Lead 210-Mil Ssop | Cypress CY8C22213, CY8C22113 specs

CY8C22x13 Final Data Sheet

4. Packaging Information

51-85077 - *C

Figure 4-4. 20-Lead (210-Mil) SSOP

		51-85024 - *B
	Figure 4-5. 20-Lead (300-Mil) Molded SOIC

June 3, 2004	Document No. 38-12009 Rev. *E	33

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Cypress CY8C22213, CY8C22113 manual Lead 210-Mil Ssop

Contents

PSoC Functional Overview FeaturesPSoC Core June Cypress MicroSystems, Inc Document No -12009 Rev. *E Digital System Block Diagram CY8C22x13 Final Data Sheet PSoC OverviewDigital System Analog System Analog System Block Diagram PSoC Device CharacteristicsPSoC Device Characteristics Additional System Resources Getting Started Development ToolsPSoC Designer Subsystems June 3 Document No -12009 Rev. *E PSoC Designer Software Subsystems Hardware ToolsPSoC Development Tool Kit June 3 Document No -12009 Rev. *E User Modules and the PSoC Development Process User Modules and Development Process Flow ChartDevice Editor Application Editor Document Conventions Table of Contents Pinouts Pin Information1 8-Pin Part Pinout 2 20-Pin Part Pinout 3 32-Pin Part Pinout CY8C22x13 Final Data Sheet Pin InformationPin Part Pinout MLF CY8C22213 PSoC Device Register Conventions Register ReferenceRegister Mapping Tables Abbreviations Used Name Addr 0,Hex Access CY8C22x13 Final Data Sheet2. Register ReferenceBlank fields are Reserved and should not be accessed Register Map Bank 0 Table User Space Name Addr 1,Hex Access Register Map Bank 1 Table Configuration Space Symbol Unit of Measure Electrical SpecificationsUnits of Measure Vdd Voltage CY8C22x13 Final Data Sheet Electrical Specifications Operating TemperatureOperating Temperature Absolute Maximum Ratings DC Chip-Level Specifications DC Electrical CharacteristicsDC General Purpose IO Specifications DC Chip-Level Specifications DC Operational Amplifier Specifications V DC Operational Amplifier SpecificationsPsrr OA Psrroa V DC Analog Output Buffer Specifications DC Analog Output Buffer Specifications3V DC Analog Output Buffer Specifications Psrr OB DC Analog PSoC Block Specifications DC Analog Reference Specifications10 V DC Analog Reference Specifications 11 .3V DC Analog Reference Specifications 13. DC POR and LVD Specifications DC POR and LVD Specifications 14. DC Programming Specifications DC Programming Specifications AC Electrical Characteristics AC Chip-Level Specifications15. AC Chip-Level Specifications TOS Tpllslewlow 16. AC Gpio Specifications AC General Purpose IO Specifications AC Operational Amplifier Specifications 17 V AC Operational Amplifier SpecificationsBW OA Bwoa AC Digital Block Specifications 19. AC Digital Block SpecificationsFunction Description Min Typ Max Units 20 V AC Analog Output Buffer Specifications AC Analog Output Buffer Specifications21 .3V AC Analog Output Buffer Specifications BW OB AC Programming Specifications AC External Clock Specifications22 V AC External Clock Specifications 23 .3V AC External Clock Specifications 25. AC Characteristics of the I2C SDA and SCL Pins AC I2C SpecificationsStandard Mode Fast Mode Symbol Description Min Max Units TLOWI2C TSUDATI2C Packaging Information Packaging Dimensions Lead 300-Mil Molded DIP June 3 Document No -12009 Rev. *E Lead 150-Mil Soic Lead 210-Mil Ssop Typical Package Capacitance on Crystal Pins Capacitance on Crystal PinsThermal Impedances Thermal Impedances per Package Ordering Code Definitions Ordering InformationCY 8 C 22 xxx-SPxx Rows Sales and Company Information CY8C22x13 Data Sheet Revision HistoryRevision History Copyrights

Figure 4-4. 20-Lead (210-Mil) SSOP

Figure 4-5. 20-Lead (300-Mil) Molded SOIC

June 3, 2004

Document No. 38-12009 Rev. *E