Cypress 37000 CPLD manual O and Buried Macrocells

Page 5

Ultra37000 CPLD Family

The buried macrocell also supports input register capability. The buried macrocell can be configured to act as an input register (D-type or latch) whose input comes from the I/O pin associated with the neighboring macrocell. The output of all buried macrocells is sent directly to the PIM regardless of its configuration.

I/O Macrocell

Figure 2 illustrates the architecture of the I/O macrocell. The I/O macrocell supports the same functions as the buried macrocell with the addition of I/O capability. At the output of the macrocell, a polarity control mux is available to select active LOW or active HIGH signals. This has the added advantage of allowing significant logic reduction to occur in many appli- cations.

The Ultra37000 macrocell features a feedback path to the PIM separate from the I/O pin input path. This means that if the macrocell is buried (fed back internally only), the associated I/O pin can still be used as an input.

Bus Hold Capabilities on all I/Os

Bus-hold, which is an improved version of the popular internal pull-up resistor, is a weak latch connected to the pin that does not degrade the device’s performance. As a latch, bus-hold maintains the last state of a pin when the pin is placed in a high-impedance state, thus reducing system noise in bus-interface applications. Bus-hold additionally allows unused device pins to remain unconnected on the board, which is particularly useful during prototyping as designers can route new signals to the device without cutting trace connec- tions to VCC or GND. For more information, see the application note Understanding Bus-Hold—A Feature of Cypress CPLDs.

Programmable Slew Rate Control

Each output has a programmable configuration bit, which sets the output slew rate to fast or slow. For designs concerned with meeting FCC emissions standards the slow edge provides for lower system noise. For designs requiring very high perfor- mance the fast edge rate provides maximum system perfor- mance.

 

 

 

I/O MACROCELL

 

 

 

 

 

 

 

FROM PTM

 

 

0

 

 

 

 

 

 

FAST

SLEW

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

 

 

 

 

 

 

 

 

016

 

 

 

 

 

 

 

 

SLOW

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PRODUCT

 

 

C25

 

 

0

 

 

 

 

C26

I/O CELL

TERMS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

P

Q

1

 

O

0

O

 

 

 

 

0

 

 

D/T/L

 

 

1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

“0”

 

 

 

 

1

O

 

R

 

 

 

 

 

0

 

 

 

2

 

 

 

 

 

C4

“1”

1

O

 

 

3

 

 

 

 

 

 

 

 

 

2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

4

 

 

 

 

DECODE

 

 

 

3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

C0 C1 C24

1

 

 

 

 

 

 

 

C6

C5

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

C2

C3

 

 

 

 

 

 

 

 

 

BURIED MACROCELL

 

 

 

 

 

 

 

FROM PTM

 

 

0

 

 

 

 

 

 

 

 

 

 

016

 

 

1

 

 

 

 

 

 

 

 

 

 

PRODUCT

 

 

 

 

 

 

 

 

 

 

 

 

 

TERMS

 

 

C25

 

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

0

O

 

 

 

 

 

 

 

O

 

P

 

 

 

 

 

 

 

 

 

1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

 

 

 

 

 

 

0

 

 

 

D/T/L

Q

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

Q

 

C7

 

 

 

 

 

 

 

 

 

 

2

 

 

R

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

3

 

 

 

 

 

 

 

 

 

 

 

 

4

 

 

 

 

 

 

DECODE

 

 

 

 

 

C0 C1 C24

 

 

 

 

 

 

 

 

 

 

1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

C2

C3

 

 

 

 

 

 

 

 

FEEDBACK TO PIM

 

 

 

 

 

 

 

 

 

 

FEEDBACK TO PIM

 

 

 

 

 

 

 

 

 

 

FEEDBACK TO PIM

 

 

 

 

 

ASYNCHRONOUS

 

 

 

 

 

 

 

 

 

 

 

 

 

BLOCK RESET

4 SYNCHRONOUS CLOCKS (CLK0,CLK1,CLK2,CLK3)

 

 

 

 

 

 

 

ASYNCHRONOUS

 

 

 

OE0 OE1

 

 

1 ASYNCHRONOUS CLOCK(PTCLK)

 

 

 

 

 

 

 

 

BLOCK PRESET

 

 

 

 

 

 

 

 

 

 

Figure 2. I/O and Buried Macrocells

Document #: 38-03007 Rev. *E

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Contents Ultra37000 5.0V Devices FeaturesUltra37000V 3.3V Devices Cypress Semiconductor CorporationSelection Guide Logic Block Architecture Overview of Ultra37000 FamilyProgrammable Interconnect Matrix Ultra37000 Macrocell Product Term AllocatorO and Buried Macrocells Timing Model Input MacrocellJtag and PCI Standards Development Software SupportThird-Party Programmers CY37064/CY37064VInput Logic Block DiagramsCY37032/CY37032V CY37192/CY37192V CY37128/CY37128VCY37256/CY37256V Logic Block DiagramsTMS CY37384/CY37384VCY37512/CY37512V Operating Range2 0V Device Characteristics Maximum RatingsRange Output Condition3V Device Characteristics Maximum Ratings Endurance Characteristics5Inductance5 Capacitance5AC Characteristics Switching Characteristics Over the Operating Range Reset/Preset Parameters Pipelined Mode ParametersParameter Description Unit Product Term Clocking Parameters User Option ParametersSynchronous Reset/PresetProduct Term Operating Frequency ParametersUser Option Switching WaveformsJtag Timing Combinatorial OutputLatched Output Latched Input Registered InputClock to Clock Asynchronous Preset Asynchronous ResetOutput Enable/Disable Latched Input and OutputCY37064 Power ConsumptionTypical 5.0V Power Consumption CY37032 CY37192 Typical 5.0V Power Consumption CY37128CY37384 Typical 5.0V Power Consumption CY37256Typical 3.3V Power Consumption CY37032V Typical 5.0V Power Consumption CY37512CY37128V Typical 3.3V Power Consumption CY37064VCY37256V Typical 3.3V Power Consumption CY37192VCY37512V Typical 3.3V Power Consumption CY37384VPin Plcc J67 / Clcc Y67 Top View Pin Configurations20Pin Tqfp A44 Top View Lead Plcc J83 / Clcc Y84 Top View Ball Fine-Pitch BGA BA50 Top ViewLead Tqfp A100 Top View Ball Fine-Pitch BGA BB100 for CY37128V Top View Ball Fine-Pitch BGA BB100 for CY37064V Top ViewCLK3/I4 GND TDO I/O Lead Tqfp A160 for CY37192V Top ViewI/O I/O I/O I/O I/O I/O I/O I/O Lead Pqfp N208 / Cqfp U208 Top ViewBall Pbga BG292 Top View Ball Fine-Pitch BGA BB256 Top View Lead Pbga BG388 Top View Ball Fine-Pitch BGA BB400 Top View 0V Ordering Information Ordering InformationLead Plastic Leaded Chip Carrier CY37064P84-154JC CY37128P84-167JC Lead Plastic Quad Flat Pack CY37256P256-154BGC 3V Ordering Information BB100 Lead Plastic Quad Flat Pack CY37256VP256-100BGC Lead Lead Pb-Free Plastic Leaded Chip Carrier J67 Package DiagramsLead Lead Pb-Free Thin Plastic Quad Flat Pack A44 Lead Ceramic Leaded Chip Carrier Y67 Lead Lead Pb-Free Plastic Leaded Chip Carrier J83 Ball 7.0 mm x 7.0 mm x 1.2 mm, 0.80 pitch Thin BGA BA48DLead Ceramic Leaded Chip Carrier Y84 Lead Lead Pb-Free Thin Plastic Quad Flat Pack Tqfp A100 Ball Thin Ball Grid Array 11 x 11 x 1.4 mm BB100 51-85049-*B Detail a Lead Ceramic Quad Flatpack Cavity Up U162Lead Plastic Quad Flatpack N208 Lead Ceramic Quad Flatpack Cavity Up U208 Bottom View Ball Fbga 17 x 17 mm BB256Ball Plastic Ball Grid Array Pbga 27 x 27 x 2.33 mm BG292 Ball Plastic Ball Grid Array Pbga 35 x 35 x 2.33 mm BG388 Ball Fbga 21 x 21 x 1.4 mm BB400 3V ± Addendum 3V Operating RangeCommercial Document History Issue Orig. Description of Change Date