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Cypress CY8C22213 4. 20-Lead 210-Mil SSOP, 5. 20-Lead 300-Mil Molded SOIC, Packaging Information

Models: CY8C22213 CY8C22113

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CY8C22x13 Final Data Sheet

4. Packaging Information

51-85077 - *C

Figure 4-4. 20-Lead (210-Mil) SSOP

		51-85024 - *B
	Figure 4-5. 20-Lead (300-Mil) Molded SOIC

June 3, 2004	Document No. 38-12009 Rev. *E	33

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Page 33

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Cypress CY8C22213 4. 20-Lead 210-Mil SSOP, 5. 20-Lead 300-Mil Molded SOIC, CY8C22x13 Final Data Sheet, June 3, + Feedback

Contents

PSoC Functional Overview FeaturesThe PSoC Core JuneDigital System Block Diagram CY8C22x13 Final Data SheetThe Digital System The Analog SystemAnalog System Block Diagram PSoC Device CharacteristicsPSoC Device Characteristics Additional System ResourcesDevelopment Tools Getting StartedDevelopment Kits Tele-TrainingHardware Tools PSoC Designer Software SubsystemsPSoC Development Tool Kit CY8C22x13 Final Data SheetUser Modules and the PSoC Development Process User Modules and Development Process Flow ChartDevice Editor Application Editor3. Electrical Specifications Table of ContentsDocument Conventions Acronyms Used1.1 Pinouts 1. Pin Information1.1.1 8-Pin Part Pinout 1.1.2 20-Pin Part PinoutTable 1-3. 32-Pin Part Pinout MLF 1.1.3 32-Pin Part PinoutCY8C22213 PSoC Device CY8C22x13 Final Data Sheet2.1 Register Conventions 2. Register Reference2.2 Register Mapping Tables 2.1.1 Abbreviations UsedRegister Map Bank 0 Table User Space CY8C22x13 Final Data Sheet2. Register ReferenceDocument No. 38-12009 Rev. *E June 3CY8C22x13 Final Data Sheet2. Register Reference Register Map Bank 1 Table Configuration SpaceJune 3 Document No. 38-12009 Rev. *E3. Electrical Specifications R r dCPU Frequency Table 3-3. Operating Temperature 3.2 Operating Temperature3.1 Absolute Maximum Ratings Table 3-2. Absolute Maximum Ratings3.3.1 DC Chip-Level Specifications 3.3 DC Electrical Characteristics3.3.2 DC General Purpose IO Specifications Table 3-4. DC Chip-Level SpecificationsTable 3-6. 5V DC Operational Amplifier Specifications 3.3.3 DC Operational Amplifier SpecificationsCY8C22x13 Final Data Sheet 3. Electrical SpecificationsCY8C22x13 Final Data Sheet Table 3-7. 3.3V DC Operational Amplifier Specifications3. Electrical Specifications June 3Table 3-8. 5V DC Analog Output Buffer Specifications 3.3.4 DC Analog Output Buffer SpecificationsTable 3-9. 3.3V DC Analog Output Buffer Specifications CY8C22x13 Final Data Sheet3.3.6 DC Analog PSoC Block Specifications 3.3.5 DC Analog Reference SpecificationsTable 3-10. 5V DC Analog Reference Specifications Table 3-11. 3.3V DC Analog Reference SpecificationsTable 3-13. DC POR and LVD Specifications 3.3.7 DC POR and LVD SpecificationsCY8C22x13 Final Data Sheet 3. Electrical SpecificationsTable 3-14. DC Programming Specifications 3.3.8 DC Programming SpecificationsCY8C22x13 Final Data Sheet 3. Electrical Specifications3.4.1 AC Chip-Level Specifications 3.4 AC Electrical CharacteristicsTable 3-15. AC Chip-Level Specifications Figure 3-2. PLL Lock Timing DiagramFigure 3-4. External Crystal Oscillator Startup Timing Diagram Figure 3-3. PLL Lock for Low Gain Setting Timing DiagramFigure 3-5. 24 MHz Period Jitter IMO Timing Diagram Figure 3-6. 32 kHz Period Jitter ECO Timing DiagramTable 3-16. AC GPIO Specifications 3.4.2 AC General Purpose IO SpecificationsFigure 3-7. GPIO Timing Diagram CY8C22x13 Final Data SheetTable 3-17. 5V AC Operational Amplifier Specifications 3.4.3 AC Operational Amplifier SpecificationsCY8C22x13 Final Data Sheet 3. Electrical SpecificationsCY8C22x13 Final Data Sheet Table 3-18. 3.3V AC Operational Amplifier Specifications3. Electrical Specifications June 3Table 3-19. AC Digital Block Specifications 3.4.4 AC Digital Block SpecificationsCY8C22x13 Final Data Sheet 3. Electrical SpecificationsTable 3-20. 5V AC Analog Output Buffer Specifications 3.4.5 AC Analog Output Buffer SpecificationsTable 3-21. 3.3V AC Analog Output Buffer Specifications CY8C22x13 Final Data Sheet3.4.7 AC Programming Specifications 3.4.6 AC External Clock SpecificationsTable 3-22. 5V AC External Clock Specifications Table 3-23. 3.3V AC External Clock SpecificationsTable 3-25. AC Characteristics of the I2C SDA and SCL Pins 3.4.8 AC I2C SpecificationsCY8C22x13 Final Data Sheet 3. Electrical Specifications4. Packaging Information 4.1 Packaging DimensionsFigure 4-1. 8-Lead 300-Mil PDIP Cypress MicroSystems, Inc. 2003 - Document No. 38-12009 Rev. *EFigure 4-3. 20-Lead 300-Mil Molded DIP Figure 4-2. 8-Lead 150-Mil SOICCY8C22x13 Final Data Sheet 4. Packaging InformationFigure 4-5. 20-Lead 300-Mil Molded SOIC Figure 4-4. 20-Lead 210-Mil SSOPCY8C22x13 Final Data Sheet 4. Packaging InformationTable 4-2 Typical Package Capacitance on Crystal Pins 4.3 Capacitance on Crystal Pins4.2 Thermal Impedances Figure 4-6. 32-Lead 5x5 mm MLF5.1 Ordering Code Definitions 5. Ordering InformationCY 8 C 22 xxx-SPxx June 36. Sales and Company Information Table 6-1. CY8C22x13 Data Sheet Revision History6.1 Revision History 6.2 Copyrights

Figure 4-4. 20-Lead (210-Mil) SSOP

51-85024 - *B

Figure 4-5. 20-Lead (300-Mil) Molded SOIC