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Intel E8501 manual 1.2Definition of Terms, Introduction, 1.Thermal Design Process

Models: E8501

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Introduction

Introduction

Figure 1-1. Thermal Design Process

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1.2Definition of Terms

BGA	Ball grid array. A package type, defined by a resin-fiber substrate, onto which a
	die is mounted, bonded and encapsulated in molding compound. The primary
	electrical interface is an array of solder balls attached to the substrate opposite
	the die and molding compound.
BLT	Bond line thickness. Final settled thickness of the thermal interface material
	after installation of heatsink.
ICH5	I/O controller hub. The chipset component that contains the primary PCI
	interface, LPC interface, USB, S-ATA, and other legacy functions.
IHS	Integrated Heat Spreader, Integral part of the NB package. It enhances
	dissipation of heat generated by the NB die and provides interface surface
	between NB die and cooling solution.

IMI

Intel® 6700PXH 64-bit PCI Hub

Independent memory Interfaces. Port connecting the NB to the XMB

The chipset component that performs PCI bridging functions between the PCI Express* interface and the PCI Bus. It contains two PCI bus interfaces that can be independently configured to operate in PCI (33 or 66 MHz) or PCI-X* mode 1 (66, 100 or 133 MHz), for either 32- or 64-bit PCI devices.

Tcase_max

Tcase_min

TDP

TIM

NB

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Maximum die temperature allowed. This temperature is measured at the geometric center of the top of the package die.

Minimum die temperature allowed. This temperature is measured at the geometric center of the top of the package die.

Thermal design power. Thermal solutions should be designed to dissipate this target power level. TDP is not the maximum power that the chipset can dissipate.

Thermal interface material. Thermally conductive material installed between two surfaces to improve heat transfer and reduce interface contact resistance.

Intel® E8500/E8501 chipset North Bridge Component. The chipset component that provides the interconnect to the processors, XMBs and various I/O components.

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mechanical Design Guide

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Intel E8501 manual 1.2Definition of Terms, Introduction, 1.Thermal Design Process

Contents

Thermal/Mechanical Design Guide Document NumberIntel E8500/E8501 Chipset North Bridge NB and eXternal Memory Bridge XMBBridge XMB Thermal/Mechanical Design Guide Contents Thermal Solution Component Suppliers FiguresMechanical Drawings Bridge XMB Thermal/Mechanical Design GuideTables Bridge XMB Thermal/Mechanical Design GuideRevision History Bridge XMB Thermal/Mechanical Design GuideDocument Revision1Introduction 1.1Design FlowFigure 1-1.Thermal Design Process 1.2Definition of TermsIntroduction •Intel E8501 Chipset North Bridge NB Datasheet •Intel E8500 Chipset North Bridge NB Datasheet•BGA/OLGA Assembly Development Guide 1.3Reference DocumentsIntroduction Bridge XMB Thermal/Mechanical Design GuideFigure 2-2.NB Package Dimensions Side View 2Packaging TechnologyFigure 2-1.NB Package Dimensions Top View Packaging Technology Figure 2-3.NB Package Dimensions Bottom ViewBridge XMB Thermal/Mechanical Design Guide NOTESFigure 2-4.XMB Package Dimensions Top View Figure 2-5.XMB Package Dimensions Side ViewPackaging Technology Bridge XMB Thermal/Mechanical Design Guide2.1Package Mechanical Requirements Figure 2-6.XMB Package Dimensions Bottom ViewPackaging Technology Notes3.2Die Case Temperature Specifications 3Thermal Specifications3.1Thermal Design Power TDP Thermal Specifications 4Thermal Simulation Thermal Simulation Bridge XMB Thermal/Mechanical Design Guide5.1Die Case Temperature Measurements 5Thermal MetrologyThermal Metrology Figure 5-1.Thermal Solution Decision Flowchart5.2Power Simulation Software Thermal MetrologyThermal Metrology Bridge XMB Thermal/Mechanical Design Guide6.2Heatsink Performance 6NB Reference Thermal Solution #16.1Operating Environment NB Reference Thermal Solution #1 6.3Mechanical Design Envelope6.4Board-LevelComponents Keepout Dimensions MotherboardNB Reference Thermal Solution #1 HeatsinkNB Reference Thermal Solution #1 6.5First NB Heatsink Thermal Solution AssemblyTNBLocation 6.5.1Heatsink Orientation 6.5.2Extruded Heatsink Profiles6.5.3Mechanical Interface Material 6.5.4Thermal Interface MaterialFigure 6-5.First NB Heatsink Extrusion Profile 6.5.5Heatsink Retaining FastenerNB Reference Thermal Solution #1 6.6Reliability Guidelines NB Reference Thermal Solution #1Bridge XMB Thermal/Mechanical Design Guide TestNB Reference Thermal Solution #1 Bridge XMB Thermal/Mechanical Design Guide7.2Heatsink Performance 7NB Reference Thermal Solution #27.1Operating Environment NB Reference Thermal Solution #2 7.3Mechanical Design Envelope7.4Board-LevelComponents Keepout Dimensions 7.5Second NB Heatsink Thermal Solution AssemblyNB Reference Thermal Solution #2 Motherboard7.5.1Heatsink Orientation 7.5.2Extruded Heatsink Profiles7.5.3Mechanical Interface Material 7.5.4Thermal Interface Material7.6Reliability Guidelines NB Reference Thermal Solution #2Please refer to Section 6.6 for detail § Bridge XMB Thermal/Mechanical Design GuideNB Reference Thermal Solution #2 Bridge XMB Thermal/Mechanical Design Guide8.2Heatsink Performance 8XMB Reference Thermal Solution8.1Operating Environment 8.4Board-LevelComponents Keepout Dimensions 8.5XMB Heatsink Thermal Solution AssemblyXMB Reference Thermal Solution 8.3Mechanical Design EnvelopeXMB Reference Thermal Solution 8.5.1Heatsink OrientationXMB Location 8.5.2Extruded Heatsink Profiles 8.5.3Mechanical Interface Material8.5.4Thermal Interface Material 8.5.5Heatsink Retaining Fastener8.6Reliability Guidelines XMB Reference Thermal SolutionFigure 8-5.XMB Heatsink Extrusion Profile Bridge XMB Thermal/Mechanical Design GuideXMB Reference Thermal Solution Bridge XMB Thermal/Mechanical Design GuideAThermal Solution Component Suppliers Bridge XMB Thermal/Mechanical Design GuidePart Intel Part NumberThermal Solution Component Suppliers Bridge XMB Thermal/Mechanical Design GuidePart Intel Part NumberThermal Solution Component Suppliers Bridge XMB Thermal/Mechanical Design GuidePart Intel Part NumberThermal Solution Component Suppliers Bridge XMB Thermal/Mechanical Design GuideB Mechanical Drawings Table B-1.Mechanical Drawing ListBridge XMB Thermal/Mechanical Design Guide Drawing DescriptionBridge XMB Thermal/Mechanical Design Guide Mechanical DrawingsFigure B-1.NB Heatsink #1 Assembly Drawing Bridge XMB Thermal/Mechanical Design Guide Mechanical DrawingsFigure B-2.NB Heatsink #1 Drawing Bridge XMB Thermal/Mechanical Design Guide Figure B-3.NB Heatsink #2 Assembly DrawingMechanical Drawings Bridge XMB Thermal/Mechanical Design Guide Mechanical DrawingsFigure B-4.NB Heatsink #2 Drawing Bridge XMB Thermal/Mechanical Design Guide Figure B-5.XMB Heatsink Assembly DrawingMechanical Drawings Bridge XMB Thermal/Mechanical Design Guide Mechanical DrawingsFigure B-6.XMB Heatsink Drawing Mechanical Drawings Bridge XMB Thermal/Mechanical Design Guide