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Intel E8501 manual 7.4Board-LevelComponents Keepout Dimensions, Motherboard

Models: E8501

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7.4Board-Level Components Keepout Dimensions

NB Reference Thermal Solution #2

Figure 7-2. Second NB Reference Heatsink Volumetric Envelope

Heatsink				mm.
Fin				mm.
Fin				55.09
		4 mm.	4.29 mm.	55.09
Heatsink Base
IHS + TIM2
FCBGA
Motherboard
64.52 mm.
42.50 mm.
Heatsink Base
Heatsink	mm.	64.52 mm.
Fin	40.50
	40.50

7.4Board-Level Components Keepout Dimensions

Please refer to Section 6.4 for detail.

7.5Second NB Heatsink Thermal Solution Assembly

The reference thermal solution for the chipset NB component is a passive extruded heatsink with thermal interlace. It is attached to the board by using four retaining Tuflok fasteners. Figure 7-3shows the reference thermal solution assembly and associated components.

Full mechanical drawings of the thermal solution assembly and the heatsink are provided in Appendix B. Appendix A contains vendor information for each thermal solution component.

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory	33
Bridge (XMB) Thermal/Mechanical Design Guide

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Intel E8501 7.4Board-LevelComponents Keepout Dimensions, 7.5Second NB Heatsink Thermal Solution Assembly, Motherboard

Contents

Document Number Thermal/Mechanical Design GuideIntel E8500/E8501 Chipset North Bridge NB and eXternal Memory Bridge XMBBridge XMB Thermal/Mechanical Design Guide Contents Figures Thermal Solution Component SuppliersMechanical Drawings Bridge XMB Thermal/Mechanical Design GuideBridge XMB Thermal/Mechanical Design Guide TablesBridge XMB Thermal/Mechanical Design Guide Revision HistoryDocument Revision1.1Design Flow 1Introduction1.2Definition of Terms IntroductionFigure 1-1.Thermal Design Process •Intel E8500 Chipset North Bridge NB Datasheet •Intel E8501 Chipset North Bridge NB Datasheet•BGA/OLGA Assembly Development Guide 1.3Reference DocumentsBridge XMB Thermal/Mechanical Design Guide Introduction2Packaging Technology Figure 2-1.NB Package Dimensions Top ViewFigure 2-2.NB Package Dimensions Side View Figure 2-3.NB Package Dimensions Bottom View Packaging TechnologyBridge XMB Thermal/Mechanical Design Guide NOTESFigure 2-5.XMB Package Dimensions Side View Figure 2-4.XMB Package Dimensions Top ViewPackaging Technology Bridge XMB Thermal/Mechanical Design GuideFigure 2-6.XMB Package Dimensions Bottom View 2.1Package Mechanical RequirementsPackaging Technology Notes3Thermal Specifications 3.1Thermal Design Power TDP3.2Die Case Temperature Specifications Thermal Specifications 4Thermal Simulation Bridge XMB Thermal/Mechanical Design Guide Thermal Simulation5Thermal Metrology 5.1Die Case Temperature MeasurementsFigure 5-1.Thermal Solution Decision Flowchart Thermal MetrologyThermal Metrology 5.2Power Simulation SoftwareBridge XMB Thermal/Mechanical Design Guide Thermal Metrology6NB Reference Thermal Solution #1 6.1Operating Environment6.2Heatsink Performance 6.3Mechanical Design Envelope NB Reference Thermal Solution #1Motherboard 6.4Board-LevelComponents Keepout DimensionsNB Reference Thermal Solution #1 Heatsink6.5First NB Heatsink Thermal Solution Assembly TNBLocationNB Reference Thermal Solution #1 6.5.2Extruded Heatsink Profiles 6.5.1Heatsink Orientation6.5.3Mechanical Interface Material 6.5.4Thermal Interface Material6.5.5Heatsink Retaining Fastener NB Reference Thermal Solution #1Figure 6-5.First NB Heatsink Extrusion Profile NB Reference Thermal Solution #1 6.6Reliability GuidelinesBridge XMB Thermal/Mechanical Design Guide TestBridge XMB Thermal/Mechanical Design Guide NB Reference Thermal Solution #17NB Reference Thermal Solution #2 7.1Operating Environment7.2Heatsink Performance 7.3Mechanical Design Envelope NB Reference Thermal Solution #27.5Second NB Heatsink Thermal Solution Assembly 7.4Board-LevelComponents Keepout DimensionsNB Reference Thermal Solution #2 Motherboard7.5.2Extruded Heatsink Profiles 7.5.1Heatsink Orientation7.5.3Mechanical Interface Material 7.5.4Thermal Interface MaterialNB Reference Thermal Solution #2 7.6Reliability GuidelinesPlease refer to Section 6.6 for detail § Bridge XMB Thermal/Mechanical Design GuideBridge XMB Thermal/Mechanical Design Guide NB Reference Thermal Solution #28XMB Reference Thermal Solution 8.1Operating Environment8.2Heatsink Performance 8.5XMB Heatsink Thermal Solution Assembly 8.4Board-LevelComponents Keepout DimensionsXMB Reference Thermal Solution 8.3Mechanical Design Envelope8.5.1Heatsink Orientation XMB LocationXMB Reference Thermal Solution 8.5.3Mechanical Interface Material 8.5.2Extruded Heatsink Profiles8.5.4Thermal Interface Material 8.5.5Heatsink Retaining FastenerXMB Reference Thermal Solution 8.6Reliability GuidelinesFigure 8-5.XMB Heatsink Extrusion Profile Bridge XMB Thermal/Mechanical Design GuideBridge XMB Thermal/Mechanical Design Guide XMB Reference Thermal SolutionBridge XMB Thermal/Mechanical Design Guide AThermal Solution Component SuppliersPart Intel Part NumberBridge XMB Thermal/Mechanical Design Guide Thermal Solution Component SuppliersPart Intel Part NumberBridge XMB Thermal/Mechanical Design Guide Thermal Solution Component SuppliersPart Intel Part NumberBridge XMB Thermal/Mechanical Design Guide Thermal Solution Component SuppliersTable B-1.Mechanical Drawing List B Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Drawing DescriptionMechanical Drawings Figure B-1.NB Heatsink #1 Assembly DrawingBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Figure B-2.NB Heatsink #1 DrawingBridge XMB Thermal/Mechanical Design Guide Figure B-3.NB Heatsink #2 Assembly Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Figure B-4.NB Heatsink #2 DrawingBridge XMB Thermal/Mechanical Design Guide Figure B-5.XMB Heatsink Assembly Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Figure B-6.XMB Heatsink DrawingBridge XMB Thermal/Mechanical Design Guide Bridge XMB Thermal/Mechanical Design Guide Mechanical Drawings