Packaging Information, Packaging Dimensions

4.Packaging Information

This chapter illustrates the packaging specifications for the CY8C22x13 PSoC device, along with the thermal impedances for each package and the typical package capacitance on crystal pins.

4.1Packaging Dimensions

51-85075 - *A

Figure 4-1. 8-Lead (300-Mil) PDIP

May 2004

© Cypress MicroSystems, Inc. 2003 — Document No. 38-12009 Rev. *E

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Cypress CY8C22213, CY8C22113 manual Packaging Information, Packaging Dimensions

Contents

June Cypress MicroSystems, Inc Document No -12009 Rev. *E FeaturesPSoC Functional Overview PSoC Core Analog System CY8C22x13 Final Data Sheet PSoC OverviewDigital System Block Diagram Digital System Additional System Resources PSoC Device CharacteristicsAnalog System Block Diagram PSoC Device Characteristics Development Tools Getting StartedPSoC Designer Subsystems June 3 Document No -12009 Rev. *E Hardware Tools PSoC Designer Software SubsystemsPSoC Development Tool Kit June 3 Document No -12009 Rev. *E Application Editor User Modules and Development Process Flow ChartUser Modules and the PSoC Development Process Device Editor Document Conventions Table of Contents 2 20-Pin Part Pinout Pin InformationPinouts 1 8-Pin Part Pinout CY8C22213 PSoC Device CY8C22x13 Final Data Sheet Pin Information3 32-Pin Part Pinout Pin Part Pinout MLF Abbreviations Used Register ReferenceRegister Conventions Register Mapping Tables Register Map Bank 0 Table User Space CY8C22x13 Final Data Sheet2. Register ReferenceName Addr 0,Hex Access Blank fields are Reserved and should not be accessed Name Addr 1,Hex Access Register Map Bank 1 Table Configuration Space Vdd Voltage Electrical SpecificationsSymbol Unit of Measure Units of Measure Absolute Maximum Ratings Operating TemperatureCY8C22x13 Final Data Sheet Electrical Specifications Operating Temperature DC Chip-Level Specifications DC Electrical CharacteristicsDC Chip-Level Specifications DC General Purpose IO Specifications V DC Operational Amplifier Specifications DC Operational Amplifier SpecificationsPsrr OA Psrroa Psrr OB DC Analog Output Buffer SpecificationsV DC Analog Output Buffer Specifications 3V DC Analog Output Buffer Specifications 11 .3V DC Analog Reference Specifications DC Analog Reference SpecificationsDC Analog PSoC Block Specifications 10 V DC Analog Reference Specifications 13. DC POR and LVD Specifications DC POR and LVD Specifications 14. DC Programming Specifications DC Programming Specifications AC Chip-Level Specifications AC Electrical Characteristics15. AC Chip-Level Specifications TOS Tpllslewlow 16. AC Gpio Specifications AC General Purpose IO Specifications 17 V AC Operational Amplifier Specifications AC Operational Amplifier SpecificationsBW OA Bwoa 19. AC Digital Block Specifications AC Digital Block SpecificationsFunction Description Min Typ Max Units BW OB AC Analog Output Buffer Specifications20 V AC Analog Output Buffer Specifications 21 .3V AC Analog Output Buffer Specifications 23 .3V AC External Clock Specifications AC External Clock SpecificationsAC Programming Specifications 22 V AC External Clock Specifications TLOWI2C TSUDATI2C AC I2C Specifications25. AC Characteristics of the I2C SDA and SCL Pins Standard Mode Fast Mode Symbol Description Min Max Units Packaging Information Packaging Dimensions Lead 300-Mil Molded DIP June 3 Document No -12009 Rev. *E Lead 150-Mil Soic Lead 210-Mil Ssop Thermal Impedances per Package Capacitance on Crystal PinsTypical Package Capacitance on Crystal Pins Thermal Impedances Rows Ordering InformationOrdering Code Definitions CY 8 C 22 xxx-SPxx Copyrights CY8C22x13 Data Sheet Revision HistorySales and Company Information Revision History