Intel E8501 manual 7.3Mechanical Design Envelope, NB Reference Thermal Solution #2

NB Reference Thermal Solution #2

Figure 7-1. Second NB Reference Heatsink Measured Thermal Performance vs. Approach Velocity

	2.3
	2
(°C/W)	1.7
	1.4
Ȍca	1.1
	0.8
	0.5
	0	100	200	300	400	500	600

Flow Rate (LFM)

7.3Mechanical Design Envelope

While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically placed on the E8500/E8501 chipset NB thermal solution are shown in Figure 7-2.

When using heatsinks that extend beyond the NB reference heatsink envelope shown in Figure 7-2, any motherboard components placed between the heatsink and motherboard cannot exceed

4.14 mm (0.16 in.) in height.

32	Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
	Bridge (XMB) Thermal/Mechanical Design Guide