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Intel E8501 manual 6.5.1Heatsink Orientation, 6.5.2Extruded Heatsink Profiles

Models: E8501

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6.5.1Heatsink Orientation

NB Reference Thermal Solution #1

6.5.1Heatsink Orientation

Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned with the direction of the heatsink fins.

Figure 6-4. First NB Heatsink Assembly

6.5.2Extruded Heatsink Profiles

The reference NB thermal solution uses an extruded heatsink for cooling the chipset NB.

Figure 6-5shows the heatsink profile. Appendix A lists a supplier for this extruded heatsink. Other heatsinks with similar dimensions and increased thermal performance may be available. Full mechanical drawing of this heatsink is provided in Appendix B.

6.5.3Mechanical Interface Material

There is no mechanical interface material associated with this reference solution.

6.5.4Thermal Interface Material

A TIM provides improved conductivity between the die and heatsink. The reference thermal solution uses Chomerics THERMFLOW* T710, 0.127 mm (0.005 in.) thick, 38.5 mm x 38.5 mm (1.5 in. x 1.5 in.) square.

Note: Unflowed or “dry” Chomerics THERMFLOW T710 has a material thickness of 0.005 inch. The flowed or “wet” Chomerics THERMFLOW T710 has a material thickness of ~0.0025 inch after it reaches its phase change temperature.

6.5.4.1Effect of Pressure on TIM Performance

As mechanical pressure increases on the TIM, the thermal resistance of the TIM decreases. This phenomenon is due to the decrease of the bond line thickness (BLT). BLT is the final settled thickness of the thermal interface material after installation of heatsink. The effect of pressure on

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory	27
Bridge (XMB) Thermal/Mechanical Design Guide

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Intel E8501 manual 6.5.1Heatsink Orientation, 6.5.2Extruded Heatsink Profiles, 6.5.3Mechanical Interface Material

Contents

Bridge NB and eXternal Memory Bridge XMB Thermal/Mechanical Design GuideDocument Number Intel E8500/E8501 Chipset NorthBridge XMB Thermal/Mechanical Design Guide Contents Bridge XMB Thermal/Mechanical Design Guide Thermal Solution Component SuppliersFigures Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide TablesRevision Revision HistoryBridge XMB Thermal/Mechanical Design Guide Document1.1Design Flow 1Introduction1.2Definition of Terms IntroductionFigure 1-1.Thermal Design Process 1.3Reference Documents •Intel E8501 Chipset North Bridge NB Datasheet•Intel E8500 Chipset North Bridge NB Datasheet •BGA/OLGA Assembly Development GuideBridge XMB Thermal/Mechanical Design Guide Introduction2Packaging Technology Figure 2-1.NB Package Dimensions Top ViewFigure 2-2.NB Package Dimensions Side View NOTES Packaging TechnologyFigure 2-3.NB Package Dimensions Bottom View Bridge XMB Thermal/Mechanical Design GuideBridge XMB Thermal/Mechanical Design Guide Figure 2-4.XMB Package Dimensions Top ViewFigure 2-5.XMB Package Dimensions Side View Packaging TechnologyNotes 2.1Package Mechanical RequirementsFigure 2-6.XMB Package Dimensions Bottom View Packaging Technology3Thermal Specifications 3.1Thermal Design Power TDP3.2Die Case Temperature Specifications Thermal Specifications 4Thermal Simulation Bridge XMB Thermal/Mechanical Design Guide Thermal Simulation5Thermal Metrology 5.1Die Case Temperature MeasurementsFigure 5-1.Thermal Solution Decision Flowchart Thermal MetrologyThermal Metrology 5.2Power Simulation SoftwareBridge XMB Thermal/Mechanical Design Guide Thermal Metrology6NB Reference Thermal Solution #1 6.1Operating Environment6.2Heatsink Performance 6.3Mechanical Design Envelope NB Reference Thermal Solution #1Heatsink 6.4Board-LevelComponents Keepout DimensionsMotherboard NB Reference Thermal Solution #16.5First NB Heatsink Thermal Solution Assembly TNBLocationNB Reference Thermal Solution #1 6.5.4Thermal Interface Material 6.5.1Heatsink Orientation6.5.2Extruded Heatsink Profiles 6.5.3Mechanical Interface Material6.5.5Heatsink Retaining Fastener NB Reference Thermal Solution #1Figure 6-5.First NB Heatsink Extrusion Profile Test 6.6Reliability GuidelinesNB Reference Thermal Solution #1 Bridge XMB Thermal/Mechanical Design GuideBridge XMB Thermal/Mechanical Design Guide NB Reference Thermal Solution #17NB Reference Thermal Solution #2 7.1Operating Environment7.2Heatsink Performance 7.3Mechanical Design Envelope NB Reference Thermal Solution #2Motherboard 7.4Board-LevelComponents Keepout Dimensions7.5Second NB Heatsink Thermal Solution Assembly NB Reference Thermal Solution #27.5.4Thermal Interface Material 7.5.1Heatsink Orientation7.5.2Extruded Heatsink Profiles 7.5.3Mechanical Interface MaterialBridge XMB Thermal/Mechanical Design Guide 7.6Reliability GuidelinesNB Reference Thermal Solution #2 Please refer to Section 6.6 for detail §Bridge XMB Thermal/Mechanical Design Guide NB Reference Thermal Solution #28XMB Reference Thermal Solution 8.1Operating Environment8.2Heatsink Performance 8.3Mechanical Design Envelope 8.4Board-LevelComponents Keepout Dimensions8.5XMB Heatsink Thermal Solution Assembly XMB Reference Thermal Solution8.5.1Heatsink Orientation XMB LocationXMB Reference Thermal Solution 8.5.5Heatsink Retaining Fastener 8.5.2Extruded Heatsink Profiles8.5.3Mechanical Interface Material 8.5.4Thermal Interface MaterialBridge XMB Thermal/Mechanical Design Guide 8.6Reliability GuidelinesXMB Reference Thermal Solution Figure 8-5.XMB Heatsink Extrusion ProfileBridge XMB Thermal/Mechanical Design Guide XMB Reference Thermal SolutionIntel Part Number AThermal Solution Component SuppliersBridge XMB Thermal/Mechanical Design Guide PartIntel Part Number Thermal Solution Component SuppliersBridge XMB Thermal/Mechanical Design Guide PartIntel Part Number Thermal Solution Component SuppliersBridge XMB Thermal/Mechanical Design Guide PartBridge XMB Thermal/Mechanical Design Guide Thermal Solution Component SuppliersDrawing Description B Mechanical DrawingsTable B-1.Mechanical Drawing List Bridge XMB Thermal/Mechanical Design GuideMechanical Drawings Figure B-1.NB Heatsink #1 Assembly DrawingBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Figure B-2.NB Heatsink #1 DrawingBridge XMB Thermal/Mechanical Design Guide Figure B-3.NB Heatsink #2 Assembly Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Figure B-4.NB Heatsink #2 DrawingBridge XMB Thermal/Mechanical Design Guide Figure B-5.XMB Heatsink Assembly Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Figure B-6.XMB Heatsink DrawingBridge XMB Thermal/Mechanical Design Guide Bridge XMB Thermal/Mechanical Design Guide Mechanical Drawings