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Intel E8501 7NB Reference Thermal Solution #2, 7.1Operating Environment, 7.2Heatsink Performance

Models: E8501

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7NB Reference Thermal Solution #2

7NB Reference Thermal Solution #2

Intel has developed two different reference thermal solutions designed to meet the cooling needs of the E8500/E8501 chipset NB component under operating environments and specifications defined in this document. This chapter describes the overall requirements for the 2nd NB reference thermal solution including critical-to-function dimensions, operating environment, and validation criteria. Other chipset components may or may not need attached thermal solutions, depending on your specific system local-ambient operating conditions. For information on the Intel® 6700PXH 64-bit PCI Hub, refer to thermal specification in the Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines. For information on the ICH5, refer to thermal specification in the Intel® 82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R (ICH5R) Thermal Design Guide.

7.1Operating Environment

The reference thermal solution was designed assuming a maximum local-ambient temperature of 52°C. The minimum recommended airflow velocity through the cross section of the heatsink fins is 400 linear feet per minutes (lfm). The approaching airflow temperature is assumed to be equal to the local-ambient temperature. The thermal designer must carefully select the location to measure airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35°C external-ambient temperature at sea level. (External-ambient refers to the environmental external to the system.)

The fastener for this reference thermal solution is intended to be used on motherboard with thickness between 0.085” and 0.093”.

7.2Heatsink Performance

Figure 7-1depicts the measured thermal performance of the 2nd NB reference thermal solution versus approach air velocity. Since this data was measured at sea level, a correction factor would be required to estimate thermal performance at other altitudes.

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory	31
Bridge (XMB) Thermal/Mechanical Design Guide

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Intel E8501 manual 7NB Reference Thermal Solution #2, 7.1Operating Environment, 7.2Heatsink Performance

Contents

Bridge NB and eXternal Memory Bridge XMB Thermal/Mechanical Design GuideDocument Number Intel E8500/E8501 Chipset NorthBridge XMB Thermal/Mechanical Design Guide Contents Bridge XMB Thermal/Mechanical Design Guide Thermal Solution Component SuppliersFigures Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide TablesRevision Revision HistoryBridge XMB Thermal/Mechanical Design Guide Document1.1Design Flow 1IntroductionIntroduction 1.2Definition of TermsFigure 1-1.Thermal Design Process 1.3Reference Documents •Intel E8501 Chipset North Bridge NB Datasheet•Intel E8500 Chipset North Bridge NB Datasheet •BGA/OLGA Assembly Development GuideBridge XMB Thermal/Mechanical Design Guide IntroductionFigure 2-1.NB Package Dimensions Top View 2Packaging TechnologyFigure 2-2.NB Package Dimensions Side View NOTES Packaging TechnologyFigure 2-3.NB Package Dimensions Bottom View Bridge XMB Thermal/Mechanical Design GuideBridge XMB Thermal/Mechanical Design Guide Figure 2-4.XMB Package Dimensions Top ViewFigure 2-5.XMB Package Dimensions Side View Packaging TechnologyNotes 2.1Package Mechanical RequirementsFigure 2-6.XMB Package Dimensions Bottom View Packaging Technology3.1Thermal Design Power TDP 3Thermal Specifications3.2Die Case Temperature Specifications Thermal Specifications 4Thermal Simulation Bridge XMB Thermal/Mechanical Design Guide Thermal Simulation5Thermal Metrology 5.1Die Case Temperature MeasurementsFigure 5-1.Thermal Solution Decision Flowchart Thermal MetrologyThermal Metrology 5.2Power Simulation SoftwareBridge XMB Thermal/Mechanical Design Guide Thermal Metrology6.1Operating Environment 6NB Reference Thermal Solution #16.2Heatsink Performance 6.3Mechanical Design Envelope NB Reference Thermal Solution #1Heatsink 6.4Board-LevelComponents Keepout DimensionsMotherboard NB Reference Thermal Solution #1TNBLocation 6.5First NB Heatsink Thermal Solution AssemblyNB Reference Thermal Solution #1 6.5.4Thermal Interface Material 6.5.1Heatsink Orientation6.5.2Extruded Heatsink Profiles 6.5.3Mechanical Interface MaterialNB Reference Thermal Solution #1 6.5.5Heatsink Retaining FastenerFigure 6-5.First NB Heatsink Extrusion Profile Test 6.6Reliability GuidelinesNB Reference Thermal Solution #1 Bridge XMB Thermal/Mechanical Design GuideBridge XMB Thermal/Mechanical Design Guide NB Reference Thermal Solution #17.1Operating Environment 7NB Reference Thermal Solution #27.2Heatsink Performance 7.3Mechanical Design Envelope NB Reference Thermal Solution #2Motherboard 7.4Board-LevelComponents Keepout Dimensions7.5Second NB Heatsink Thermal Solution Assembly NB Reference Thermal Solution #27.5.4Thermal Interface Material 7.5.1Heatsink Orientation7.5.2Extruded Heatsink Profiles 7.5.3Mechanical Interface MaterialBridge XMB Thermal/Mechanical Design Guide 7.6Reliability GuidelinesNB Reference Thermal Solution #2 Please refer to Section 6.6 for detail §Bridge XMB Thermal/Mechanical Design Guide NB Reference Thermal Solution #28.1Operating Environment 8XMB Reference Thermal Solution8.2Heatsink Performance 8.3Mechanical Design Envelope 8.4Board-LevelComponents Keepout Dimensions8.5XMB Heatsink Thermal Solution Assembly XMB Reference Thermal SolutionXMB Location 8.5.1Heatsink OrientationXMB Reference Thermal Solution 8.5.5Heatsink Retaining Fastener 8.5.2Extruded Heatsink Profiles8.5.3Mechanical Interface Material 8.5.4Thermal Interface MaterialBridge XMB Thermal/Mechanical Design Guide 8.6Reliability GuidelinesXMB Reference Thermal Solution Figure 8-5.XMB Heatsink Extrusion ProfileBridge XMB Thermal/Mechanical Design Guide XMB Reference Thermal SolutionIntel Part Number AThermal Solution Component SuppliersBridge XMB Thermal/Mechanical Design Guide PartIntel Part Number Thermal Solution Component SuppliersBridge XMB Thermal/Mechanical Design Guide PartIntel Part Number Thermal Solution Component SuppliersBridge XMB Thermal/Mechanical Design Guide PartBridge XMB Thermal/Mechanical Design Guide Thermal Solution Component SuppliersDrawing Description B Mechanical DrawingsTable B-1.Mechanical Drawing List Bridge XMB Thermal/Mechanical Design GuideFigure B-1.NB Heatsink #1 Assembly Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Figure B-2.NB Heatsink #1 Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Figure B-3.NB Heatsink #2 Assembly DrawingBridge XMB Thermal/Mechanical Design Guide Figure B-4.NB Heatsink #2 Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Figure B-5.XMB Heatsink Assembly DrawingBridge XMB Thermal/Mechanical Design Guide Figure B-6.XMB Heatsink Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Bridge XMB Thermal/Mechanical Design Guide Mechanical Drawings