2.Following the 1, 2, 3, 4 sequence stamped into the heat sink, loosen the four captive Philllips screws (1) (4) that secure the heat sink to the system board, and then remove the heat sink (5).

NOTE: Due to the adhesive quality of the thermal material located between the heat sink and the system board components, it may be necessary to move the heat sink from side to side to detach it.

3.The following illustrations show the replacement thermal material locations. The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components

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HP 840 G1 manual Component replacement procedures