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Intel E8501 manual 6.4Board-LevelComponents Keepout Dimensions, Motherboard, Heatsink, 55.09, 4 mm

Models: E8501

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NB Reference Thermal Solution #1

Figure 6-2. First NB Reference Heatsink Volumetric Envelope

Heatsink				mm.
Fin				mm.
Fin				55.09
		4 mm.	4.29 mm.	55.09
Heatsink Base
IHS + TIM2
FCBGA + Solder Balls
Motherboard
64.52 mm.
42.50 mm.
TNB
Heatsink
Heatsink	mm.	mm.
Heatsink	42.50	64.52
Fin

Heatsink Base

6.4Board-Level Components Keepout Dimensions

The location of hole pattern and keepout zones for the reference thermal solution are shown in Figure 6-3.

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory	25
Bridge (XMB) Thermal/Mechanical Design Guide

Page 25

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Intel E8501 6.4Board-LevelComponents Keepout Dimensions, Motherboard, NB Reference Thermal Solution #1, Heatsink, 55.09

Contents

Document Number Thermal/Mechanical Design GuideIntel E8500/E8501 Chipset North Bridge NB and eXternal Memory Bridge XMBBridge XMB Thermal/Mechanical Design Guide Contents Figures Thermal Solution Component SuppliersMechanical Drawings Bridge XMB Thermal/Mechanical Design GuideBridge XMB Thermal/Mechanical Design Guide TablesBridge XMB Thermal/Mechanical Design Guide Revision HistoryDocument Revision1.1Design Flow 1IntroductionIntroduction 1.2Definition of TermsFigure 1-1.Thermal Design Process •Intel E8500 Chipset North Bridge NB Datasheet •Intel E8501 Chipset North Bridge NB Datasheet•BGA/OLGA Assembly Development Guide 1.3Reference DocumentsBridge XMB Thermal/Mechanical Design Guide IntroductionFigure 2-1.NB Package Dimensions Top View 2Packaging TechnologyFigure 2-2.NB Package Dimensions Side View Figure 2-3.NB Package Dimensions Bottom View Packaging TechnologyBridge XMB Thermal/Mechanical Design Guide NOTESFigure 2-5.XMB Package Dimensions Side View Figure 2-4.XMB Package Dimensions Top ViewPackaging Technology Bridge XMB Thermal/Mechanical Design GuideFigure 2-6.XMB Package Dimensions Bottom View 2.1Package Mechanical RequirementsPackaging Technology 3.1Thermal Design Power TDP 3Thermal Specifications3.2Die Case Temperature Specifications Thermal Specifications 4Thermal Simulation Bridge XMB Thermal/Mechanical Design Guide Thermal Simulation5.1Die Case Temperature Measurements 5Thermal MetrologyFigure 5-1.Thermal Solution Decision Flowchart Thermal MetrologyThermal Metrology 5.2Power Simulation SoftwareBridge XMB Thermal/Mechanical Design Guide Thermal Metrology6.1Operating Environment 6NB Reference Thermal Solution #16.2Heatsink Performance 6.3Mechanical Design Envelope NB Reference Thermal Solution #1Motherboard 6.4Board-LevelComponents Keepout DimensionsNB Reference Thermal Solution #1 HeatsinkTNBLocation 6.5First NB Heatsink Thermal Solution AssemblyNB Reference Thermal Solution #1 6.5.2Extruded Heatsink Profiles 6.5.1Heatsink Orientation6.5.3Mechanical Interface Material 6.5.4Thermal Interface MaterialNB Reference Thermal Solution #1 6.5.5Heatsink Retaining FastenerFigure 6-5.First NB Heatsink Extrusion Profile NB Reference Thermal Solution #1 6.6Reliability GuidelinesBridge XMB Thermal/Mechanical Design Guide TestBridge XMB Thermal/Mechanical Design Guide NB Reference Thermal Solution #17.1Operating Environment 7NB Reference Thermal Solution #27.2Heatsink Performance 7.3Mechanical Design Envelope NB Reference Thermal Solution #27.5Second NB Heatsink Thermal Solution Assembly 7.4Board-LevelComponents Keepout DimensionsNB Reference Thermal Solution #2 Motherboard7.5.2Extruded Heatsink Profiles 7.5.1Heatsink Orientation7.5.3Mechanical Interface Material 7.5.4Thermal Interface MaterialNB Reference Thermal Solution #2 7.6Reliability GuidelinesPlease refer to Section 6.6 for detail § Bridge XMB Thermal/Mechanical Design GuideBridge XMB Thermal/Mechanical Design Guide NB Reference Thermal Solution #28.1Operating Environment 8XMB Reference Thermal Solution8.2Heatsink Performance 8.5XMB Heatsink Thermal Solution Assembly 8.4Board-LevelComponents Keepout DimensionsXMB Reference Thermal Solution 8.3Mechanical Design EnvelopeXMB Location 8.5.1Heatsink OrientationXMB Reference Thermal Solution 8.5.3Mechanical Interface Material 8.5.2Extruded Heatsink Profiles8.5.4Thermal Interface Material 8.5.5Heatsink Retaining FastenerXMB Reference Thermal Solution 8.6Reliability GuidelinesFigure 8-5.XMB Heatsink Extrusion Profile Bridge XMB Thermal/Mechanical Design GuideBridge XMB Thermal/Mechanical Design Guide XMB Reference Thermal SolutionBridge XMB Thermal/Mechanical Design Guide AThermal Solution Component SuppliersPart Intel Part NumberBridge XMB Thermal/Mechanical Design Guide Thermal Solution Component SuppliersPart Intel Part NumberBridge XMB Thermal/Mechanical Design Guide Thermal Solution Component SuppliersPart Intel Part NumberBridge XMB Thermal/Mechanical Design Guide Thermal Solution Component SuppliersTable B-1.Mechanical Drawing List B Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Drawing DescriptionFigure B-1.NB Heatsink #1 Assembly Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Figure B-2.NB Heatsink #1 Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Figure B-3.NB Heatsink #2 Assembly DrawingBridge XMB Thermal/Mechanical Design Guide Figure B-4.NB Heatsink #2 Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Figure B-5.XMB Heatsink Assembly DrawingBridge XMB Thermal/Mechanical Design Guide Figure B-6.XMB Heatsink Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Bridge XMB Thermal/Mechanical Design Guide Mechanical Drawings