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Intel E8501 Revision History, Bridge XMB Thermal/Mechanical Design Guide, Document, Description

Models: E8501

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Revision History

Document	Revision	Description	Date
Number	Number	Description	Date
Number	Number

306749	001	• Initial release of this document	March 2005

306749	002	• Added Intel® E8501 chipset specific information and re-titled document	May 2006
		• Added updated Intel® E8500 Chipset eXternal Memory Bridge (XMB)
		thermal specification in Section 3.2

6	Intel® E8500/8501 Chipset North Bridge (NB) and eXternal Memory
	Bridge (XMB) Thermal/Mechanical Design Guide

Page 6

Image 6

Intel E8501 manual Revision History, Bridge XMB Thermal/Mechanical Design Guide, Document, Description, Date, Number

Contents

Intel E8500/E8501 Chipset North Thermal/Mechanical Design GuideDocument Number Bridge NB and eXternal Memory Bridge XMBBridge XMB Thermal/Mechanical Design Guide Contents Mechanical Drawings Thermal Solution Component SuppliersFigures Bridge XMB Thermal/Mechanical Design GuideTables Bridge XMB Thermal/Mechanical Design GuideDocument Revision HistoryBridge XMB Thermal/Mechanical Design Guide Revision1Introduction 1.1Design Flow1.2Definition of Terms IntroductionFigure 1-1.Thermal Design Process •BGA/OLGA Assembly Development Guide •Intel E8501 Chipset North Bridge NB Datasheet•Intel E8500 Chipset North Bridge NB Datasheet 1.3Reference DocumentsIntroduction Bridge XMB Thermal/Mechanical Design Guide2Packaging Technology Figure 2-1.NB Package Dimensions Top ViewFigure 2-2.NB Package Dimensions Side View Bridge XMB Thermal/Mechanical Design Guide Packaging TechnologyFigure 2-3.NB Package Dimensions Bottom View NOTESPackaging Technology Figure 2-4.XMB Package Dimensions Top ViewFigure 2-5.XMB Package Dimensions Side View Bridge XMB Thermal/Mechanical Design GuidePackaging Technology 2.1Package Mechanical RequirementsFigure 2-6.XMB Package Dimensions Bottom View Notes3Thermal Specifications 3.1Thermal Design Power TDP3.2Die Case Temperature Specifications Thermal Specifications 4Thermal Simulation Thermal Simulation Bridge XMB Thermal/Mechanical Design Guide5.1Die Case Temperature Measurements 5Thermal MetrologyThermal Metrology Figure 5-1.Thermal Solution Decision Flowchart5.2Power Simulation Software Thermal MetrologyThermal Metrology Bridge XMB Thermal/Mechanical Design Guide6NB Reference Thermal Solution #1 6.1Operating Environment6.2Heatsink Performance NB Reference Thermal Solution #1 6.3Mechanical Design EnvelopeNB Reference Thermal Solution #1 6.4Board-LevelComponents Keepout DimensionsMotherboard Heatsink6.5First NB Heatsink Thermal Solution Assembly TNBLocationNB Reference Thermal Solution #1 6.5.3Mechanical Interface Material 6.5.1Heatsink Orientation6.5.2Extruded Heatsink Profiles 6.5.4Thermal Interface Material6.5.5Heatsink Retaining Fastener NB Reference Thermal Solution #1Figure 6-5.First NB Heatsink Extrusion Profile Bridge XMB Thermal/Mechanical Design Guide 6.6Reliability GuidelinesNB Reference Thermal Solution #1 TestNB Reference Thermal Solution #1 Bridge XMB Thermal/Mechanical Design Guide7NB Reference Thermal Solution #2 7.1Operating Environment7.2Heatsink Performance NB Reference Thermal Solution #2 7.3Mechanical Design EnvelopeNB Reference Thermal Solution #2 7.4Board-LevelComponents Keepout Dimensions7.5Second NB Heatsink Thermal Solution Assembly Motherboard7.5.3Mechanical Interface Material 7.5.1Heatsink Orientation7.5.2Extruded Heatsink Profiles 7.5.4Thermal Interface MaterialPlease refer to Section 6.6 for detail § 7.6Reliability GuidelinesNB Reference Thermal Solution #2 Bridge XMB Thermal/Mechanical Design GuideNB Reference Thermal Solution #2 Bridge XMB Thermal/Mechanical Design Guide8XMB Reference Thermal Solution 8.1Operating Environment8.2Heatsink Performance XMB Reference Thermal Solution 8.4Board-LevelComponents Keepout Dimensions8.5XMB Heatsink Thermal Solution Assembly 8.3Mechanical Design Envelope8.5.1Heatsink Orientation XMB LocationXMB Reference Thermal Solution 8.5.4Thermal Interface Material 8.5.2Extruded Heatsink Profiles8.5.3Mechanical Interface Material 8.5.5Heatsink Retaining FastenerFigure 8-5.XMB Heatsink Extrusion Profile 8.6Reliability GuidelinesXMB Reference Thermal Solution Bridge XMB Thermal/Mechanical Design GuideXMB Reference Thermal Solution Bridge XMB Thermal/Mechanical Design GuidePart AThermal Solution Component SuppliersBridge XMB Thermal/Mechanical Design Guide Intel Part NumberPart Thermal Solution Component SuppliersBridge XMB Thermal/Mechanical Design Guide Intel Part NumberPart Thermal Solution Component SuppliersBridge XMB Thermal/Mechanical Design Guide Intel Part NumberThermal Solution Component Suppliers Bridge XMB Thermal/Mechanical Design GuideBridge XMB Thermal/Mechanical Design Guide B Mechanical DrawingsTable B-1.Mechanical Drawing List Drawing DescriptionMechanical Drawings Figure B-1.NB Heatsink #1 Assembly DrawingBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Figure B-2.NB Heatsink #1 DrawingBridge XMB Thermal/Mechanical Design Guide Figure B-3.NB Heatsink #2 Assembly Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Figure B-4.NB Heatsink #2 DrawingBridge XMB Thermal/Mechanical Design Guide Figure B-5.XMB Heatsink Assembly Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Figure B-6.XMB Heatsink DrawingBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Bridge XMB Thermal/Mechanical Design Guide

Revision History

Document

Revision

Description

Date

Number