Manuals / Intel / Computer Equipment / Computer Hardware

Intel E8501 manual 6.5.5Heatsink Retaining Fastener, NB Reference Thermal Solution #1

Models: E8501

1 54

Download 54 pages 42.29 Kb

Page 28

6.5.5Heatsink Retaining Fastener

NB Reference Thermal Solution #1

the thermal resistance of the Chomerics THERMFLOW T710 TIM is shown in Table 6-1The heatsink clip provides enough pressure for the TIM to achieve a thermal conductivity of 0.17°C inch2/W.

Table 6-1. Chomerics THERMFLOW* T710 TIM Performance as a Function of Attach Pressure

Pressure (psi)	Thermal Resistance (°C × in2)/W
5	0.37

10	0.30

20	0.21

30	0.17

NOTE:

1.All measured at 50°C.

6.5.5Heatsink Retaining Fastener

The reference solution uses four heatsink retaining Tufloks. The fasteners attach the heatsink to the motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting holes. These fasteners are intended to be used on a 0.062” thickness motherboard with either of the two NB reference thermal solutions. See Appendix B for a mechanical drawing of the fastener.

Figure 6-5. First NB Heatsink Extrusion Profile

28	Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
	Bridge (XMB) Thermal/Mechanical Design Guide

Image 28

Contents

Thermal/Mechanical Design Guide Document NumberIntel E8500/E8501 Chipset North Bridge NB and eXternal Memory Bridge XMBBridge XMB Thermal/Mechanical Design Guide Contents Thermal Solution Component Suppliers FiguresMechanical Drawings Bridge XMB Thermal/Mechanical Design GuideTables Bridge XMB Thermal/Mechanical Design GuideRevision History Bridge XMB Thermal/Mechanical Design GuideDocument Revision1Introduction 1.1Design FlowIntroduction 1.2Definition of TermsFigure 1-1.Thermal Design Process •Intel E8501 Chipset North Bridge NB Datasheet •Intel E8500 Chipset North Bridge NB Datasheet•BGA/OLGA Assembly Development Guide 1.3Reference DocumentsIntroduction Bridge XMB Thermal/Mechanical Design GuideFigure 2-1.NB Package Dimensions Top View 2Packaging TechnologyFigure 2-2.NB Package Dimensions Side View Packaging Technology Figure 2-3.NB Package Dimensions Bottom ViewBridge XMB Thermal/Mechanical Design Guide NOTESFigure 2-4.XMB Package Dimensions Top View Figure 2-5.XMB Package Dimensions Side ViewPackaging Technology Bridge XMB Thermal/Mechanical Design Guide2.1Package Mechanical Requirements Figure 2-6.XMB Package Dimensions Bottom ViewPackaging Technology Notes3.1Thermal Design Power TDP 3Thermal Specifications3.2Die Case Temperature Specifications Thermal Specifications 4Thermal Simulation Thermal Simulation Bridge XMB Thermal/Mechanical Design Guide5.1Die Case Temperature Measurements 5Thermal MetrologyThermal Metrology Figure 5-1.Thermal Solution Decision Flowchart5.2Power Simulation Software Thermal MetrologyThermal Metrology Bridge XMB Thermal/Mechanical Design Guide6.1Operating Environment 6NB Reference Thermal Solution #16.2Heatsink Performance NB Reference Thermal Solution #1 6.3Mechanical Design Envelope6.4Board-LevelComponents Keepout Dimensions MotherboardNB Reference Thermal Solution #1 HeatsinkTNBLocation 6.5First NB Heatsink Thermal Solution AssemblyNB Reference Thermal Solution #1 6.5.1Heatsink Orientation 6.5.2Extruded Heatsink Profiles6.5.3Mechanical Interface Material 6.5.4Thermal Interface MaterialNB Reference Thermal Solution #1 6.5.5Heatsink Retaining FastenerFigure 6-5.First NB Heatsink Extrusion Profile 6.6Reliability Guidelines NB Reference Thermal Solution #1Bridge XMB Thermal/Mechanical Design Guide TestNB Reference Thermal Solution #1 Bridge XMB Thermal/Mechanical Design Guide7.1Operating Environment 7NB Reference Thermal Solution #27.2Heatsink Performance NB Reference Thermal Solution #2 7.3Mechanical Design Envelope7.4Board-LevelComponents Keepout Dimensions 7.5Second NB Heatsink Thermal Solution AssemblyNB Reference Thermal Solution #2 Motherboard7.5.1Heatsink Orientation 7.5.2Extruded Heatsink Profiles7.5.3Mechanical Interface Material 7.5.4Thermal Interface Material7.6Reliability Guidelines NB Reference Thermal Solution #2Please refer to Section 6.6 for detail § Bridge XMB Thermal/Mechanical Design GuideNB Reference Thermal Solution #2 Bridge XMB Thermal/Mechanical Design Guide8.1Operating Environment 8XMB Reference Thermal Solution8.2Heatsink Performance 8.4Board-LevelComponents Keepout Dimensions 8.5XMB Heatsink Thermal Solution AssemblyXMB Reference Thermal Solution 8.3Mechanical Design EnvelopeXMB Location 8.5.1Heatsink OrientationXMB Reference Thermal Solution 8.5.2Extruded Heatsink Profiles 8.5.3Mechanical Interface Material8.5.4Thermal Interface Material 8.5.5Heatsink Retaining Fastener8.6Reliability Guidelines XMB Reference Thermal SolutionFigure 8-5.XMB Heatsink Extrusion Profile Bridge XMB Thermal/Mechanical Design GuideXMB Reference Thermal Solution Bridge XMB Thermal/Mechanical Design GuideAThermal Solution Component Suppliers Bridge XMB Thermal/Mechanical Design GuidePart Intel Part NumberThermal Solution Component Suppliers Bridge XMB Thermal/Mechanical Design GuidePart Intel Part NumberThermal Solution Component Suppliers Bridge XMB Thermal/Mechanical Design GuidePart Intel Part NumberThermal Solution Component Suppliers Bridge XMB Thermal/Mechanical Design GuideB Mechanical Drawings Table B-1.Mechanical Drawing ListBridge XMB Thermal/Mechanical Design Guide Drawing DescriptionFigure B-1.NB Heatsink #1 Assembly Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Figure B-2.NB Heatsink #1 Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Figure B-3.NB Heatsink #2 Assembly DrawingBridge XMB Thermal/Mechanical Design Guide Figure B-4.NB Heatsink #2 Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Figure B-5.XMB Heatsink Assembly DrawingBridge XMB Thermal/Mechanical Design Guide Figure B-6.XMB Heatsink Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Bridge XMB Thermal/Mechanical Design Guide