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Cypress CY8C22113 Lead 150-Mil Soic, Lead 300-Mil Molded DIP June 3 Document No -12009 Rev. *E

Models: CY8C22213 CY8C22113

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CY8C22x13 Final Data Sheet	4. Packaging Information

51-85066 *B

51-85066 - *C

Figure 4-2. 8-Lead (150-Mil) SOIC

51-85011 - *A

Figure 4-3. 20-Lead (300-Mil) Molded DIP

June 3, 2004

Document No. 38-12009 Rev. *E

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Cypress CY8C22113, CY8C22213 manual Lead 150-Mil Soic, Lead 300-Mil Molded DIP June 3 Document No -12009 Rev. *E

Contents

Features PSoC Functional OverviewPSoC Core June Cypress MicroSystems, Inc Document No -12009 Rev. *ECY8C22x13 Final Data Sheet PSoC Overview Digital System Block DiagramDigital System Analog SystemPSoC Device Characteristics Analog System Block DiagramPSoC Device Characteristics Additional System ResourcesPSoC Designer Subsystems June 3 Document No -12009 Rev. *E Getting StartedDevelopment Tools PSoC Development Tool Kit June 3 Document No -12009 Rev. *E PSoC Designer Software SubsystemsHardware Tools User Modules and Development Process Flow Chart User Modules and the PSoC Development ProcessDevice Editor Application EditorTable of Contents Document ConventionsPin Information Pinouts1 8-Pin Part Pinout 2 20-Pin Part PinoutCY8C22x13 Final Data Sheet Pin Information 3 32-Pin Part PinoutPin Part Pinout MLF CY8C22213 PSoC DeviceRegister Reference Register ConventionsRegister Mapping Tables Abbreviations UsedCY8C22x13 Final Data Sheet2. Register Reference Name Addr 0,Hex AccessBlank fields are Reserved and should not be accessed Register Map Bank 0 Table User SpaceRegister Map Bank 1 Table Configuration Space Name Addr 1,Hex AccessElectrical Specifications Symbol Unit of MeasureUnits of Measure Vdd VoltageOperating Temperature CY8C22x13 Final Data Sheet Electrical SpecificationsOperating Temperature Absolute Maximum RatingsDC Electrical Characteristics DC Chip-Level SpecificationsDC General Purpose IO Specifications DC Chip-Level SpecificationsPsrr OA DC Operational Amplifier SpecificationsV DC Operational Amplifier Specifications Psrroa DC Analog Output Buffer Specifications V DC Analog Output Buffer Specifications3V DC Analog Output Buffer Specifications Psrr OBDC Analog Reference Specifications DC Analog PSoC Block Specifications10 V DC Analog Reference Specifications 11 .3V DC Analog Reference SpecificationsDC POR and LVD Specifications 13. DC POR and LVD SpecificationsDC Programming Specifications 14. DC Programming Specifications15. AC Chip-Level Specifications AC Electrical CharacteristicsAC Chip-Level Specifications Tpllslewlow TOSAC General Purpose IO Specifications 16. AC Gpio SpecificationsBW OA AC Operational Amplifier Specifications17 V AC Operational Amplifier Specifications Bwoa Function Description Min Typ Max Units AC Digital Block Specifications19. AC Digital Block Specifications AC Analog Output Buffer Specifications 20 V AC Analog Output Buffer Specifications21 .3V AC Analog Output Buffer Specifications BW OBAC External Clock Specifications AC Programming Specifications22 V AC External Clock Specifications 23 .3V AC External Clock SpecificationsAC I2C Specifications 25. AC Characteristics of the I2C SDA and SCL PinsStandard Mode Fast Mode Symbol Description Min Max Units TLOWI2C TSUDATI2CPackaging Dimensions Packaging InformationLead 150-Mil Soic Lead 300-Mil Molded DIP June 3 Document No -12009 Rev. *ELead 210-Mil Ssop Capacitance on Crystal Pins Typical Package Capacitance on Crystal PinsThermal Impedances Thermal Impedances per PackageOrdering Information Ordering Code DefinitionsCY 8 C 22 xxx-SPxx RowsCY8C22x13 Data Sheet Revision History Sales and Company InformationRevision History Copyrights