Elmo MAN-OCSIG (Ver. 1.2) manual Mounting, Ocarina, Castanet

Ocarina/Castanet Installation Guide	Installation
MAN-OCSIG (Ver. 1.2)

3-3

3.4Mounting

3.4.1Ocarina

The Ocarina was designed for mounting on a printed circuit board (PCB). It is connected by 2 mm pitch 0.51 mm square pins. When designing the Ocarina into a device, be sure to leave about 1 cm (0.4") outward from the heatsink to enable free air convection around the Ocarina. We recommend that the Ocarina be soldered directly to the board. Alternatively, the Ocarina can be attached to socket connectors mounted on the PCB. If the PCB is enclosed in a metal chassis, we recommend that the Ocarina be screw-mounted to it as well to help with heat dissipation. The Ocarina has screw-mount holes on each corner of the heatsink for this purpose.

3.4.2Castanet

The Castanet was designed for mounting on a printed circuit board (PCB). It is connected by 2mm pitch 0.51 mm square pins. When designing the Castanet into a device, be sure to leave about 1 cm (0.4") outward from the lower board to enable free air convection around the Castanet. We recommend that the Castanet be soldered directly to the board. Alternatively, the Castanet can be attached to socket connectors mounted on the PCB.

Note: Elmo recommends you leave approximately 1 cm (0.4 in) of space on the side opposite the terminals to allow for free air convection.