Cypress 37000 CPLD Architecture Overview of Ultra37000 Family, Programmable Interconnect Matrix

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Ultra37000 CPLD Family

Speed Bins

Device

200

 

167

 

 

154

 

 

143

125

 

100

 

 

83

 

 

66

CY37032V

 

 

 

 

 

 

 

 

 

 

X

 

 

 

X

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CY37064V

 

 

 

 

 

 

 

 

 

 

X

 

 

 

X

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CY37128V

 

 

 

 

 

 

 

 

 

 

 

X

 

 

 

 

 

X

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CY37192V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

X

 

 

 

 

 

X

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CY37256V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

X

 

 

 

 

 

X

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CY37384V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

X

 

 

X

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CY37512V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

X

 

 

X

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Device-Package Offering and I/O Count

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Device

44- Lead TQFP

44- Lead CLCC

48- Lead FBGA

84- Lead CLCC

100- Lead TQFP

100- Lead FBGA

 

160- Lead TQFP

160- Lead CQFP

208- Lead PQFP

208- Lead CQFP

292- Lead PBGA

256- Lead FBGA

388- Lead PBGA

400- Lead FBGA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CY37032V

37

 

 

37

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CY37064V

37

37

 

37

 

 

69

69

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CY37128V

 

 

 

 

69

69

85

 

133

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CY37192V

 

 

 

 

 

 

 

 

 

 

125

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CY37256V

 

 

 

 

 

 

 

 

 

 

133

133

165

 

 

197

197

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CY37384V

 

 

 

 

 

 

 

 

 

 

 

 

165

 

 

197

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CY37512V

 

 

 

 

 

 

 

 

 

 

 

 

165

 

165

197

 

269

269

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Architecture Overview of Ultra37000 Family

Programmable Interconnect Matrix

The PIM consists of a completely global routing matrix for signals from I/O pins and feedbacks from the logic blocks. The PIM provides extremely robust interconnection to avoid fitting and density limitations.

The inputs to the PIM consist of all I/O and dedicated input pins and all macrocell feedbacks from within the logic blocks. The number of PIM inputs increases with pin count and the number of logic blocks. The outputs from the PIM are signals routed to the appropriate logic blocks. Each logic block receives 36 inputs from the PIM and their complements, allowing for 32-bit operations to be implemented in a single pass through the device. The wide number of inputs to the logic block also improves the routing capacity of the Ultra37000 family.

An important feature of the PIM is its simple timing. The propa- gation delay through the PIM is accounted for in the timing specifications for each device. There is no additional delay for traveling through the PIM. In fact, all inputs travel through the PIM. As a result, there are no route-dependent timing param- eters on the Ultra37000 devices. The worst-case PIM delays are incorporated in all appropriate Ultra37000 specifications.

Routing signals through the PIM is completely invisible to the user. All routing is accomplished by software—no hand routing is necessary. Warpand third-party development packages automatically route designs for the Ultra37000 family in a matter of minutes. Finally, the rich routing resources of the Ultra37000 family accommodate last minute logic changes while maintaining fixed pin assignments.

Logic Block

The logic block is the basic building block of the Ultra37000 architecture. It consists of a product term array, an intelligent product-term allocator, 16 macrocells, and a number of I/O cells. The number of I/O cells varies depending on the device used. Refer to Figure 1 for the block diagram.

Product Term Array

Each logic block features a 72 x 87 programmable product term array. This array accepts 36 inputs from the PIM, which originate from macrocell feedbacks and device pins. Active LOW and active HIGH versions of each of these inputs are generated to create the full 72-input field. The 87 product terms in the array can be created from any of the 72 inputs.

Of the 87 product terms, 80 are for general-purpose use for the 16 macrocells in the logic block. Four of the remaining seven product terms in the logic block are output enable (OE) product terms. Each of the OE product terms controls up to eight of the 16 macrocells and is selectable on an individual macrocell basis. In other words, each I/O cell can select between one of two OE product terms to control the output buffer. The first two of these four OE product terms are available to the upper half of the I/O macrocells in a logic block. The other two OE product terms are available to the lower half of the I/O macrocells in a logic block.

The next two product terms in each logic block are dedicated asynchronous set and asynchronous reset product terms. The final product term is the product term clock. The set, reset, OE and product term clock have polarity control to realize OR functions in a single pass through the array.

Document #: 38-03007 Rev. *E

Page 3 of 64

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Contents Cypress Semiconductor Corporation FeaturesUltra37000 5.0V Devices Ultra37000V 3.3V DevicesSelection Guide Architecture Overview of Ultra37000 Family Programmable Interconnect MatrixLogic Block Ultra37000 Macrocell Product Term AllocatorO and Buried Macrocells Timing Model Input MacrocellJtag and PCI Standards Development Software SupportThird-Party Programmers Logic Block Diagrams CY37032/CY37032VCY37064/CY37064VInput CY37192/CY37192V CY37128/CY37128VCY37256/CY37256V Logic Block DiagramsTMS CY37384/CY37384VCY37512/CY37512V Output Condition 0V Device Characteristics Maximum RatingsOperating Range2 RangeCapacitance5 Endurance Characteristics53V Device Characteristics Maximum Ratings Inductance5AC Characteristics Switching Characteristics Over the Operating Range User Option Parameters Pipelined Mode ParametersReset/Preset Parameters Parameter Description Unit Product Term Clocking ParametersOperating Frequency Parameters Reset/PresetSynchronous Product TermCombinatorial Output Switching WaveformsUser Option Jtag TimingLatched Output Registered Input Clock to ClockLatched Input Latched Input and Output Asynchronous ResetAsynchronous Preset Output Enable/DisablePower Consumption Typical 5.0V Power Consumption CY37032CY37064 CY37192 Typical 5.0V Power Consumption CY37128CY37384 Typical 5.0V Power Consumption CY37256Typical 3.3V Power Consumption CY37032V Typical 5.0V Power Consumption CY37512CY37128V Typical 3.3V Power Consumption CY37064VCY37256V Typical 3.3V Power Consumption CY37192VCY37512V Typical 3.3V Power Consumption CY37384VPin Configurations20 Pin Tqfp A44 Top ViewPin Plcc J67 / Clcc Y67 Top View Lead Plcc J83 / Clcc Y84 Top View Ball Fine-Pitch BGA BA50 Top ViewLead Tqfp A100 Top View Ball Fine-Pitch BGA BB100 for CY37128V Top View Ball Fine-Pitch BGA BB100 for CY37064V Top ViewCLK3/I4 GND TDO I/O Lead Tqfp A160 for CY37192V Top ViewI/O I/O I/O I/O I/O I/O I/O I/O Lead Pqfp N208 / Cqfp U208 Top ViewBall Pbga BG292 Top View Ball Fine-Pitch BGA BB256 Top View Lead Pbga BG388 Top View Ball Fine-Pitch BGA BB400 Top View 0V Ordering Information Ordering InformationLead Plastic Leaded Chip Carrier CY37064P84-154JC CY37128P84-167JC Lead Plastic Quad Flat Pack CY37256P256-154BGC 3V Ordering Information BB100 Lead Plastic Quad Flat Pack CY37256VP256-100BGC Package Diagrams Lead Lead Pb-Free Thin Plastic Quad Flat Pack A44Lead Lead Pb-Free Plastic Leaded Chip Carrier J67 Lead Ceramic Leaded Chip Carrier Y67 Lead Lead Pb-Free Plastic Leaded Chip Carrier J83 Ball 7.0 mm x 7.0 mm x 1.2 mm, 0.80 pitch Thin BGA BA48DLead Ceramic Leaded Chip Carrier Y84 Lead Lead Pb-Free Thin Plastic Quad Flat Pack Tqfp A100 Ball Thin Ball Grid Array 11 x 11 x 1.4 mm BB100 51-85049-*B Detail a Lead Ceramic Quad Flatpack Cavity Up U162Lead Plastic Quad Flatpack N208 Lead Ceramic Quad Flatpack Cavity Up U208 Bottom View Ball Fbga 17 x 17 mm BB256Ball Plastic Ball Grid Array Pbga 27 x 27 x 2.33 mm BG292 Ball Plastic Ball Grid Array Pbga 35 x 35 x 2.33 mm BG388 Ball Fbga 21 x 21 x 1.4 mm BB400 Addendum 3V Operating Range Commercial3V ± Document History Issue Orig. Description of Change Date