CY7C1440AV33
CY7C1442AV33
CY7C1446AV33
Document #: 38-05383 Rev. *E Page 19 of 31
Capacitance[19]
Parameter Description Test Conditions 100 TQFP
Max. 165 FBGA
Max. 209 FBGA
Max. Unit
CIN Input Capacitance TA = 25°C, f = 1 MHz,
VDD = 3.3V
VDDQ = 2.5V
6.5 7 5 pF
CCLK Clock Input Capacitance 3 7 5 pF
CI/O Input/Output Capacitance 5.5 6 7 pF
Thermal Resistance[19]
Parameter Description Test Conditions 100 TQFP
Package 165 FBGA
Package 209 FBGA
Package Unit
ΘJA Thermal Resistance
(Junction to Ambient) Test conditions follow standard
test methods and procedures
for measuring thermal
impedance, per EIA/JESD51.
25.21 20.8 25.31 °C/W
ΘJC Thermal Resistance
(Junction to Case) 2.28 3.2 4.48 °C/W
AC Test Loads and Waveforms
Note:
19.Tested initially and after any design or process change that may affect these parameters.
OUTPUT
R = 317Ω
R = 351Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
V
T
= 1.5V
3.3V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1ns ≤1ns
(c)
OUTPUT
R = 1667Ω
R = 1538Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
VT= 1.25V
2.5V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1ns ≤1ns
(c)
3.3V I/O Test Load
2.5V I/O Test Load
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