Intel E8501 6.6Reliability Guidelines, NB Reference Thermal Solution #1, Test, Requirement, Notes

Models: E8501

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6.6Reliability Guidelines

NB Reference Thermal Solution #1

6.6Reliability Guidelines

Each motherboard, heatsink and attach combination may vary the mechanical loading of the component. Based on the end user environment, the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume. Some general recommendations are shown in Table 6-2.

Table 6-2. Reliability Guidelines

Test (1)

Requirement

Pass/Fail Criteria (2)

Mechanical

50 g, board level, 11 msec, 3 shocks/axis

Visual Check and Electrical Functional

Shock

 

Test

 

 

 

Random

7.3 g, board level, 45 min/axis, 50 Hz to

Visual Check and Electrical Functional

Vibration

2000 Hz

Test

 

 

 

Temperature Life

85°C, 2000 hours total, checkpoints at 168,

Visual Check

 

500, 1000, and 2000 hours

 

 

 

 

Thermal Cycling

–5°C to +70°C, 500 cycles

Visual Check

 

 

 

Humidity

85% relative humidity, 55°C, 1000 hours

Visual Check

 

 

 

NOTES:

1.It is recommended that the above tests be performed on a sample size of at least twelve assemblies from three lots of material.

2.Additional pass/fail criteria may be added at the discretion of the user.

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Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

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Bridge (XMB) Thermal/Mechanical Design Guide

 

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Intel E8501 6.6Reliability Guidelines, NB Reference Thermal Solution #1, Bridge XMB Thermal/Mechanical Design Guide, Test