Manuals / Intel / Computer Equipment / Computer Hardware

Intel E8501 manual 3Thermal Specifications, 3.1Thermal Design Power TDP

Models: E8501

1 54

Download 54 pages 42.29 Kb

Page 15

3Thermal Specifications

3Thermal Specifications

3.1Thermal Design Power (TDP)

Analysis indicates that real applications are unlikely to cause the E8500/E8501 chipset NB/XMB components to consume maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more realistic power level for thermal design purposes, Intel characterizes power consumption based on known platform benchmark applications. The resulting power consumption is referred to as the Thermal Design Power (TDP). TDP is the target power level that the thermal solutions should be designed to. TDP is not the maximum power that the chipset can dissipate.

For TDP specifications, see Table 3-1for the E8500 chipset NB component, Table 3-2for the E8501 chipset NB component, Table 3-3for the E8500 chipset XMB component and Table 3-4for the E85001 chipset XMB component FC-BGA packages have poor heat transfer capability into the board and have minimal thermal capability without a thermal solution. Intel recommends that system designers plan for one or more heatsinks when using the E8500/E8501 chipsets NB/XMB components.

3.2Die Case Temperature Specifications

To ensure proper operation and reliability of the E8500/E8501 chipset NB/XMB components, the die temperatures must be at or between the maximum/minimum operating temperature ranges as specified in Table 3-1, Table 3-2, Table 3-3and Table 3-4. System and/or component level thermal solutions are required to maintain these temperature specifications. Refer to Section 5 for guidelines on accurately measuring package die temperatures.

Table 3-1. Intel® E8500 Chipset NB Thermal Specifications

Parameter	Value	Notes

Tcase_max	104°C
Tcase_min	5°C
TDPwith 1 XMB attached	17.9W
TDPwith 2 XMBs attached	19.8W
TDPwith 3 XMBs attached	22.4W
TDPwith 4 XMBs attached	24.5W

NOTE:

1.These specifications are based on silicon characterization, however, they may be updated as further data becomes available.

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory	15
Bridge (XMB) Thermal/Mechanical Design Guide

Image 15

Intel E8501 manual 3Thermal Specifications, 3.1Thermal Design Power TDP, 3.2Die Case Temperature Specifications

Contents

Bridge NB and eXternal Memory Bridge XMB Thermal/Mechanical Design GuideDocument Number Intel E8500/E8501 Chipset NorthBridge XMB Thermal/Mechanical Design Guide Contents Bridge XMB Thermal/Mechanical Design Guide Thermal Solution Component SuppliersFigures Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide TablesRevision Revision HistoryBridge XMB Thermal/Mechanical Design Guide Document1.1Design Flow 1Introduction1.2Definition of Terms IntroductionFigure 1-1.Thermal Design Process 1.3Reference Documents •Intel E8501 Chipset North Bridge NB Datasheet•Intel E8500 Chipset North Bridge NB Datasheet •BGA/OLGA Assembly Development GuideBridge XMB Thermal/Mechanical Design Guide Introduction2Packaging Technology Figure 2-1.NB Package Dimensions Top ViewFigure 2-2.NB Package Dimensions Side View NOTES Packaging TechnologyFigure 2-3.NB Package Dimensions Bottom View Bridge XMB Thermal/Mechanical Design GuideBridge XMB Thermal/Mechanical Design Guide Figure 2-4.XMB Package Dimensions Top ViewFigure 2-5.XMB Package Dimensions Side View Packaging TechnologyNotes 2.1Package Mechanical RequirementsFigure 2-6.XMB Package Dimensions Bottom View Packaging Technology3Thermal Specifications 3.1Thermal Design Power TDP3.2Die Case Temperature Specifications Thermal Specifications 4Thermal Simulation Bridge XMB Thermal/Mechanical Design Guide Thermal Simulation5Thermal Metrology 5.1Die Case Temperature MeasurementsFigure 5-1.Thermal Solution Decision Flowchart Thermal MetrologyThermal Metrology 5.2Power Simulation SoftwareBridge XMB Thermal/Mechanical Design Guide Thermal Metrology6NB Reference Thermal Solution #1 6.1Operating Environment6.2Heatsink Performance 6.3Mechanical Design Envelope NB Reference Thermal Solution #1Heatsink 6.4Board-LevelComponents Keepout DimensionsMotherboard NB Reference Thermal Solution #16.5First NB Heatsink Thermal Solution Assembly TNBLocationNB Reference Thermal Solution #1 6.5.4Thermal Interface Material 6.5.1Heatsink Orientation6.5.2Extruded Heatsink Profiles 6.5.3Mechanical Interface Material6.5.5Heatsink Retaining Fastener NB Reference Thermal Solution #1Figure 6-5.First NB Heatsink Extrusion Profile Test 6.6Reliability GuidelinesNB Reference Thermal Solution #1 Bridge XMB Thermal/Mechanical Design GuideBridge XMB Thermal/Mechanical Design Guide NB Reference Thermal Solution #17NB Reference Thermal Solution #2 7.1Operating Environment7.2Heatsink Performance 7.3Mechanical Design Envelope NB Reference Thermal Solution #2Motherboard 7.4Board-LevelComponents Keepout Dimensions7.5Second NB Heatsink Thermal Solution Assembly NB Reference Thermal Solution #27.5.4Thermal Interface Material 7.5.1Heatsink Orientation7.5.2Extruded Heatsink Profiles 7.5.3Mechanical Interface MaterialBridge XMB Thermal/Mechanical Design Guide 7.6Reliability GuidelinesNB Reference Thermal Solution #2 Please refer to Section 6.6 for detail §Bridge XMB Thermal/Mechanical Design Guide NB Reference Thermal Solution #28XMB Reference Thermal Solution 8.1Operating Environment8.2Heatsink Performance 8.3Mechanical Design Envelope 8.4Board-LevelComponents Keepout Dimensions8.5XMB Heatsink Thermal Solution Assembly XMB Reference Thermal Solution8.5.1Heatsink Orientation XMB LocationXMB Reference Thermal Solution 8.5.5Heatsink Retaining Fastener 8.5.2Extruded Heatsink Profiles8.5.3Mechanical Interface Material 8.5.4Thermal Interface MaterialBridge XMB Thermal/Mechanical Design Guide 8.6Reliability GuidelinesXMB Reference Thermal Solution Figure 8-5.XMB Heatsink Extrusion ProfileBridge XMB Thermal/Mechanical Design Guide XMB Reference Thermal SolutionIntel Part Number AThermal Solution Component SuppliersBridge XMB Thermal/Mechanical Design Guide PartIntel Part Number Thermal Solution Component SuppliersBridge XMB Thermal/Mechanical Design Guide PartIntel Part Number Thermal Solution Component SuppliersBridge XMB Thermal/Mechanical Design Guide PartBridge XMB Thermal/Mechanical Design Guide Thermal Solution Component SuppliersDrawing Description B Mechanical DrawingsTable B-1.Mechanical Drawing List Bridge XMB Thermal/Mechanical Design GuideMechanical Drawings Figure B-1.NB Heatsink #1 Assembly DrawingBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Figure B-2.NB Heatsink #1 DrawingBridge XMB Thermal/Mechanical Design Guide Figure B-3.NB Heatsink #2 Assembly Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Figure B-4.NB Heatsink #2 DrawingBridge XMB Thermal/Mechanical Design Guide Figure B-5.XMB Heatsink Assembly Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Figure B-6.XMB Heatsink DrawingBridge XMB Thermal/Mechanical Design Guide Bridge XMB Thermal/Mechanical Design Guide Mechanical Drawings