ProCurve Secure Router Installation Guide

Option Modules

 

 

1xE1 + G.703 Drop and Insert Interface Module

The 1xE1 + G.703 Drop and Insert Interface Module (see Figure 9) provides a single E1 interface

(2.043 Mbps) with user-selectable TS0 assignment and a G.703 drop port which may be used to drop and insert traffic to an E1 PBX. Refer to Table A-4 on page 44 for the E1 pinouts. Refer to Table A-6 on page 45 for the G.703 pinouts. Refer to Table A-12 on page 47 for the backup connector pinouts. An optional backup module is required for backup applications.

Figure 9. 1xE1 + G.703 Drop and Insert Interface Module

Features and Specifications

 

Operating Modes

Diagnostics

•E1/ FE1 Frame Relay/Multilink Frame Relay

•E1/FE1 PPP/Multilink PPP

•E1/FE1 HDLC

E1 Interface

•Supported Standards: ITU-T G.703, ITU-T G.704 (CRC-4), ITU-T G.797, ITU-T G.823

•Line Rate: 2.048 Mbps +50 PPM

•Line Code: AMI or HDB3

•Framing: FAS with optional CRC-4

•FE1 Line Rate: Channelized timeslot (in multiples of 56/64 kbps)

•Receiver Sensitivity: -30 dB

•Connector: RJ-48C

G.703 Interface

•Line Interface: Per ITU-T G.703

•Line Rate: 2.048 Mbps ± 50 PPM

•Line Code: AMI or HDB3

•Framing: FAS with optional CRC-4

•Capacity: 1 to 31 timeslots

•Receiver Sensitivity: -30 dB

•Connector: RJ-48C

Clock Source

•Network

•Internal

•Through

•Test Pattern Generation and Detection: QRSS, 511, all ones, all zeros

•Network loopbacks

•Alarm generation and detection

•Network performance data (15 minutes and 24 hours)

Compliance

•ACIF S016, ETSI TBR 12/TBR 13

•EN 60950, AS/NZS 60950

•EMC - see Electromagnetic Compatibility (EMC) Table on page 62

Environmental

•Operating temperature: 0°C to 50°C (32°F to 122°F)

•Non-Operating Temperature: -20°C to 70°C (-4°F to 158°F)

•Relative Humidity: Up to 95 percent noncondensing at 30°C (86°F)

•Non-Operating Relative Humidity: Up to 95 percent noncondensing at 30°C (86°F)

•Altitude: Up to 3.05 km (10,000 ft)

Physical

•Dimensions: 6.99 cm (2.75 in) W x 10.80 cm (4.25 in) D

5990-3760

Copyright 2006 Hewlett-Packard Development Company, LP

23