Cypress 37000 CPLD manual 0V Ordering Information

Page 42

Ultra37000 CPLD Family

Ordering Information

C Y 3 7 5 1 2 V P 4 0 0 - 8 3 B B X C

Cypress Semiconductor ID

Family Type

37 = Ultra37000 Family

Operating Conditions

Commercial

0°C to +70°C

Industrial -40°C to +85°C

Military

-55°C to +125°C

Macrocell Density

32 = 32 Macrocells 256 = 256 Macrocells

64 = 64 Macrocells 384 = 384 Macrocells

128 = 128 Macrocells 512 = 512 Macrocells

192 = 192 Macrocells

Operating Reference Voltage V = 3.3V Supply Voltage (5.0V if not specified)

Pin Count

P44 = 44 Leads

P48 = 48 Leads

P84 = 84 Leads

P100 = 100 Leads

P160 = 160 Leads

P208 = 208 Leads

P256 = 256 Leads

P352 = 352 Leads

P400 = 400 Leads

5.0V Ordering Information

Lead Free

XLead Free

Package Type

A = Thin Quad Flat Pack (TQFP)

U = Ceramic Quad Flat Pack (CQFP) N = Plastic Quad Flat Pack (PQFP)

NT = Thermally Enhanced Plastic Quad Flat Pack (EQFP)

J = Plastic Leaded Chip Carrier (PLCC) Y = Ceramic Leaded Chip Carrier (CLCC) BG = Plastic Ball Grid Array (PBGA)

BA = Fine-Pitch Ball Grid Array (FBGA) 0.8mm Lead Pitch

BB = Fine-Pitch Ball Grid Array (FBGA) 1.0mm Lead Pitch

Speed

125 = 125 MHz

 

200 = 200 MHz

100 = 100 MHz

167 = 167 MHz

83 = 83 MHz

154 = 154 MHz

66 = 66 MHz

143 = 143 MHz

 

 

Macrocells

Speed

Ordering Code

Package

Package Type

Operating

 

(MHz)

Name

Range

 

 

 

 

 

 

 

 

32

200

CY37032P44-200AC

A44

44-Lead Thin Quad Flat Pack

Commercial

 

 

 

 

 

 

 

 

 

 

CY37032P44-200AXC

A44

44-Lead Lead Free Thin Quad Flat Pack

 

 

 

 

 

 

 

 

 

 

 

CY37032P44-200JC

J67

44-Lead Plastic Leaded Chip Carrier

 

 

 

 

 

 

 

 

 

 

 

CY37032P44-200JXC

J67

44-Lead Lead Free Plastic Leaded Chip Carrier

 

 

 

 

 

 

 

 

 

 

154

CY37032P44-154AC

A44

44-Lead Thin Quad Flat Pack

Commercial

 

 

 

 

 

 

 

 

 

 

CY37032P44-154JC

J67

44-Lead Plastic Leaded Chip Carrier

 

 

 

 

 

 

 

 

 

 

 

CY37032P44-154AI

A44

44-Lead Thin Quad Flat Pack

Industrial

 

 

 

 

 

 

 

 

 

 

CY37032P44-154AXI

A44

44-Lead Lead Free Thin Quad Flat Pack

 

 

 

 

 

 

 

 

 

 

 

CY37032P44-154JI

J67

44-Lead Plastic Leaded Chip Carrier

 

 

 

 

 

 

 

 

 

 

 

CY37032P44-154JXI

J67

44-Lead Lead Free Plastic Leaded Chip Carrier

 

 

 

 

 

 

 

 

 

 

125

CY37032P44-125AC

A44

44-Lead Thin Quad Flat Pack

Commercial

 

 

 

 

 

 

 

 

 

 

CY37032P44-125AXC

A44

44-Lead Lead Free Thin Quad Flat Pack

 

 

 

 

 

 

 

 

 

 

 

CY37032P44-125JC

J67

44-Lead Plastic Leaded Chip Carrier

 

 

 

 

 

 

 

 

 

 

 

CY37032P44-125JXC

J67

44-Lead Lead Free Plastic Leaded Chip Carrier

 

 

 

 

 

 

 

 

 

 

 

CY37032P44-125AI

A44

44-Lead Thin Quad Flat Pack

Industrial

 

 

 

 

 

 

 

 

 

 

CY37032P44-125JI

J67

44-Lead Plastic Leaded Chip Carrier

 

 

 

 

 

 

 

 

 

64

200

CY37064P44-200AC

A44

44-Lead Thin Quad Flat Pack

Commercial

 

 

 

 

 

 

 

 

 

 

CY37064P44-200AXC

A44

44-Lead Lead Free Thin Quad Flat Pack

 

 

 

 

 

 

 

 

 

 

 

CY37064P44-200JC

J67

44-Lead Plastic Leaded Chip Carrier

 

 

 

 

 

 

 

 

 

 

 

CY37064P44-200JXC

J67

44-Lead Lead Free Plastic Leaded Chip Carrier

 

 

 

 

 

 

 

 

 

 

 

CY37064P84-200JC

J83

84-Lead Plastic Leaded Chip Carrier

 

 

 

 

 

 

 

 

 

 

 

CY37064P100-200AC

A100

100-Lead Thin Quad Flat Pack

 

 

 

 

 

 

 

 

 

 

 

CY37064P100-200AXC

A100

100-Lead Lead Free Thin Quad Flat Pack

 

 

 

 

 

 

 

 

Document #: 38-03007 Rev. *E

 

 

Page 42 of 64

[+] Feedback

Image 42
Contents Ultra37000V 3.3V Devices FeaturesUltra37000 5.0V Devices Cypress Semiconductor CorporationSelection Guide Architecture Overview of Ultra37000 Family Programmable Interconnect MatrixLogic Block Product Term Allocator Ultra37000 MacrocellO and Buried Macrocells Input Macrocell Timing ModelDevelopment Software Support Jtag and PCI StandardsThird-Party Programmers Logic Block Diagrams CY37032/CY37032VCY37064/CY37064VInput CY37128/CY37128V CY37192/CY37192VLogic Block Diagrams CY37256/CY37256VCY37384/CY37384V TMSCY37512/CY37512V Range 0V Device Characteristics Maximum RatingsOperating Range2 Output ConditionInductance5 Endurance Characteristics53V Device Characteristics Maximum Ratings Capacitance5AC Characteristics Switching Characteristics Over the Operating Range Parameter Description Unit Product Term Clocking Parameters Pipelined Mode ParametersReset/Preset Parameters User Option ParametersProduct Term Reset/PresetSynchronous Operating Frequency ParametersJtag Timing Switching WaveformsUser Option Combinatorial OutputLatched Output Registered Input Clock to ClockLatched Input Output Enable/Disable Asynchronous ResetAsynchronous Preset Latched Input and OutputPower Consumption Typical 5.0V Power Consumption CY37032CY37064 Typical 5.0V Power Consumption CY37128 CY37192Typical 5.0V Power Consumption CY37256 CY37384Typical 5.0V Power Consumption CY37512 Typical 3.3V Power Consumption CY37032VTypical 3.3V Power Consumption CY37064V CY37128VTypical 3.3V Power Consumption CY37192V CY37256VTypical 3.3V Power Consumption CY37384V CY37512VPin Configurations20 Pin Tqfp A44 Top ViewPin Plcc J67 / Clcc Y67 Top View Ball Fine-Pitch BGA BA50 Top View Lead Plcc J83 / Clcc Y84 Top ViewLead Tqfp A100 Top View Ball Fine-Pitch BGA BB100 for CY37064V Top View Ball Fine-Pitch BGA BB100 for CY37128V Top ViewCLK3/I4 GND Lead Tqfp A160 for CY37192V Top View TDO I/OLead Pqfp N208 / Cqfp U208 Top View I/O I/O I/O I/O I/O I/O I/O I/OBall Pbga BG292 Top View Ball Fine-Pitch BGA BB256 Top View Lead Pbga BG388 Top View Ball Fine-Pitch BGA BB400 Top View Ordering Information 0V Ordering InformationLead Plastic Leaded Chip Carrier CY37064P84-154JC CY37128P84-167JC Lead Plastic Quad Flat Pack CY37256P256-154BGC 3V Ordering Information BB100 Lead Plastic Quad Flat Pack CY37256VP256-100BGC Package Diagrams Lead Lead Pb-Free Thin Plastic Quad Flat Pack A44Lead Lead Pb-Free Plastic Leaded Chip Carrier J67 Lead Ceramic Leaded Chip Carrier Y67 Ball 7.0 mm x 7.0 mm x 1.2 mm, 0.80 pitch Thin BGA BA48D Lead Lead Pb-Free Plastic Leaded Chip Carrier J83Lead Ceramic Leaded Chip Carrier Y84 Lead Lead Pb-Free Thin Plastic Quad Flat Pack Tqfp A100 Ball Thin Ball Grid Array 11 x 11 x 1.4 mm BB100 51-85049-*B Lead Ceramic Quad Flatpack Cavity Up U162 Detail aLead Plastic Quad Flatpack N208 Lead Ceramic Quad Flatpack Cavity Up U208 Ball Fbga 17 x 17 mm BB256 Bottom ViewBall Plastic Ball Grid Array Pbga 27 x 27 x 2.33 mm BG292 Ball Plastic Ball Grid Array Pbga 35 x 35 x 2.33 mm BG388 Ball Fbga 21 x 21 x 1.4 mm BB400 Addendum 3V Operating Range Commercial3V ± Issue Orig. Description of Change Date Document History