![Thermal Specifications](/images/new-backgrounds/103201/10320131x1.webp)
Thermal Specifications
Table
Parameter | Value | Notes |
|
|
|
Tcase_max | 104°C |
|
Tcase_min | 5°C |
|
TDPwith 1 XMB attached | 26.0 W |
|
TDPwith 2 XMBs attached | 28.2 W |
|
TDPwith 3 XMBs attached | 30.4 W |
|
TDPwith 4 XMBs attached | 32.6 W |
|
Table
Parameter | Value | Notes |
|
|
|
Tcase_max | 105°C |
|
Tcase_min | 5°C |
|
TDPdual channel | 11.1 W |
NOTE:
1.These specifications are based on silicon characterization, however, they may be updated as further data becomes available.
Table
Parameter | Value | Notes |
|
|
|
Tcase_max | 105°C |
|
Tcase_min | 5°C |
|
TDPdual channel | 12.1W |
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16 | Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory |
| Bridge (XMB) Thermal/Mechanical Design Guide |