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Intel E8501 manual 6.5First NB Heatsink Thermal Solution Assembly, TNBLocation

Models: E8501

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NB Reference Thermal Solution #1

6.5First NB Heatsink Thermal Solution Assembly

The reference thermal solution for the chipset NB component is a passive extruded heatsink with thermal interface. It is attached to the board by using four retaining Tuflok* fasteners. Figure 6-4shows the reference thermal solution assembly and associated components.

Full mechanical drawings of the thermal solution assembly and the heatsink are provided in Appendix B. Appendix A contains vendor information for each thermal solution component.

Figure 6-3. First NB Heatsink Board Component Keepout

4X Ø 5.5mm

64.500mm.

55.245mm.

42.500mm.

TNBLocation

42.500mm. 55.245mm. 64.500mm.

4X Ø 2.95 ± 0.0254mm

No Component Keep Out Area

4.14mm Max Component Height

Heatsink Mounting Hole

NOTE: All dimensions are in millimeters.

26	Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
	Bridge (XMB) Thermal/Mechanical Design Guide

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Intel E8501 manual 6.5First NB Heatsink Thermal Solution Assembly, TNBLocation, NB Reference Thermal Solution #1

Contents

Intel E8500/E8501 Chipset North Thermal/Mechanical Design GuideDocument Number Bridge NB and eXternal Memory Bridge XMBBridge XMB Thermal/Mechanical Design Guide Contents Mechanical Drawings Thermal Solution Component SuppliersFigures Bridge XMB Thermal/Mechanical Design GuideTables Bridge XMB Thermal/Mechanical Design GuideDocument Revision HistoryBridge XMB Thermal/Mechanical Design Guide Revision1Introduction 1.1Design FlowFigure 1-1.Thermal Design Process 1.2Definition of TermsIntroduction •BGA/OLGA Assembly Development Guide •Intel E8501 Chipset North Bridge NB Datasheet•Intel E8500 Chipset North Bridge NB Datasheet 1.3Reference DocumentsIntroduction Bridge XMB Thermal/Mechanical Design GuideFigure 2-2.NB Package Dimensions Side View 2Packaging TechnologyFigure 2-1.NB Package Dimensions Top View Bridge XMB Thermal/Mechanical Design Guide Packaging TechnologyFigure 2-3.NB Package Dimensions Bottom View NOTESPackaging Technology Figure 2-4.XMB Package Dimensions Top ViewFigure 2-5.XMB Package Dimensions Side View Bridge XMB Thermal/Mechanical Design GuidePackaging Technology 2.1Package Mechanical RequirementsFigure 2-6.XMB Package Dimensions Bottom View Notes3.2Die Case Temperature Specifications 3Thermal Specifications3.1Thermal Design Power TDP Thermal Specifications 4Thermal Simulation Thermal Simulation Bridge XMB Thermal/Mechanical Design Guide5.1Die Case Temperature Measurements 5Thermal MetrologyThermal Metrology Figure 5-1.Thermal Solution Decision Flowchart5.2Power Simulation Software Thermal MetrologyThermal Metrology Bridge XMB Thermal/Mechanical Design Guide6.2Heatsink Performance 6NB Reference Thermal Solution #16.1Operating Environment NB Reference Thermal Solution #1 6.3Mechanical Design EnvelopeNB Reference Thermal Solution #1 6.4Board-LevelComponents Keepout DimensionsMotherboard HeatsinkNB Reference Thermal Solution #1 6.5First NB Heatsink Thermal Solution AssemblyTNBLocation 6.5.3Mechanical Interface Material 6.5.1Heatsink Orientation6.5.2Extruded Heatsink Profiles 6.5.4Thermal Interface MaterialFigure 6-5.First NB Heatsink Extrusion Profile 6.5.5Heatsink Retaining FastenerNB Reference Thermal Solution #1 Bridge XMB Thermal/Mechanical Design Guide 6.6Reliability GuidelinesNB Reference Thermal Solution #1 TestNB Reference Thermal Solution #1 Bridge XMB Thermal/Mechanical Design Guide7.2Heatsink Performance 7NB Reference Thermal Solution #27.1Operating Environment NB Reference Thermal Solution #2 7.3Mechanical Design EnvelopeNB Reference Thermal Solution #2 7.4Board-LevelComponents Keepout Dimensions7.5Second NB Heatsink Thermal Solution Assembly Motherboard7.5.3Mechanical Interface Material 7.5.1Heatsink Orientation7.5.2Extruded Heatsink Profiles 7.5.4Thermal Interface MaterialPlease refer to Section 6.6 for detail § 7.6Reliability GuidelinesNB Reference Thermal Solution #2 Bridge XMB Thermal/Mechanical Design GuideNB Reference Thermal Solution #2 Bridge XMB Thermal/Mechanical Design Guide8.2Heatsink Performance 8XMB Reference Thermal Solution8.1Operating Environment XMB Reference Thermal Solution 8.4Board-LevelComponents Keepout Dimensions8.5XMB Heatsink Thermal Solution Assembly 8.3Mechanical Design EnvelopeXMB Reference Thermal Solution 8.5.1Heatsink OrientationXMB Location 8.5.4Thermal Interface Material 8.5.2Extruded Heatsink Profiles8.5.3Mechanical Interface Material 8.5.5Heatsink Retaining FastenerFigure 8-5.XMB Heatsink Extrusion Profile 8.6Reliability GuidelinesXMB Reference Thermal Solution Bridge XMB Thermal/Mechanical Design GuideXMB Reference Thermal Solution Bridge XMB Thermal/Mechanical Design GuidePart AThermal Solution Component SuppliersBridge XMB Thermal/Mechanical Design Guide Intel Part NumberPart Thermal Solution Component SuppliersBridge XMB Thermal/Mechanical Design Guide Intel Part NumberPart Thermal Solution Component SuppliersBridge XMB Thermal/Mechanical Design Guide Intel Part NumberThermal Solution Component Suppliers Bridge XMB Thermal/Mechanical Design GuideBridge XMB Thermal/Mechanical Design Guide B Mechanical DrawingsTable B-1.Mechanical Drawing List Drawing DescriptionBridge XMB Thermal/Mechanical Design Guide Mechanical DrawingsFigure B-1.NB Heatsink #1 Assembly Drawing Bridge XMB Thermal/Mechanical Design Guide Mechanical DrawingsFigure B-2.NB Heatsink #1 Drawing Bridge XMB Thermal/Mechanical Design Guide Figure B-3.NB Heatsink #2 Assembly DrawingMechanical Drawings Bridge XMB Thermal/Mechanical Design Guide Mechanical DrawingsFigure B-4.NB Heatsink #2 Drawing Bridge XMB Thermal/Mechanical Design Guide Figure B-5.XMB Heatsink Assembly DrawingMechanical Drawings Bridge XMB Thermal/Mechanical Design Guide Mechanical DrawingsFigure B-6.XMB Heatsink Drawing Mechanical Drawings Bridge XMB Thermal/Mechanical Design Guide