100 Top View Ball Fine-Pitch BGA BB100 for CY37128V Top View Ball Fine-Pitch BGA BB100 for CY37064V Top ViewCLK3/I4 GND TDO I/O Lead Tqfp A160 for CY37192V Top ViewI/O I/O I/O I/O I/O I/O I/O I/O Lead Pqfp N208 / Cqfp U208 Top ViewBall Pbga BG292 Top View Ball Fine-Pitch BGA BB256 Top View Lead Pbga BG388 Top View Ball Fine-Pitch BGA BB400 Top View 0V Ordering Information Ordering InformationLead Plastic Leaded Chip Carrier CY37064P84-154JC CY37128P84-167JC Lead Plastic Quad Flat Pack CY37256P256-154BGC 3V Ordering Information BB100 Lead Plastic Quad Flat Pack CY37256VP256-100BGC Lead Lead Pb-Free Thin Plastic Quad Flat Pack A44 Package DiagramsLead Lead Pb-Free Plastic Leaded Chip Carrier J67 Lead Ceramic Leaded Chip Carrier Y67 Lead Lead Pb-Free Plastic Leaded Chip Carrier J83 Ball 7.0 mm x 7.0 mm x 1.2 mm, 0.80 pitch Thin BGA BA48DLead Ceramic Leaded Chip Carrier Y84 Lead Lead Pb-Free Thin Plastic Quad Flat Pack Tqfp A100 Ball Thin Ball Grid Array 11 x 11 x 1.4 mm BB100 51-85049-*B Detail a Lead Ceramic Quad Flatpack Cavity Up U162Lead Plastic Quad Flatpack N208 Lead Ceramic Quad Flatpack Cavity Up U208 Bottom View Ball Fbga 17 x 17 mm BB256Ball Plastic Ball Grid Array Pbga 27 x 27 x 2.33 mm BG292 Ball Plastic Ball Grid Array Pbga 35 x 35 x 2.33 mm BG388 Ball Fbga 21 x 21 x 1.4 mm BB400 Commercial Addendum 3V Operating Range3V ± Document History Issue Orig. Description of Change Date