Cypress CY8C22113, CY8C22213 manual Capacitance on Crystal Pins, Thermal Impedances per Package

CY8C22x13 Final Data Sheet 4. Packaging Information

X = 138 MIL

Y = 138 MIL

32

51-85188 - **

Figure 4-6. 32-Lead (5x5 mm) MLF

4.2Thermal Impedances

Table 4-1. Thermal Impedances per Package

Package	Typical θJA *
8 PDIP	123 oC/W
8 SOIC	185 oC/W
20 PDIP	109 oC/W
20 SSOP	117 oC/W
20 SOIC	81 oC/W
32 MLF	22 oC/W
* TJ = TA + POWER x θJA

4.3Capacitance on Crystal Pins

Table 4-2: Typical Package Capacitance on Crystal Pins

Package	Package Capacitance
8 PDIP	2.8 pF
8 SOIC	2.0 pF
20 PDIP	3.0 pF
20 SSOP	2.6 pF
20 SOIC	2.5 pF
32 MLF	2.0 pF

June 3, 2004 Document No. 38-12009 Rev. *E 34

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