Intel E8501 8XMB Reference Thermal Solution, 8.1Operating Environment, 8.2Heatsink Performance

8XMB Reference Thermal Solution

Intel has developed one different reference thermal solution designed to meet the cooling needs of the E8500/E8501 chipset XMB component under operating environments and specifications defined in this document. This chapter describes the overall requirements for the XMB reference thermal solution including critical-to-function dimensions, operating environment, and validation criteria. Other chipset components may or may not need attached thermal solutions, depending on your specific system local-ambient operating conditions. For information on the Intel® 6700PXH 64-bit PCI Hub, refer to thermal specification in the Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guide. For information on the ICH5, refer to thermal specification in the Intel® 82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R (ICH5R) Thermal Design Guide.

8.1Operating Environment

The reference thermal solution was designed assuming a maximum local-ambient temperature of 57°C. The minimum recommended airflow velocity through the cross section of the heatsink fins is 300 linear feet per minute (lfm). The approaching airflow temperature is assumed to be equal to the local-ambient temperature. The thermal designer must carefully select the location to measure airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35°C external-ambient temperature at sea level. (External-ambient refers to the environment external to the system.)

The fasteners associated for this reference thermal solution is intended to be used on 0.062” thickness motherboard.

8.2Heatsink Performance

Figure 8-1depicts the measured thermal performance of the XMB reference thermal solution versus approach air velocity. Since this data was measured at sea level, a correction factor would be required to estimate thermal performance at other altitudes.

Figure 8-1. XMB Reference Heatsink Measured Thermal Performance vs. Approach Velocity

	5.5
(°C/W)	5
	4.5
	4
ca	3.5
Ȍ
	3
	2.5
	0	100	200	300	400	500	600
				Flow Rate (LFM)

Intel® E8500 /E8501 Chipset North Bridge (NB) and eXternal Memory	37
Bridge (XMB) Thermal/Mechanical Design Guide