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Intel E8501 manual 8.5.2Extruded Heatsink Profiles, 8.5.3Mechanical Interface Material

Models: E8501

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XMB Reference Thermal Solution

8.5.2Extruded Heatsink Profiles

The reference XMB thermal solution uses an extruded heatsink for cooling the chipset XMB. Figure 8-5shows the heatsink profile. Appendix A lists a supplier for this extruded heatsink. Other heatsinks with similar dimensions and increased thermal performance may be available. A full mechanical drawing of this heatsink is provided in Appendix B.

8.5.3Mechanical Interface Material

There is no mechanical interface material associated with this reference solution.

8.5.4Thermal Interface Material

A TIM provides improved conductivity between the die and the heatsink. The reference thermal solution uses Chomerics THERMFLOW T710, 0.127 mm (0.005 in.) thick, 17.8 mm x 17.8 mm (0.7 in. x 0.7 in.) square.

Note: Unflowed or “dry” Chomerics THERMFLOW T710 has a material thickness of 0.005 inch. The flowed or “wet” Chomerics THERMFLOW T710 has a material thickness of ~0.0025 inch after it reaches its phase change temperature.

8.5.4.1Effect of Pressure on TIM Performance

Please refer to Section 6.5.4.1 for detail.

8.5.5Heatsink Retaining Fastener

The reference solution uses four heatsink retaining Tufloks. The fasteners attached the heatsink to the motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting hole. These fasteners are intended to be used on a 0.062” thickness motherboard. See Appendix B for a mechanical drawing of the fastener.

40	Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
	Bridge (XMB) Thermal/Mechanical Design Guide

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Intel E8501 manual 8.5.2Extruded Heatsink Profiles, 8.5.3Mechanical Interface Material, 8.5.4Thermal Interface Material

Contents

Thermal/Mechanical Design Guide Document NumberIntel E8500/E8501 Chipset North Bridge NB and eXternal Memory Bridge XMBBridge XMB Thermal/Mechanical Design Guide Contents Thermal Solution Component Suppliers FiguresMechanical Drawings Bridge XMB Thermal/Mechanical Design GuideTables Bridge XMB Thermal/Mechanical Design GuideRevision History Bridge XMB Thermal/Mechanical Design GuideDocument Revision1Introduction 1.1Design FlowIntroduction 1.2Definition of TermsFigure 1-1.Thermal Design Process •Intel E8501 Chipset North Bridge NB Datasheet •Intel E8500 Chipset North Bridge NB Datasheet•BGA/OLGA Assembly Development Guide 1.3Reference DocumentsIntroduction Bridge XMB Thermal/Mechanical Design GuideFigure 2-1.NB Package Dimensions Top View 2Packaging TechnologyFigure 2-2.NB Package Dimensions Side View Packaging Technology Figure 2-3.NB Package Dimensions Bottom ViewBridge XMB Thermal/Mechanical Design Guide NOTESFigure 2-4.XMB Package Dimensions Top View Figure 2-5.XMB Package Dimensions Side ViewPackaging Technology Bridge XMB Thermal/Mechanical Design Guide2.1Package Mechanical Requirements Figure 2-6.XMB Package Dimensions Bottom ViewPackaging Technology Notes3.1Thermal Design Power TDP 3Thermal Specifications3.2Die Case Temperature Specifications Thermal Specifications 4Thermal Simulation Thermal Simulation Bridge XMB Thermal/Mechanical Design Guide5.1Die Case Temperature Measurements 5Thermal MetrologyThermal Metrology Figure 5-1.Thermal Solution Decision Flowchart5.2Power Simulation Software Thermal MetrologyThermal Metrology Bridge XMB Thermal/Mechanical Design Guide6.1Operating Environment 6NB Reference Thermal Solution #16.2Heatsink Performance NB Reference Thermal Solution #1 6.3Mechanical Design Envelope6.4Board-LevelComponents Keepout Dimensions MotherboardNB Reference Thermal Solution #1 HeatsinkTNBLocation 6.5First NB Heatsink Thermal Solution AssemblyNB Reference Thermal Solution #1 6.5.1Heatsink Orientation 6.5.2Extruded Heatsink Profiles6.5.3Mechanical Interface Material 6.5.4Thermal Interface MaterialNB Reference Thermal Solution #1 6.5.5Heatsink Retaining FastenerFigure 6-5.First NB Heatsink Extrusion Profile 6.6Reliability Guidelines NB Reference Thermal Solution #1Bridge XMB Thermal/Mechanical Design Guide TestNB Reference Thermal Solution #1 Bridge XMB Thermal/Mechanical Design Guide7.1Operating Environment 7NB Reference Thermal Solution #27.2Heatsink Performance NB Reference Thermal Solution #2 7.3Mechanical Design Envelope7.4Board-LevelComponents Keepout Dimensions 7.5Second NB Heatsink Thermal Solution AssemblyNB Reference Thermal Solution #2 Motherboard7.5.1Heatsink Orientation 7.5.2Extruded Heatsink Profiles7.5.3Mechanical Interface Material 7.5.4Thermal Interface Material7.6Reliability Guidelines NB Reference Thermal Solution #2Please refer to Section 6.6 for detail § Bridge XMB Thermal/Mechanical Design GuideNB Reference Thermal Solution #2 Bridge XMB Thermal/Mechanical Design Guide8.1Operating Environment 8XMB Reference Thermal Solution8.2Heatsink Performance 8.4Board-LevelComponents Keepout Dimensions 8.5XMB Heatsink Thermal Solution AssemblyXMB Reference Thermal Solution 8.3Mechanical Design EnvelopeXMB Location 8.5.1Heatsink OrientationXMB Reference Thermal Solution 8.5.2Extruded Heatsink Profiles 8.5.3Mechanical Interface Material8.5.4Thermal Interface Material 8.5.5Heatsink Retaining Fastener8.6Reliability Guidelines XMB Reference Thermal SolutionFigure 8-5.XMB Heatsink Extrusion Profile Bridge XMB Thermal/Mechanical Design GuideXMB Reference Thermal Solution Bridge XMB Thermal/Mechanical Design GuideAThermal Solution Component Suppliers Bridge XMB Thermal/Mechanical Design GuidePart Intel Part NumberThermal Solution Component Suppliers Bridge XMB Thermal/Mechanical Design GuidePart Intel Part NumberThermal Solution Component Suppliers Bridge XMB Thermal/Mechanical Design GuidePart Intel Part NumberThermal Solution Component Suppliers Bridge XMB Thermal/Mechanical Design GuideB Mechanical Drawings Table B-1.Mechanical Drawing ListBridge XMB Thermal/Mechanical Design Guide Drawing DescriptionFigure B-1.NB Heatsink #1 Assembly Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Figure B-2.NB Heatsink #1 Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Figure B-3.NB Heatsink #2 Assembly DrawingBridge XMB Thermal/Mechanical Design Guide Figure B-4.NB Heatsink #2 Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Figure B-5.XMB Heatsink Assembly DrawingBridge XMB Thermal/Mechanical Design Guide Figure B-6.XMB Heatsink Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Bridge XMB Thermal/Mechanical Design Guide